TLC073AID Equivalent & Substitute Parts

Part Overview

The TLC073AID is a CMOS dual-channel operational amplifier manufactured by Texas Instruments, packaged in a 14-SOIC surface mount configuration. This device is classified as a Last Time Buy product, indicating discontinued production with limited remaining inventory of 843 pieces. The TLC073AID serves applications requiring low-power CMOS amplification with dual independent circuits in a compact form factor. Identification of equivalent substitute parts is necessary due to the Last Time Buy status and to support long-term design continuity and supply chain planning.

Substiute Parts

TLC073AID
Texas InstrumentsIn Stock: 860TLC073AID Datasheet
TLC073AID
Current Part
TLC073IDGQR
Texas InstrumentsIn Stock: 5704TLC073IDGQR Datasheet
TLC073IDGQR
MFR Recommended

Key Parameters

Parameter Value Unit
Amplifier Type CMOS
Number of Circuits 2
Slew Rate 19 V/µs
Gain Bandwidth Product 10 MHz
Current - Input Bias 1.5 pA
Voltage - Input Offset 390 µV
Current - Supply (per Channel) 2.1 mA
Current - Output per Channel 57 mA
Voltage - Supply Span (Min) 4.5 V
Voltage - Supply Span (Max) 16 V
Operating Temperature Range -40 to 125 °C
Mounting Type Surface Mount
Package / Case 14-SOIC (0.154", 3.90mm Width)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the TLC073AID is determined by strict equivalence across all electrical performance parameters and compliance certifications. The substitute part TLC073IDGQR maintains identical electrical specifications including slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current, and supply voltage range. Both parts share the same base product number (TLC073), confirming core functional equivalence.

The primary distinction between the main part and substitute is packaging format and product status. The TLC073AID uses 14-SOIC packaging in tube format with Last Time Buy status, while the TLC073IDGQR uses 10-HVSSOP packaging in tape & reel format with Active product status. The TLC073IDGQR additionally carries Automotive grade qualification and AEC-Q100 certification, providing enhanced reliability documentation for automotive applications.

Substitution is valid when the following conditions are met:

  • Identical electrical performance parameters across all specified ranges
  • Identical operating temperature range (-40°C to 125°C)
  • Identical supply voltage specifications (4.5 V to 16 V)
  • Identical CMOS amplifier type with dual circuits
  • Identical RoHS3 compliance and MSL rating
  • PCB layout accommodation for alternative package dimensions

Parameter Comparison

Parameter TLC073AID (14-SOIC) TLC073IDGQR (10-HVSSOP) Match
Manufacturer Texas Instruments Texas Instruments Yes
Amplifier Type CMOS CMOS Yes
Number of Circuits 2 2 Yes
Slew Rate 19 V/µs 19 V/µs Yes
Gain Bandwidth Product 10 MHz 10 MHz Yes
Current - Input Bias 1.5 pA 1.5 pA Yes
Voltage - Input Offset 390 µV 390 µV Yes
Current - Supply (per Channel) 2.1 mA 2.1 mA Yes
Current - Output per Channel 57 mA 57 mA Yes
Voltage - Supply Span (Min) 4.5 V 4.5 V Yes
Voltage - Supply Span (Max) 16 V 16 V Yes
Operating Temperature Range -40°C to 125°C -40°C to 125°C Yes
Mounting Type Surface Mount Surface Mount Yes
RoHS Status ROHS3 Compliant ROHS3 Compliant Yes
Moisture Sensitivity Level 1 (Unlimited) 1 (Unlimited) Yes
Package / Case 14-SOIC (0.154", 3.90mm Width) 10-HVSSOP (0.118", 3.00mm Width) Different
Packaging Format Tube Tape & Reel Different
Product Status Last Time Buy Active Different
Grade Standard Automotive Different
Qualification AEC-Q100 Different

Engineering Selection Recommendations

The TLC073IDGQR serves as the direct electrical equivalent to the TLC073AID with identical performance across all specified electrical parameters. Selection between these parts is determined by application requirements and supply chain constraints rather than functional capability.

