THGAMRG9T23BAIL Equivalent & Substitute Parts

Part Overview

The THGAMRG9T23BAIL is a 512Gbit NAND Flash eMMC memory IC manufactured by Kioxia America, Inc., packaged in a 153-WFBGA (11.5x13mm) configuration. This component is classified as obsolete, making substitute parts necessary for new designs and ongoing production requirements. The part operates across an industrial temperature range of -25°C to 85°C and complies with ROHS3 and REACH standards.

Substiute Parts

THGAMRG9T23BAIL

Kioxia America, Inc.In Stock: 2183THGAMRG9T23BAIL Datasheet

Current PartRFQ

THGAMVG9T23BAIL

Kioxia America, Inc.In Stock: 851THGAMVG9T23BAIL Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the THGAMRG9T23BAIL is determined by the following critical parameters:

• Memory capacity: 512Gbit minimum
• Memory organization: 64G x 8 configuration
• Interface standard: eMMC protocol support
• Package footprint: 153-BGA/WBGA with 11.5x13mm dimensions
• Mounting compatibility: Surface mount BGA technology
• Temperature range: Operating specification must encompass the required thermal envelope
• Compliance certifications: ROHS3 and REACH status alignment

The THGAMVG9T23BAIL meets all substitution criteria as an active product offering equivalent memory capacity, organization, and physical packaging with enhanced interface specifications (eMMC_5.1 at 200 MHz).

Parameter Comparison

Engineering Selection Recommendations

The THGAMVG9T23BAIL is the primary substitute for the obsolete THGAMRG9T23BAIL. Selection is justified on the following basis:

• Both parts are manufactured by Kioxia America, Inc., ensuring consistent quality and reliability standards
• Identical memory capacity (512Gbit) and organization (64G x 8) provide direct functional equivalence
• Physical package dimensions (11.5x13mm) and BGA footprint are compatible with existing PCB designs
• The substitute operates within the required temperature range (-20°C to 85°C), with the lower limit at -20°C versus -25°C for the original part
• eMMC_5.1 interface on the substitute represents a specification enhancement over the base eMMC standard
• Both parts maintain identical MSL rating (3, 168 Hours) and export compliance classifications (ECCN, HTSUS)
• The substitute is currently in active production status, ensuring supply chain availability

For applications requiring operation below -20°C, the lower temperature specification of the substitute must be evaluated against system requirements.

Frequently Asked Questions (FAQ)

Q: Can THGAMVG9T23BAIL directly replace THGAMRG9T23BAIL in existing designs?

A: Yes. Both parts share identical memory capacity, organization, and physical package dimensions (153-BGA, 11.5x13mm). The substitute's eMMC_5.1 interface is backward compatible with eMMC protocol requirements. PCB footprint and mounting procedures remain unchanged.

Q: What is the difference between 153-WFBGA and 153-WBGA packaging?

A: Both designations refer to 153-ball BGA packages with 11.5x13mm dimensions. The "W" prefix indicates a wafer-level package. The WFBGA and WBGA variants are mechanically and electrically compatible for this application.

Q: Does the operating temperature difference affect substitution suitability?

A: The substitute operates from -20°C to 85°C versus the original's -25°C to 85°C. For applications requiring operation below -20°C, the lower temperature limit of the substitute must be verified against system specifications. For standard industrial applications (-20°C and above), the substitute is fully suitable.

Q: Are there supply chain advantages to using the substitute part?

A: Yes. The THGAMVG9T23BAIL is in active production status with documented inventory availability, whereas the original THGAMRG9T23BAIL is obsolete. New designs should specify the substitute to ensure long-term component availability.

Q: Is the eMMC_5.1 specification on the substitute compatible with eMMC host controllers?

A: eMMC_5.1 is backward compatible with earlier eMMC protocol versions. Existing host controllers designed for standard eMMC will operate with the eMMC_5.1 device. The 200 MHz clock frequency specification on the substitute represents enhanced performance capability.

Q: Do both parts meet the same compliance requirements?

A: Yes. Both parts carry identical ECCN (3A991B1A) and HTSUS (8542.32.0071) classifications, and both comply with ROHS3 standards and REACH regulations.