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TLC082IP Equivalent & Substitute Parts
Part Overview
The TLC082IP is a general-purpose operational amplifier featuring two independent circuits in an 8-pin DIP package. This device is manufactured by Texas Instruments and is classified as a Last Time Buy product, indicating discontinued production with limited remaining inventory. The TLC082IP is designed for applications requiring dual-channel amplification with low input bias current and moderate bandwidth characteristics. Due to its Last Time Buy status, identifying equivalent substitute parts with compatible electrical and mechanical specifications is essential for design continuity and long-term component availability.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Amplifier Type | General Purpose | — |
| Number of Circuits | 2 | — |
| Slew Rate | 19 | V/µs |
| Gain Bandwidth Product | 10 | MHz |
| Current - Input Bias | 3 | pA |
| Voltage - Input Offset | 390 | µV |
| Current - Supply (per Channel) | 1.9 | mA |
| Current - Output / Channel | 57 | mA |
| Voltage - Supply Span (Min) | 4.5 | V |
| Voltage - Supply Span (Max) | 16 | V |
| Operating Temperature Range | -40 to 125 | °C |
| Mounting Type | Through Hole | — |
| Package / Case | 8-DIP (0.300", 7.62mm) | — |
Substitute Part Grouping Explanation
Substitution of the TLC082IP is determined by electrical parameter equivalence and mechanical compatibility. The substitute part must satisfy the following criteria:
Electrical Equivalence Requirements:
- Identical amplifier type (General Purpose)
- Identical number of circuits (2)
- Matching slew rate (19 V/µs)
- Matching gain bandwidth product (10 MHz)
- Matching input bias current (3 pA)
- Matching input offset voltage (390 µV)
- Matching supply current specifications (1.9 mA per channel)
- Matching output current per channel (57 mA)
- Matching supply voltage range (4.5 V to 16 V)
- Matching operating temperature range (-40°C to 125°C)
Mechanical Compatibility Considerations:
- Package type and pin configuration must support the intended mounting method
- Pin count and spacing must align with circuit board design requirements
- Physical dimensions must accommodate board layout constraints
The TLC082IDR is identified as a manufacturer-recommended substitute based on identical electrical specifications and the same base product number (TLC082). The primary difference is the package format: the substitute uses surface-mount technology (8-SOIC) rather than through-hole mounting (8-DIP).
Parameter Comparison
| Parameter | TLC082IP (Main Part) | TLC082IDR (Substitute) | Match Status |
|---|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments | Identical |
| Base Product Number | TLC082 | TLC082 | Identical |
| Amplifier Type | General Purpose | General Purpose | Identical |
| Number of Circuits | 2 | 2 | Identical |
| Slew Rate | 19 V/µs | 19 V/µs | Identical |
| Gain Bandwidth Product | 10 MHz | 10 MHz | Identical |
| Current - Input Bias | 3 pA | 3 pA | Identical |
| Voltage - Input Offset | 390 µV | 390 µV | Identical |
| Current - Supply (per Channel) | 1.9 mA | 1.9 mA | Identical |
| Current - Output / Channel | 57 mA | 57 mA | Identical |
| Voltage - Supply Span (Min) | 4.5 V | 4.5 V | Identical |
| Voltage - Supply Span (Max) | 16 V | 16 V | Identical |
| Operating Temperature Range | -40°C to 125°C | -40°C to 125°C | Identical |
| Mounting Type | Through Hole | Surface Mount | Different |
| Package / Case | 8-DIP (0.300", 7.62mm) | 8-SOIC (0.154", 3.90mm Width) | Different |
| Product Status | Last Time Buy | Active | Different |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Identical |
| REACH Status | REACH Unaffected | REACH Unaffected | Identical |
Engineering Selection Recommendations
TLC082IDR Selection Criteria:
The TLC082IDR is the manufacturer-recommended substitute for the TLC082IP. This substitution is valid when the following conditions are met:
-
Electrical Compatibility: All electrical parameters are identical between the main part and substitute. The TLC082IDR delivers equivalent amplification performance, frequency response, and signal integrity characteristics.
-
Compliance Status: Both parts maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory alignment for current and future applications.
-
Product Availability: The TLC082IDR carries Active product status with current inventory availability, providing long-term supply continuity compared to the Last Time Buy status of the TLC082IP.
-
Package Transition: The substitution requires a transition from through-hole (8-DIP) to surface-mount (8-SOIC) technology. This change necessitates circuit board redesign to accommodate the different mounting method and physical footprint.
The TLC082IDR is suitable for new designs or redesigned applications where surface-mount assembly is preferred or required. For existing through-hole designs, the TLC082IP remains the appropriate choice until inventory depletion necessitates a board-level redesign.
Frequently Asked Questions (FAQ)
Q: What is the primary difference between the TLC082IP and TLC082IDR?
A: The primary difference is the package format and mounting technology. The TLC082IP uses through-hole mounting with an 8-DIP package, while the TLC082IDR uses surface-mount technology with an 8-SOIC package. All electrical specifications are identical.
Q: Can the TLC082IDR be used as a direct pin-for-pin replacement for the TLC082IP?
A: No. While the electrical specifications are identical, the physical package formats are different. The TLC082IDR cannot be inserted into a socket or PCB footprint designed for the TLC082IP without circuit board redesign and component rework.
Q: Are there any electrical performance differences between these two parts?
A: No. Both parts share identical electrical specifications including slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current, supply voltage range, and operating temperature range.
Q: Why is the TLC082IP classified as Last Time Buy?
A: Last Time Buy status indicates that Texas Instruments has discontinued production of this part. Existing inventory is available for purchase, but no future production runs are planned. Once inventory is depleted, the part will no longer be available.
Q: What should be considered when transitioning from TLC082IP to TLC082IDR?
A: Circuit board redesign is required to accommodate the different package footprint. The 8-SOIC package is significantly smaller than the 8-DIP package. PCB layout, component placement, and assembly processes must be updated to support surface-mount assembly.
Q: Are both parts compliant with current environmental regulations?
A: Yes. Both the TLC082IP and TLC082IDR are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements.
Q: Which part should be selected for new designs?
A: The TLC082IDR is recommended for new designs due to its Active product status and ongoing availability. Surface-mount technology also offers advantages in modern manufacturing environments.
Q: Can the TLC082IP be used in applications where the TLC082IDR is specified?
A: Electrically, yes. However, the through-hole package format of the TLC082IP is incompatible with PCB designs optimized for the 8-SOIC surface-mount package. Circuit board redesign would be required to use the TLC082IP in such applications.
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