TL072ACPSRE4 Equivalent & Substitute Parts

Part Overview

The TL072ACPSRE4 is a J-FET input operational amplifier manufactured by Texas Instruments, configured as a dual-channel (2 circuit) device in an 8-SOIC surface mount package. This component is classified as obsolete, indicating discontinued production and limited availability through standard distribution channels. The J-FET input architecture provides high input impedance and low input bias current characteristics suitable for precision signal conditioning applications.

Due to obsolete product status, identification of functionally equivalent substitute parts is necessary to maintain design continuity and ensure component availability for production and repair applications.

Substiute Parts

TL072ACPSRE4
Texas InstrumentsIn Stock: 857TL072ACPSRE4 Datasheet
TL072ACPSRE4
Current Part
MC33172D
STMicroelectronicsIn Stock: 100501MC33172D Datasheet
MC33172D
MFR Recommended
MC33172DT
STMicroelectronicsIn Stock: 45324MC33172DT Datasheet
MC33172DT
MFR Recommended

Key Parameters

Parameter Value Unit
Manufacturer Part Number TL072ACPSRE4
Manufacturer Texas Instruments
Amplifier Type J-FET
Number of Circuits 2
Package / Case 8-SOIC (0.209", 5.30mm Width)
Slew Rate 13 V/µs
Gain Bandwidth Product 3 MHz
Current - Input Bias 65 pA
Voltage - Input Offset 3 mV
Current - Supply 1.4 (x2 Channels) mA
Voltage - Supply Span (Min) 10 V
Voltage - Supply Span (Max) 30 V
Operating Temperature 0 to 70 °C
Mounting Type Surface Mount
Product Status Obsolete
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the TL072ACPSRE4 is determined by the following critical parameters:

Package Compatibility: Both substitute parts (MC33172D and MC33172DT) utilize the 8-SOIC surface mount package, ensuring mechanical and electrical compatibility with existing PCB layouts designed for the TL072ACPSRE4.

Dual-Channel Configuration: All substitute parts maintain a 2-circuit operational amplifier architecture, preserving functional equivalence in applications requiring dual-channel signal processing.

Supply Voltage Range: The substitute parts operate across a wider supply voltage range (4V to 44V) compared to the main part (10V to 30V). This expanded range ensures compatibility with the original design's supply specifications while providing additional operational flexibility.

Regulatory Compliance: All parts maintain ROHS3 compliance and REACH unaffected status, satisfying environmental and regulatory requirements consistent with the original component.

Product Status: The substitute parts (MC33172D and MC33172DT) are classified as active products with confirmed inventory availability, addressing the obsolescence limitation of the TL072ACPSRE4.

Parameter Comparison

Parameter TL072ACPSRE4 MC33172D MC33172DT Unit
Manufacturer Texas Instruments STMicroelectronics STMicroelectronics
Amplifier Type J-FET General Purpose General Purpose
Number of Circuits 2 2 2
Package / Case 8-SOIC (0.209", 5.30mm Width) 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width)
Slew Rate 13 2 2 V/µs
Gain Bandwidth Product 3 2.1 2.1 MHz
Current - Input Bias 65 20 20 pA
Voltage - Input Offset 3 1 1 mV
Current - Supply 1.4 (x2 Channels) 0.22 0.22 mA
Voltage - Supply Span (Min) 10 4 4 V
Voltage - Supply Span (Max) 30 44 44 V
Operating Temperature 0 to 70 -40 to 105 -40 to 105 °C
Mounting Type Surface Mount Surface Mount Surface Mount
Product Status Obsolete Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

MC33172D and MC33172DT Selection Basis:

Both MC33172D and MC33172DT are functionally equivalent substitutes for the TL072ACPSRE4, differentiated only by packaging format (Tube versus Cut Tape & Digi-Reel). Selection between these two variants depends on procurement and assembly requirements rather than electrical performance.

Product Status Advantage: The active product status of both MC33172 variants ensures long-term availability and supply chain continuity, eliminating the obsolescence risk associated with the TL072ACPSRE4.

Regulatory Compliance: All substitute parts maintain ROHS3 compliance and REACH unaffected status, satisfying environmental and regulatory requirements consistent with the original component specification.

Packaging Consideration: The substitute parts feature a narrower 8-SOIC package (0.154" width) compared to the original (0.209" width). This dimensional difference requires PCB layout verification to confirm footprint compatibility with existing designs.

Frequently Asked Questions (FAQ)

Q: Can MC33172D and MC33172DT be used interchangeably with TL072ACPSRE4 in existing designs?

A: Both MC33172 variants are electrically compatible substitutes. However, the narrower package width (0.154" versus 0.209") requires verification that existing PCB footprints accommodate the substitute component dimensions. Electrical functionality remains equivalent within the specified operating parameters.

Q: What are the key electrical differences between TL072ACPSRE4 and MC33172 substitutes?

A: The primary differences are amplifier type classification (J-FET versus General Purpose), slew rate (13 V/µs versus 2 V/µs), and gain bandwidth product (3 MHz versus 2.1 MHz). The MC33172 variants provide lower input bias current (20 pA versus 65 pA) and reduced supply current consumption (0.22 mA versus 1.4 mA). The substitute parts operate across a wider supply voltage range (4V to 44V versus 10V to 30V) and extended temperature range (-40°C to 105°C versus 0°C to 70°C).

Q: What is the difference between MC33172D and MC33172DT?

A: MC33172D is supplied in Tube packaging, while MC33172DT is supplied in Cut Tape & Digi-Reel format. Both parts are electrically and mechanically identical; packaging format selection depends on procurement volume and assembly automation requirements.

Q: Are there any compliance or regulatory concerns with substituting MC33172 for TL072ACPSRE4?

A: No. Both the original part and substitute parts maintain ROHS3 compliance and REACH unaffected status. All components satisfy equivalent environmental and regulatory requirements.

Q: How does the narrower package width of MC33172 affect PCB design?

A: The MC33172 8-SOIC package width of 0.154" is narrower than the TL072ACPSRE4 package width of 0.209". Existing PCB footprints designed for the original part must be evaluated for compatibility. In many cases, the narrower package will fit within the original footprint; however, layout verification is required to confirm adequate clearance and solder pad alignment.

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