TIP30 PBFREE Equivalent & Substitute Parts

Part Overview

The TIP30 PBFREE is a PNP bipolar junction transistor (BJT) manufactured by Central Semiconductor Corp, designed for general-purpose switching and amplification applications. This device operates at 40 V collector-emitter breakdown voltage with a maximum collector current of 1 A and dissipates up to 30 W of power in a Through Hole TO-220-3 package.

The TIP30 PBFREE is classified as obsolete. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain reliability, and support ongoing production or maintenance requirements for systems utilizing this component.

Substiute Parts

TIP30 PBFREE
Central Semiconductor CorpIn Stock: 1078TIP30 PBFREE Datasheet
TIP30 PBFREE
Current Part
TIP30
Solid State Inc.In Stock: 1985TIP30 Datasheet
TIP30
Parametric Equivalent

Key Parameters

Parameter Value Unit
Transistor Type PNP
Current - Collector (Ic) Max 1 A
Voltage - Collector Emitter Breakdown (Max) 40 V
Vce Saturation (Max) @ Ib, Ic 700 mV @ 125 mA, 1 A
Current - Collector Cutoff (Max) 300 µA
DC Current Gain (hFE) Min @ Ic, Vce 40 @ 200 mA, 4 V
Power - Max 30 W
Frequency - Transition 3 MHz
Operating Temperature Range -65 to 150 °C (TJ)
Mounting Type Through Hole
Package / Case TO-220-3

Substitute Part Grouping Explanation

Substitution of the TIP30 PBFREE is determined by strict equivalence across the following critical electrical and mechanical parameters:

Electrical Parameters (Must Match):

  • Transistor polarity: PNP
  • Maximum collector current (Ic): 1 A
  • Maximum collector-emitter breakdown voltage: 40 V
  • Vce saturation characteristics: 700 mV @ 125 mA, 1 A
  • Maximum collector cutoff current: 300 µA
  • DC current gain (hFE): minimum 40 @ 200 mA, 4 V
  • Maximum power dissipation: 30 W
  • Transition frequency: 3 MHz
  • Operating temperature range: -65°C to 150°C

Mechanical Parameters (Must Match):

  • Mounting type: Through Hole
  • Package type: TO-220-3 or compatible TO-220 variant

Substitute parts must satisfy all electrical parameters identically and maintain mechanical compatibility with the original TO-220-3 footprint. Packaging variations (such as Bulk versus standard packaging) do not affect electrical substitutability.

Parameter Comparison

Parameter TIP30 PBFREE (Central Semiconductor) TIP30 (Solid State Inc.) Match Status
Transistor Type PNP PNP ✓ Match
Current - Collector (Ic) Max 1 A 1 A ✓ Match
Voltage - Collector Emitter Breakdown (Max) 40 V 40 V ✓ Match
Vce Saturation (Max) @ Ib, Ic 700 mV @ 125 mA, 1 A 700 mV @ 125 mA, 1 A ✓ Match
Current - Collector Cutoff (Max) 300 µA 300 µA ✓ Match
DC Current Gain (hFE) Min @ Ic, Vce 40 @ 200 mA, 4 V 40 @ 200 mA, 4 V ✓ Match
Power - Max 30 W 30 W ✓ Match
Frequency - Transition 3 MHz 3 MHz ✓ Match
Operating Temperature Range -65°C to 150°C (TJ) -65°C to 150°C (TJ) ✓ Match
Mounting Type Through Hole Through Hole ✓ Match
Package / Case TO-220-3 TO-220-3 ✓ Match
Product Status Obsolete Active Substitute is Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ✓ Match

Engineering Selection Recommendations

The TIP30 manufactured by Solid State Inc. is a direct parametric equivalent to the TIP30 PBFREE from Central Semiconductor Corp. All electrical specifications, thermal characteristics, and mechanical parameters are identical.

Key Selection Factors:

  1. Product Status: The TIP30 PBFREE is obsolete, while the Solid State Inc. TIP30 maintains active product status. This ensures ongoing availability and supply chain continuity.

  2. Regulatory Compliance: Both parts are ROHS3 compliant, satisfying environmental and hazardous substance restrictions. The Solid State Inc. variant specifies Moisture Sensitivity Level (MSL) 1 (Unlimited), indicating no moisture sensitivity constraints during storage and handling.

  3. Inventory Availability: The Solid State Inc. TIP30 is available in higher quantities (1900 Pcs) compared to the original part (987 Pcs), supporting production scalability.

  4. Packaging Compatibility: Both devices utilize the TO-220-3 Through Hole package, ensuring direct mechanical and electrical compatibility with existing PCB designs and thermal management solutions.

The Solid State Inc. TIP30 is suitable for direct substitution in all applications where the TIP30 PBFREE was originally specified.

Frequently Asked Questions (FAQ)

Q: Can the TIP30 from Solid State Inc. be used as a direct replacement for the TIP30 PBFREE?

A: Yes. All electrical parameters, including collector current, breakdown voltage, saturation characteristics, current gain, power dissipation, and operating temperature range are identical. The TO-220-3 package ensures mechanical compatibility with existing designs.

Q: What is the significance of the "Obsolete" status of the TIP30 PBFREE?

A: Obsolete status indicates that the original manufacturer (Central Semiconductor Corp) has discontinued production. Identifying active equivalent parts ensures continued access to functionally identical components for maintenance, repair, and new production runs.

Q: Are there any differences in RoHS compliance between the two parts?

A: Both the TIP30 PBFREE and the Solid State Inc. TIP30 are ROHS3 compliant. No compliance differences exist.

Q: What does MSL 1 (Unlimited) mean for the Solid State Inc. TIP30?

A: MSL 1 (Unlimited) indicates that the component has no moisture sensitivity limitations. It can be stored and handled without special moisture control measures, simplifying logistics and inventory management.

Q: Are the electrical characteristics guaranteed to be identical?

A: Yes. The DC current gain (hFE), Vce saturation voltage, collector cutoff current, and all other specified electrical parameters are identical between the two parts. Both operate within the same -65°C to 150°C temperature range.

Q: Can packaging differences affect substitutability?

A: The packaging format (Bulk versus standard) does not affect electrical or mechanical substitutability. Both parts use the TO-220-3 Through Hole package and are electrically equivalent.

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