TLC082IP Equivalent & Substitute Parts

Part Overview

The TLC082IP is a general-purpose operational amplifier featuring two independent circuits in an 8-pin DIP package. This device is manufactured by Texas Instruments and is classified as a Last Time Buy product, indicating discontinued production with limited remaining inventory. The TLC082IP is designed for applications requiring dual-channel amplification with low input bias current and moderate bandwidth characteristics. Due to its Last Time Buy status, identifying equivalent substitute parts with compatible electrical and mechanical specifications is essential for design continuity and long-term component availability.

Substiute Parts

TLC082IP
Texas InstrumentsIn Stock: 79161TLC082IP Datasheet
TLC082IP
Current Part
TLC082IDR
Texas InstrumentsIn Stock: 1177TLC082IDR Datasheet
TLC082IDR
MFR Recommended

Key Parameters

Parameter Value Unit
Amplifier Type General Purpose
Number of Circuits 2
Slew Rate 19 V/µs
Gain Bandwidth Product 10 MHz
Current - Input Bias 3 pA
Voltage - Input Offset 390 µV
Current - Supply (per Channel) 1.9 mA
Current - Output / Channel 57 mA
Voltage - Supply Span (Min) 4.5 V
Voltage - Supply Span (Max) 16 V
Operating Temperature Range -40 to 125 °C
Mounting Type Through Hole
Package / Case 8-DIP (0.300", 7.62mm)

Substitute Part Grouping Explanation

Substitution of the TLC082IP is determined by electrical parameter equivalence and mechanical compatibility. The substitute part must satisfy the following criteria:

Electrical Equivalence Requirements:

  • Identical amplifier type (General Purpose)
  • Identical number of circuits (2)
  • Matching slew rate (19 V/µs)
  • Matching gain bandwidth product (10 MHz)
  • Matching input bias current (3 pA)
  • Matching input offset voltage (390 µV)
  • Matching supply current specifications (1.9 mA per channel)
  • Matching output current per channel (57 mA)
  • Matching supply voltage range (4.5 V to 16 V)
  • Matching operating temperature range (-40°C to 125°C)

Mechanical Compatibility Considerations:

  • Package type and pin configuration must support the intended mounting method
  • Pin count and spacing must align with circuit board design requirements
  • Physical dimensions must accommodate board layout constraints

The TLC082IDR is identified as a manufacturer-recommended substitute based on identical electrical specifications and the same base product number (TLC082). The primary difference is the package format: the substitute uses surface-mount technology (8-SOIC) rather than through-hole mounting (8-DIP).

Parameter Comparison

Parameter TLC082IP (Main Part) TLC082IDR (Substitute) Match Status
Manufacturer Texas Instruments Texas Instruments Identical
Base Product Number TLC082 TLC082 Identical
Amplifier Type General Purpose General Purpose Identical
Number of Circuits 2 2 Identical
Slew Rate 19 V/µs 19 V/µs Identical
Gain Bandwidth Product 10 MHz 10 MHz Identical
Current - Input Bias 3 pA 3 pA Identical
Voltage - Input Offset 390 µV 390 µV Identical
Current - Supply (per Channel) 1.9 mA 1.9 mA Identical
Current - Output / Channel 57 mA 57 mA Identical
Voltage - Supply Span (Min) 4.5 V 4.5 V Identical
Voltage - Supply Span (Max) 16 V 16 V Identical
Operating Temperature Range -40°C to 125°C -40°C to 125°C Identical
Mounting Type Through Hole Surface Mount Different
Package / Case 8-DIP (0.300", 7.62mm) 8-SOIC (0.154", 3.90mm Width) Different
Product Status Last Time Buy Active Different
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical
REACH Status REACH Unaffected REACH Unaffected Identical

Engineering Selection Recommendations

TLC082IDR Selection Criteria:

The TLC082IDR is the manufacturer-recommended substitute for the TLC082IP. This substitution is valid when the following conditions are met:

  1. Electrical Compatibility: All electrical parameters are identical between the main part and substitute. The TLC082IDR delivers equivalent amplification performance, frequency response, and signal integrity characteristics.

  2. Compliance Status: Both parts maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory alignment for current and future applications.

  3. Product Availability: The TLC082IDR carries Active product status with current inventory availability, providing long-term supply continuity compared to the Last Time Buy status of the TLC082IP.

  4. Package Transition: The substitution requires a transition from through-hole (8-DIP) to surface-mount (8-SOIC) technology. This change necessitates circuit board redesign to accommodate the different mounting method and physical footprint.

The TLC082IDR is suitable for new designs or redesigned applications where surface-mount assembly is preferred or required. For existing through-hole designs, the TLC082IP remains the appropriate choice until inventory depletion necessitates a board-level redesign.

Frequently Asked Questions (FAQ)

Q: What is the primary difference between the TLC082IP and TLC082IDR?

A: The primary difference is the package format and mounting technology. The TLC082IP uses through-hole mounting with an 8-DIP package, while the TLC082IDR uses surface-mount technology with an 8-SOIC package. All electrical specifications are identical.

Q: Can the TLC082IDR be used as a direct pin-for-pin replacement for the TLC082IP?

A: No. While the electrical specifications are identical, the physical package formats are different. The TLC082IDR cannot be inserted into a socket or PCB footprint designed for the TLC082IP without circuit board redesign and component rework.

Q: Are there any electrical performance differences between these two parts?

A: No. Both parts share identical electrical specifications including slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current, supply voltage range, and operating temperature range.

Q: Why is the TLC082IP classified as Last Time Buy?

A: Last Time Buy status indicates that Texas Instruments has discontinued production of this part. Existing inventory is available for purchase, but no future production runs are planned. Once inventory is depleted, the part will no longer be available.

Q: What should be considered when transitioning from TLC082IP to TLC082IDR?

A: Circuit board redesign is required to accommodate the different package footprint. The 8-SOIC package is significantly smaller than the 8-DIP package. PCB layout, component placement, and assembly processes must be updated to support surface-mount assembly.

Q: Are both parts compliant with current environmental regulations?

A: Yes. Both the TLC082IP and TLC082IDR are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements.

Q: Which part should be selected for new designs?

A: The TLC082IDR is recommended for new designs due to its Active product status and ongoing availability. Surface-mount technology also offers advantages in modern manufacturing environments.

Q: Can the TLC082IP be used in applications where the TLC082IDR is specified?

A: Electrically, yes. However, the through-hole package format of the TLC082IP is incompatible with PCB designs optimized for the 8-SOIC surface-mount package. Circuit board redesign would be required to use the TLC082IP in such applications.

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