TLC2254ID Equivalent & Substitute Parts

Part Overview

The TLC2254ID is a general-purpose operational amplifier manufactured by Texas Instruments, featuring four independent circuits in a 14-SOIC surface-mount package. This LinCMOS™ series device provides rail-to-rail output capability with low input bias current and is designed for applications requiring low-power, precision amplification across industrial and consumer electronics.

The TLC2254ID maintains Active product status. Identification of equivalent and substitute parts becomes necessary when addressing supply chain constraints, inventory availability, or specific application requirements that may benefit from alternative amplifier characteristics while maintaining functional compatibility within the same package footprint and pin configuration.

Substiute Parts

TLC2254ID

Texas InstrumentsIn Stock: 2890TLC2254ID Datasheet

Current PartRFQ

LMC6044AIM/NOPB

Texas InstrumentsIn Stock: 10423LMC6044AIM/NOPB Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLC2254ID is determined by strict adherence to the following electrical and mechanical parameters:

Primary Substitution Criteria:

• Package compatibility: 14-SOIC surface-mount configuration with identical pin spacing (0.154", 3.90mm width)
• Circuit count: Four independent amplifier circuits per package
• Output configuration: Rail-to-rail output capability
• Supply voltage range: Minimum 4.4 V to maximum 16 V operation
• Operating temperature range: -40°C to 125°C minimum
• Compliance certifications: ROHS3 compliance and MSL Level 1 rating

Secondary Compatibility Parameters:

• Input bias current characteristics
• Voltage input offset specifications
• Supply current consumption per channel
• Output current per channel capability
• Slew rate and gain bandwidth product performance

The LMC6044AIM/NOPB qualifies as a manufacturer-recommended substitute based on identical package footprint, four-circuit configuration, rail-to-rail output, and overlapping supply voltage specifications. However, this substitute exhibits differences in operating temperature maximum rating and specific electrical performance characteristics that must be evaluated against application requirements.

Parameter Comparison

Engineering Selection Recommendations

TLC2254ID Selection: The TLC2254ID is appropriate for applications requiring extended operating temperature range to 125°C, higher slew rate performance (0.12 V/µs), and greater gain bandwidth product (210 kHz). This device maintains Active product status, ensuring continued availability and long-term supply chain stability. The TLC2254ID is suitable for designs with higher-speed signal processing requirements and applications operating in elevated temperature environments.

LMC6044AIM/NOPB Selection: The LMC6044AIM/NOPB is designated as Last Time Buy, indicating limited future availability. This substitute is appropriate only for applications where the reduced operating temperature maximum (85°C), lower slew rate (0.02 V/µs), and reduced gain bandwidth product (100 kHz) are acceptable. The LMC6044AIM/NOPB offers significantly lower supply current consumption (52 µA versus 160 µA), making it suitable for ultra-low-power applications. Both devices maintain identical ROHS3 compliance and MSL Level 1 ratings.

Compliance Considerations: Both the TLC2254ID and LMC6044AIM/NOPB are ROHS3 compliant and REACH unaffected, with identical ECCN (EAR99) and HTSUS (8542.33.0001) classifications. Both devices carry MSL Level 1 (Unlimited) moisture sensitivity ratings, indicating no special moisture handling requirements during storage or assembly.

Frequently Asked Questions (FAQ)

Q: Can the LMC6044AIM/NOPB directly replace the TLC2254ID in all applications?

A: Direct replacement is limited to applications where the operating temperature does not exceed 85°C and where the reduced slew rate (0.02 V/µs versus 0.12 V/µs) and lower gain bandwidth product (100 kHz versus 210 kHz) do not compromise circuit performance. The identical 14-SOIC package and pin configuration enable mechanical and electrical compatibility at the board level, but application-specific performance requirements must be verified.

Q: What are the key electrical differences between these devices?

A: The TLC2254ID provides higher slew rate (0.12 V/µs), greater gain bandwidth product (210 kHz), and extended operating temperature to 125°C. The LMC6044AIM/NOPB offers superior input bias current characteristics (0.002 pA versus 1 pA) and significantly lower supply current consumption (52 µA versus 160 µA). Input offset voltage differs substantially (1000 µV versus 200 µV).

Q: Are there supply voltage compatibility concerns?

A: Both devices operate within overlapping supply voltage ranges. The TLC2254ID supports 4.4 V to 16 V, while the LMC6044AIM/NOPB supports 4.5 V to 15.5 V. Applications requiring operation below 4.5 V must use the TLC2254ID. Applications requiring operation above 15.5 V must use the TLC2254ID.

Q: What is the significance of the Last Time Buy status for the LMC6044AIM/NOPB?

A: Last Time Buy status indicates that the manufacturer has announced end-of-life for this product. New orders may be accepted for a limited period, but long-term availability is not guaranteed. For new designs or applications requiring extended product lifecycle support, the TLC2254ID is the appropriate selection.

Q: Are both devices suitable for high-temperature applications?

A: The TLC2254ID is rated to 125°C and is suitable for high-temperature applications. The LMC6044AIM/NOPB is rated to 85°C maximum and is not suitable for applications exceeding this temperature. Application-specific thermal analysis is required to determine actual junction temperature under operating conditions.

Q: Do package and moisture sensitivity requirements differ between these devices?

A: Both devices are supplied in identical 14-SOIC (0.154", 3.90mm width) surface-mount packages. Both carry MSL Level 1 (Unlimited) moisture sensitivity ratings, eliminating the need for special moisture-controlled storage or handling procedures during assembly and deployment.