TLC081IP Equivalent & Substitute Parts

Part Overview

The TLC081IP is a general-purpose operational amplifier manufactured by Texas Instruments, housed in an 8-DIP through-hole package. This device is classified as Last Time Buy, indicating discontinued production with limited remaining inventory. The TLC081IP serves applications requiring low-power, single-circuit amplification with specified gain-bandwidth and slew-rate characteristics. Identification of equivalent substitute parts is necessary due to product status transition and to support design flexibility across different mounting technologies and supply chain availability.

Substiute Parts

TLC081IP
Texas InstrumentsIn Stock: 1176TLC081IP Datasheet
TLC081IP
Current Part
TLC081IDR
Texas InstrumentsIn Stock: 1223TLC081IDR Datasheet
TLC081IDR
MFR Recommended

Key Parameters

Parameter Value Unit
Amplifier Type General Purpose
Number of Circuits 1
Slew Rate 19 V/µs
Gain Bandwidth Product 10 MHz
Current - Input Bias 2 pA
Voltage - Input Offset 390 µV
Current - Supply 1.9 mA
Current - Output / Channel 57 mA
Voltage - Supply Span (Min) 4.5 V
Voltage - Supply Span (Max) 16 V
Operating Temperature Range -40 to 125 °C
Mounting Type Through Hole
Package / Case 8-DIP (0.300", 7.62mm)

Substitute Part Grouping Explanation

Substitution of the TLC081IP is determined by electrical parameter equivalence and functional compatibility. The substitute part TLC081IDR maintains identical electrical specifications across all critical performance parameters: slew rate (19 V/µs), gain-bandwidth product (10 MHz), input bias current (2 pA), input offset voltage (390 µV), supply current (1.9 mA), output current per channel (57 mA), and supply voltage range (4.5 V to 16 V). Operating temperature range remains constant at -40°C to 125°C.

The primary distinction between the main part and substitute is the packaging format and mounting technology. The TLC081IP uses through-hole mounting in an 8-DIP package, while the TLC081IDR employs surface-mount technology in an 8-SOIC package. Both parts share the same base product number (TLC081) and are manufactured by Texas Instruments, confirming functional equivalence at the die level.

Substitution is valid when circuit design accommodates surface-mount assembly and PCB layout supports 8-SOIC footprint integration. No electrical parameter derating or functional compromise occurs with this substitution.

Parameter Comparison

Parameter TLC081IP (Main Part) TLC081IDR (Substitute) Match Status
Manufacturer Texas Instruments Texas Instruments Identical
Base Product Number TLC081 TLC081 Identical
Amplifier Type General Purpose General Purpose Identical
Number of Circuits 1 1 Identical
Slew Rate 19 V/µs 19 V/µs Identical
Gain Bandwidth Product 10 MHz 10 MHz Identical
Current - Input Bias 2 pA 2 pA Identical
Voltage - Input Offset 390 µV 390 µV Identical
Current - Supply 1.9 mA 1.9 mA Identical
Current - Output / Channel 57 mA 57 mA Identical
Voltage - Supply Span (Min) 4.5 V 4.5 V Identical
Voltage - Supply Span (Max) 16 V 16 V Identical
Operating Temperature -40°C to 125°C -40°C to 125°C Identical
Mounting Type Through Hole Surface Mount Different
Package / Case 8-DIP (0.300", 7.62mm) 8-SOIC (0.154", 3.90mm Width) Different
Product Status Last Time Buy Active Different
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical
REACH Status REACH Unaffected REACH Unaffected Identical

Engineering Selection Recommendations

Selection between TLC081IP and TLC081IDR is determined by assembly technology and supply chain requirements rather than electrical performance.

TLC081IP Selection Criteria:

  • Through-hole assembly processes required
  • Existing PCB designs with 8-DIP footprint
  • Manual insertion or wave-soldering manufacturing
  • Last Time Buy status: limited availability; procurement planning required

TLC081IDR Selection Criteria:

  • Surface-mount assembly capability available
  • New PCB designs or redesigns accommodating 8-SOIC footprint
  • Automated pick-and-place manufacturing processes
  • Active product status: continuous availability from manufacturer
  • Smaller package footprint (0.154" width vs. 0.300" width) for space-constrained applications

Both parts maintain ROHS3 compliance and REACH unaffected status. No electrical derating occurs with substitution. PCB layout and assembly process compatibility are the determining factors for part selection.

Frequently Asked Questions (FAQ)

Q: Are the TLC081IP and TLC081IDR electrically identical?

A: Yes. Both parts share identical electrical specifications including slew rate (19 V/µs), gain-bandwidth product (10 MHz), input bias current (2 pA), input offset voltage (390 µV), supply current (1.9 mA), output current (57 mA), and operating temperature range (-40°C to 125°C). The only differences are packaging format and mounting technology.

Q: Can I substitute TLC081IDR for TLC081IP in an existing design?

A: Substitution requires PCB redesign to accommodate the 8-SOIC surface-mount package in place of the 8-DIP through-hole package. The electrical performance remains unchanged, but assembly process and PCB layout must be modified accordingly.

Q: Can I substitute TLC081IP for TLC081IDR?

A: Substitution is possible only if the PCB design can be modified to accept the 8-DIP through-hole package and the assembly process supports through-hole insertion. This represents a reverse substitution with similar constraints.

Q: What is the significance of the TLC081IP "Last Time Buy" status?

A: Last Time Buy indicates the manufacturer has discontinued production. Current inventory (1118 Pcs) represents the final available stock. Once depleted, the TLC081IP will no longer be available from the manufacturer. The TLC081IDR, with Active status, provides long-term supply continuity.

Q: Are there compliance differences between these parts?

A: No. Both parts are ROHS3 compliant and REACH unaffected. Regulatory and environmental compliance status is identical.

Q: What is the package size difference?

A: The TLC081IP uses an 8-DIP package measuring 0.300" (7.62mm) in width. The TLC081IDR uses an 8-SOIC package measuring 0.154" (3.90mm) in width. The SOIC package is significantly smaller, enabling more compact PCB designs.

Q: Can I use either part interchangeably in my circuit?

A: Electrically, yes. Physically and in terms of assembly, no. The parts are functionally equivalent but require different PCB footprints and assembly processes. Circuit schematic compatibility is complete; PCB layout compatibility depends on package selection.

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