THGAMRG7T13BAIL Equivalent & Substitute Parts

Part Overview

The THGAMRG7T13BAIL is a 128Gbit NAND Flash eMMC memory IC manufactured by Kioxia America, Inc., packaged in a 153-WFBGA (11.5x13mm) surface mount configuration. This component is classified as obsolete, indicating discontinuation from active production. The part operates across an industrial temperature range of -25°C to 85°C and complies with ROHS3 and REACH standards. Due to its obsolete status, equivalent substitute parts with active product status are necessary for new designs and ongoing production requirements.

Substiute Parts

THGAMRG7T13BAIL

Kioxia America, Inc.In Stock: 1283THGAMRG7T13BAIL Datasheet

Current PartRFQ

THGAMVG7T13BAIL

Kioxia America, Inc.In Stock: 803THGAMVG7T13BAIL Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the THGAMRG7T13BAIL is determined by strict equivalence across the following critical parameters:

• Memory capacity: 128Gbit
• Memory organization: 16G x 8 configuration
• Interface standard: eMMC protocol compatibility
• Package footprint: 153-BGA/WFBGA (11.5x13mm) surface mount
• Temperature range: -25°C to 85°C operation
• Compliance certifications: ROHS3 and REACH standards

The substitute part THGAMVG7T13BAIL meets all these core requirements while offering active product status and enhanced interface specifications (eMMC_5.1 with 200 MHz clock frequency).

Parameter Comparison

Engineering Selection Recommendations

The THGAMVG7T13BAIL is the direct substitute for the obsolete THGAMRG7T13BAIL. Both parts are manufactured by Kioxia America, Inc., and maintain identical memory capacity, organization, and thermal operating range. The substitute part offers active product status, ensuring continued availability for production and design cycles. Both components satisfy ROHS3 and REACH compliance requirements. The THGAMVG7T13BAIL incorporates eMMC_5.1 interface specification with 200 MHz clock frequency and specified supply voltage range of 2.7V to 3.6V, representing a functional enhancement over the base eMMC interface of the original part. The identical 153-BGA footprint (11.5x13mm) and surface mount configuration ensure direct PCB compatibility.

Frequently Asked Questions (FAQ)

Q: Can THGAMVG7T13BAIL directly replace THGAMRG7T13BAIL in existing designs?

A: Yes. Both parts share identical memory capacity (128Gbit), organization (16G x 8), package footprint (153-BGA, 11.5x13mm), and operating temperature range (-25°C to 85°C). The substitute part is pin-compatible and functionally equivalent for eMMC interface applications.

Q: What is the difference between eMMC and eMMC_5.1?

A: eMMC_5.1 is an enhanced specification of the eMMC standard, supporting higher clock frequencies (200 MHz in this case) and improved performance characteristics. The THGAMVG7T13BAIL's eMMC_5.1 interface is backward compatible with eMMC protocol requirements.

Q: Are there packaging differences between the two parts?

A: Both parts use 153-BGA surface mount packages with identical 11.5x13mm dimensions. The THGAMRG7T13BAIL is supplied in standard packaging, while the THGAMVG7T13BAIL is supplied in Tray packaging. PCB footprint and mounting requirements are identical.

Q: What is the supply voltage requirement for the substitute part?

A: The THGAMVG7T13BAIL operates at 2.7V to 3.6V supply voltage. Confirm your system power delivery specifications match this range before implementation.

Q: Are both parts RoHS and REACH compliant?

A: Yes. Both THGAMRG7T13BAIL and THGAMVG7T13BAIL are ROHS3 compliant and REACH unaffected, meeting environmental and regulatory requirements for industrial and commercial applications.

Q: Why is the original part obsolete?

A: The THGAMRG7T13BAIL has been discontinued by the manufacturer. The THGAMVG7T13BAIL represents the active production equivalent with enhanced specifications and continued availability.