For applications requiring the 14-SOIC package format: The TLC073AID remains the appropriate selection if existing PCB layouts and assembly processes are optimized for this package. However, inventory status is Last Time Buy, requiring immediate procurement planning for long-term supply assurance.

For new designs or redesign opportunities: The TLC073IDGQR is the recommended selection. This part carries Active product status, ensuring long-term availability and supply continuity. The 10-HVSSOP package provides a smaller footprint (0.118" width versus 0.154" width), supporting space-constrained applications. Automotive grade qualification and AEC-Q100 certification provide enhanced reliability documentation suitable for automotive and mission-critical applications.

For automotive applications: The TLC073IDGQR is the required selection due to Automotive grade designation and AEC-Q100 qualification. The TLC073AID does not carry automotive certifications.

Compliance and regulatory considerations: Both parts maintain identical RoHS3 compliance, MSL rating, REACH status, and ECCN classification, ensuring equivalent regulatory standing across all markets.

Frequently Asked Questions (FAQ)

Q: Can the TLC073IDGQR directly replace the TLC073AID in existing designs?

A: Electrical substitution is complete. However, PCB layout modification is required due to package format differences. The TLC073IDGQR uses 10-HVSSOP packaging (0.118" width) versus the TLC073AID's 14-SOIC packaging (0.154" width). Pin configuration and footprint differ, requiring PCB redesign and assembly process validation.

Q: What is the significance of the Last Time Buy status on the TLC073AID?

A: Last Time Buy status indicates Texas Instruments has discontinued production of this part. Current inventory of 843 pieces represents the final available stock. After depletion, the TLC073AID will no longer be available from any source. Designs currently using this part must transition to the TLC073IDGQR or identify alternative solutions before inventory exhaustion.

Q: Are the electrical specifications identical between both parts?

A: Yes. All specified electrical parameters are identical: slew rate (19 V/µs), gain bandwidth product (10 MHz), input bias current (1.5 pA), input offset voltage (390 µV), supply current (2.1 mA per channel), output current (57 mA per channel), and supply voltage range (4.5 V to 16 V). Operating temperature range is identical (-40°C to 125°C).

Q: Why does the TLC073IDGQR have Automotive grade and AEC-Q100 qualification?

A: Automotive grade and AEC-Q100 certification indicate enhanced qualification testing and reliability documentation specific to automotive applications. These certifications do not alter electrical performance but provide additional assurance of quality and reliability for automotive and mission-critical environments. Standard-grade applications are not affected by these additional certifications.

Q: What are the packaging format differences?

A: The TLC073AID is supplied in tube packaging format, typically used for lower-volume or manual assembly processes. The TLC073IDGQR is supplied in tape & reel format, optimized for high-volume automated assembly. Tape & reel format provides better handling efficiency in production environments but requires compatible reel-handling equipment.

Q: Are there any supply voltage or temperature range differences?

A: No. Both parts operate identically across the full supply voltage range (4.5 V to 16 V minimum to maximum) and temperature range (-40°C to 125°C). No derating or operational restrictions apply to either part within these ranges.

Q: Can I use the TLC073IDGQR in automotive applications?

A: Yes. The TLC073IDGQR carries Automotive grade designation and AEC-Q100 qualification, making it suitable for automotive applications. The TLC073AID does not carry automotive certifications and should not be specified for automotive use.

Q: What is the impact of the smaller 10-HVSSOP package on PCB design?

A: The 10-HVSSOP package is physically smaller (0.118" width) than the 14-SOIC package (0.154" width), allowing for more compact PCB layouts. However, pin count and configuration differ, requiring complete footprint redesign. Thermal performance and signal integrity characteristics may differ due to package geometry changes, requiring validation during design transition.

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