THS3120CDR Equivalent & Substitute Parts

Part Overview

The THS3120CDR is a current feedback amplifier integrated circuit manufactured by Texas Instruments, housed in an 8-SOIC surface mount package. This device is classified as obsolete, indicating it is no longer in active production. The THS3120CDR delivers high-speed amplification with a slew rate of 1700V/µs and -3dB bandwidth of 130 MHz, making it suitable for applications requiring fast signal processing and wide bandwidth performance.

Due to its obsolete status, locating new original inventory of the THS3120CDR presents supply chain challenges. Identifying functionally equivalent substitute parts with matching electrical specifications and compatible packaging options is essential for design continuity and production planning.

Substiute Parts

THS3120CDR

Texas InstrumentsIn Stock: 980THS3120CDR Datasheet

Current PartRFQ

THS3120CDGNR

Texas InstrumentsIn Stock: 1106THS3120CDGNR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the THS3120CDR is determined by strict equivalence across all electrical performance parameters and compliance certifications. The substitute part must maintain identical specifications for amplifier type, slew rate, bandwidth, input bias current, input offset voltage, supply current, output current capability, and supply voltage range. Additionally, the substitute must be RoHS3 compliant and possess the same moisture sensitivity level to ensure compatibility with existing manufacturing and assembly processes.

The primary substitute identified is the THS3120CDGNR, which shares all electrical characteristics with the THS3120CDR while offering an active product status and alternative surface mount packaging. The key differentiating factor between these parts is the package type: the THS3120CDR uses 8-SOIC packaging, while the THS3120CDGNR uses 8-HVSSOP packaging. Both packages are surface mount configurations with different physical dimensions and pin layouts, requiring PCB design modifications for implementation.

Parameter Comparison

Engineering Selection Recommendations

The THS3120CDGNR serves as the direct electrical equivalent to the THS3120CDR, with all performance specifications matching identically. The primary advantage of selecting the THS3120CDGNR is its active product status, ensuring ongoing availability and supply chain reliability. Both parts maintain ROHS3 compliance and REACH unaffected status, satisfying regulatory requirements for current manufacturing standards.

The transition from THS3120CDR to THS3120CDGNR requires PCB layout modification due to package differences. The THS3120CDR occupies an 8-SOIC footprint with 3.90mm width, while the THS3120CDGNR uses an 8-HVSSOP footprint with 3.00mm width and an exposed pad. The exposed pad in the THS3120CDGNR package provides enhanced thermal performance and improved electrical characteristics through direct connection to ground or power planes.

Selection of the THS3120CDGNR is appropriate for new designs and production transitions where PCB redesign is feasible. For applications requiring the original 8-SOIC package form factor without PCB modification, alternative sourcing strategies or design review may be necessary.

Frequently Asked Questions (FAQ)

Q: Are the THS3120CDR and THS3120CDGNR electrically interchangeable?

A: Yes. Both parts share identical electrical specifications including slew rate, bandwidth, input bias current, input offset voltage, supply current, output current, and supply voltage range. They are functionally equivalent current feedback amplifiers.

Q: What is the primary difference between these two parts?

A: The main difference is packaging. The THS3120CDR uses 8-SOIC (3.90mm width) while the THS3120CDGNR uses 8-HVSSOP (3.00mm width) with an exposed pad. This requires different PCB footprints and layout considerations.

Q: Why is the THS3120CDR listed as obsolete?

A: The THS3120CDR has been discontinued by Texas Instruments. The THS3120CDGNR represents the active production alternative with the same electrical performance.

Q: Can I use the THS3120CDGNR as a direct pin-for-pin replacement?

A: No. While electrically equivalent, the different package types (8-SOIC versus 8-HVSSOP) have different physical dimensions and pin layouts. PCB redesign is required to accommodate the THS3120CDGNR footprint.

Q: What advantage does the exposed pad on the THS3120CDGNR provide?

A: The exposed pad allows direct thermal connection to PCB ground or power planes, improving heat dissipation and potentially enhancing circuit performance in high-frequency applications.

Q: Are both parts RoHS compliant?

A: Yes. Both the THS3120CDR and THS3120CDGNR are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory standards.

Q: What is the moisture sensitivity level for these parts?

A: Both parts have Moisture Sensitivity Level 1 (Unlimited), indicating no special moisture control requirements during storage or handling.

Q: Is the THS3120CDGNR available in tape and reel packaging?

A: Yes. The THS3120CDGNR is supplied in Tape & Reel (TR) packaging, suitable for automated assembly processes.