TE0803-03-3BE11-AS Equivalent & Substitute Parts

Part Overview

The TE0803-03-3BE11-AS is a System-on-Module (SOM) embedded processor module manufactured by Trenz Electronic GmbH. This module integrates a Zynq UltraScale+ XCZU3EG-1SFVC784E processor with 2GB RAM and 128MB Flash storage on a compact 52.00mm × 76.00mm form factor. The module features B2B connector interfaces for integration into carrier boards and industrial embedded systems.

The TE0803 series has reached obsolete product status. Identifying equivalent and substitute modules is essential for system redesign, long-term supply chain planning, and end-of-life product transitions.

Substiute Parts

TE0803-03-3BE11-AS

Trenz Electronic GmbHIn Stock: 877TE0803-03-3BE11-AS Datasheet

Current PartRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the TE0803-03-3BE11-AS is determined by the following critical parameters:

• Core Processor Family: Zynq UltraScale+ architecture compatibility
• Memory Configuration: RAM capacity (2GB) and Flash storage (128MB)
• Connector Interface: B2B connector type for carrier board integration
• Physical Form Factor: Module dimensions (52.00mm × 76.00mm)
• Operating Temperature Range: 0°C to 85°C industrial specification
• Compliance Standards: ROHS3 certification requirement

No substitute parts have been identified with equivalent specifications matching all critical parameters. The provided substitute part list contains no entries.

Parameter Comparison

Engineering Selection Recommendations

The TE0803-03-3BE11-AS is classified as obsolete. For new designs or system transitions, component selection must account for:

• Processor Availability: Zynq UltraScale+ XCZU3EG-1SFVC784E availability through authorized Xilinx distributors
• Compliance Requirements: ROHS3 certification is mandatory for EU market applications
• Supply Chain Status: Current inventory of 807 pieces is available; long-term sourcing requires evaluation of alternative Zynq UltraScale+ modules from Trenz Electronic or competing manufacturers
• Thermal Specifications: Operating temperature range of 0°C to 85°C must be validated against target application requirements

Frequently Asked Questions (FAQ)

Q: What makes a module a valid substitute for the TE0803-03-3BE11-AS?

A: A substitute module must match the core processor family (Zynq UltraScale+), memory configuration (2GB RAM, 128MB Flash), B2B connector interface, physical dimensions (52.00mm × 76.00mm), and operating temperature range (0°C to 85°C). ROHS3 compliance is required for regulatory alignment.

Q: Why is the TE0803-03-3BE11-AS marked as obsolete?

A: Obsolete status indicates the manufacturer has discontinued production. Existing inventory may be available through authorized distributors, but long-term supply cannot be guaranteed.

Q: Can I use a different Zynq UltraScale+ module as a direct replacement?

A: Direct replacement requires matching all specified parameters: processor variant, memory capacity, connector type, form factor, and temperature rating. Dimensional compatibility with existing carrier board designs is critical.

Q: What is the significance of the B2B connector type?

A: B2B (Board-to-Board) connectors are designed for direct integration onto carrier boards. Substitute modules must use identical or mechanically compatible B2B connector specifications to ensure proper mating and signal integrity.

Q: Is ROHS3 compliance required for all applications?

A: ROHS3 compliance is mandatory for products sold in the European Union and many other regulated markets. Verify compliance requirements for your target application and geography.