TFM-115-22-S-D-A-P Equivalent & Substitute Parts

Part Overview

The TFM-115-22-S-D-A-P is a surface mount rectangular connector header manufactured by Samtec Inc. as part of the Tiger Eye™ TFM series. This connector is an active product designed for board-to-board or cable applications requiring 30-position, dual-row interconnection at 1.27mm pitch. The part is in active production status with full inventory availability. Substitute parts may be required due to design modifications, application-specific insulation height requirements, or inventory optimization across manufacturing facilities.

Substiute Parts

TFM-115-22-S-D-A-P

Samtec Inc.In Stock: 959TFM-115-22-S-D-A-P Datasheet

Current PartRFQ

TFM-115-32-S-D-A-P

Samtec Inc.In Stock: 1240TFM-115-32-S-D-A-P Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

The TFM-115-22-S-D-A-P has one identified substitute within the Tiger Eye™ TFM series: TFM-115-32-S-D-A-P. Substitution eligibility is determined by the following critical parameters that remain constant across both parts:

• Connector type, contact type, and gender (Header, Male Pin)
• Number of positions and rows (30 positions, 2 rows)
• Mating pitch and row spacing (0.050" / 1.27mm)
• Mounting type and termination method (Surface Mount, Solder)
• Fastening mechanism (Push-Pull)
• Shrouding configuration (Shrouded - 4 Wall)
• Contact material and finish specifications (Phosphor Bronze, Gold mating finish)
• Insulation material (Liquid Crystal Polymer)
• Electrical ratings (2.9A per contact, 275VAC)
• Operating temperature range (-55°C ~ 125°C)
• Compliance certifications (ROHS3, UL94 V-0)

The primary difference between these parts is the insulation height dimension, which varies to accommodate different PCB stack-up requirements or mating interface specifications.

Parameter Comparison

Engineering Selection Recommendations

Both TFM-115-22-S-D-A-P and TFM-115-32-S-D-A-P are active products with full ROHS3 compliance and UL94 V-0 flammability certification. Selection between these parts is determined by PCB design requirements, specifically the available vertical clearance and mating interface stack-up height. The TFM-115-22-S-D-A-P features an insulation height of 0.360" (9.14mm), while the TFM-115-32-S-D-A-P provides an increased insulation height of 0.435" (11.05mm). Both parts maintain identical electrical performance, contact ratings, and environmental specifications. Inventory availability is confirmed for both variants, with 927 units of TFM-115-22-S-D-A-P and 1196 units of TFM-115-32-S-D-A-P in stock.

Frequently Asked Questions (FAQ)

Q: Can TFM-115-32-S-D-A-P be used as a direct replacement for TFM-115-22-S-D-A-P?

A: Substitution is possible only if the PCB design accommodates the increased insulation height of 0.435" (11.05mm) versus 0.360" (9.14mm). All other electrical, mechanical, and environmental specifications are identical. Verify available vertical clearance in the mating interface before substitution.

Q: Are there any electrical performance differences between these two parts?

A: No. Both parts share identical current ratings (2.9A per contact), voltage ratings (275VAC), contact materials, finishes, and operating temperature ranges (-55°C ~ 125°C).

Q: What determines the choice between these two connector variants?

A: The primary determining factor is the insulation height requirement of your PCB assembly. The TFM-115-22-S-D-A-P is specified for applications requiring a lower profile (0.360"), while the TFM-115-32-S-D-A-P accommodates designs needing additional vertical space (0.435").

Q: Are both parts RoHS compliant?

A: Yes. Both TFM-115-22-S-D-A-P and TFM-115-32-S-D-A-P are ROHS3 compliant with UL94 V-0 flammability certification.

Q: What is the moisture sensitivity level for these connectors?

A: Both parts have a Moisture Sensitivity Level (MSL) of 1, indicating unlimited shelf life without special moisture control requirements.

Q: Do these connectors support pick-and-place assembly?

A: Yes. Both variants include board guide and pick-and-place features for automated assembly processes.