THGAMRG8T13BAIL Equivalent & Substitute Parts

Part Overview

The THGAMRG8T13BAIL is a 256Gbit NAND Flash eMMC memory IC manufactured by Kioxia America, Inc., packaged in a 153-WFBGA (11.5x13mm) configuration. This component is classified as obsolete, making substitute parts necessary for new designs and ongoing production requirements. The part operates within a 2.7V to 3.6V supply voltage range and supports a temperature range of -25°C to 85°C.

Substiute Parts

THGAMRG8T13BAIL

Kioxia America, Inc.In Stock: 1309THGAMRG8T13BAIL Datasheet

Current PartRFQ

THGAMVG8T13BAIL

Kioxia America, Inc.In Stock: 2216THGAMVG8T13BAIL Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the THGAMRG8T13BAIL is determined by the following critical parameters:

• Memory Capacity: 256Gbit (fixed requirement)
• Memory Organization: 32G x 8 (fixed requirement)
• Memory Interface: eMMC protocol compatibility
• Package Footprint: 153-BGA/WFBGA (11.5x13mm physical dimensions)
• Voltage Supply: 2.7V ~ 3.6V operating range
• Mounting Type: Surface Mount BGA configuration
• Compliance: RoHS3 and REACH status alignment

The THGAMVG8T13BAIL qualifies as a direct substitute based on matching memory capacity, organization, package footprint, voltage specifications, and compliance certifications. The substitute part operates with an enhanced eMMC_5.1 interface specification and higher clock frequency (200 MHz), representing a functional upgrade while maintaining backward compatibility with the original part's core electrical and mechanical requirements.

Parameter Comparison

Engineering Selection Recommendations

The THGAMVG8T13BAIL is the qualified substitute for the obsolete THGAMRG8T13BAIL based on the following engineering criteria:

• Compliance Alignment: Both parts maintain ROHS3 compliance and identical MSL ratings, ensuring equivalent handling and assembly requirements.
• Electrical Compatibility: Identical voltage supply range (2.7V ~ 3.6V) and matching memory organization (32G x 8) ensure direct functional replacement.
• Package Compatibility: Both parts use 153-BGA footprints with identical 11.5x13mm physical dimensions, supporting PCB layout reuse.
• Active Product Status: The substitute part is in active production, ensuring long-term availability and supply chain stability compared to the obsolete main part.
• Interface Enhancement: The eMMC_5.1 specification of the substitute represents a protocol upgrade with 200 MHz clock frequency support, providing improved performance characteristics while maintaining backward compatibility.

Frequently Asked Questions (FAQ)

Q: Can the THGAMVG8T13BAIL directly replace the THGAMRG8T13BAIL in existing designs?

A: Yes. Both parts share identical memory capacity (256Gbit), organization (32G x 8), voltage supply range (2.7V ~ 3.6V), and package footprint (153-BGA, 11.5x13mm). The substitute part's eMMC_5.1 interface is compatible with eMMC host controllers designed for the original part.

Q: What is the difference in operating temperature ranges?

A: The main part operates from -25°C to 85°C (TA), while the substitute operates from -20°C to 85°C (TC). The substitute's minimum temperature is 5°C higher. Applications requiring operation below -20°C must evaluate this specification difference.

Q: Are the package designations 153-WFBGA and 153-BGA interchangeable?

A: Both designations refer to 153-ball BGA packages with identical 11.5x13mm footprints. The physical dimensions and ball pitch are equivalent, supporting direct PCB layout compatibility.

Q: What compliance certifications apply to both parts?

A: Both parts are ROHS3 compliant and carry identical MSL ratings of 3 (168 Hours), ensuring equivalent environmental compliance and moisture handling requirements during assembly and storage.

Q: Why is the substitute part recommended despite the main part's lower minimum operating temperature?

A: The substitute part is in active production status, ensuring reliable supply chain availability. The main part is obsolete, creating sourcing challenges. For applications not requiring operation below -20°C, the substitute provides equivalent functionality with superior availability.