TDC227K010WSG-F Equivalent & Substitute Parts

Part Overview

The TDC227K010WSG-F is a 220 µF conformal coated tantalum capacitor rated at 10 V with radial through-hole mounting, manufactured by Cornell Dubilier Electronics (CDE). This component is classified as obsolete, necessitating identification of active equivalent parts for ongoing production and maintenance applications. The conformal coating provides enhanced environmental protection suitable for demanding operational conditions.

Substiute Parts

TDC227K010WSG-F

Cornell Dubilier Electronics (CDE)In Stock: 1157TDC227K010WSG-F Datasheet

Current PartRFQ

TAP227K010HSB

KYOCERA AVXIn Stock: 1036TAP227K010HSB Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the TDC227K010WSG-F is determined by strict equivalence across the following critical parameters:

Mandatory Matching Parameters:

• Capacitance: 220 µF
• Tolerance: ±10%
• Voltage Rating: 10 V
• Type: Conformal Coated Tantalum
• Mounting Type: Through Hole Radial
• Lead Spacing: 0.250" (6.35mm)
• Operating Temperature Range: -55°C to 125°C
• RoHS3 Compliance

The TAP227K010HSB from KYOCERA AVX meets all mandatory substitution criteria. Physical dimensions show minor variations within acceptable mechanical tolerances for through-hole radial mounting applications. The substitute part maintains identical electrical specifications and environmental compliance requirements.

Parameter Comparison

Engineering Selection Recommendations

The TAP227K010HSB is the qualified substitute for the obsolete TDC227K010WSG-F based on the following engineering criteria:

Electrical Equivalence: Both parts maintain identical capacitance (220 µF), tolerance (±10%), and voltage rating (10 V) specifications. Operating temperature ranges are identical (-55°C to 125°C), ensuring functional compatibility across all specified environmental conditions.

Mechanical Compatibility: Lead spacing remains constant at 0.250" (6.35mm), permitting direct PCB footprint compatibility. Dimensional variations in diameter and height are minor and remain within standard through-hole radial mounting tolerances.

Compliance Status: The TAP227K010HSB maintains ROHS3 compliance equivalent to the original part, satisfying regulatory requirements for new production and field replacement applications.

Product Availability: The substitute part holds active product status with confirmed inventory availability, addressing the obsolescence of the original CDE component.

Frequently Asked Questions (FAQ)

Q: Can the TAP227K010HSB be used as a direct replacement for the TDC227K010WSG-F?

A: Yes. The TAP227K010HSB meets all mandatory electrical and mechanical parameters for direct substitution. Identical capacitance, voltage rating, tolerance, and lead spacing ensure PCB compatibility and functional equivalence.

Q: Are there dimensional differences between these parts?

A: Minor dimensional variations exist. The TAP227K010HSB has a slightly larger diameter (0.394" vs. 0.350") and height (0.669" vs. 0.650"). These differences remain within standard through-hole radial component tolerances and do not affect PCB mounting compatibility.

Q: Does the substitute part maintain the same operating temperature range?

A: Yes. Both parts operate across the identical temperature range of -55°C to 125°C, ensuring equivalent thermal performance in all specified applications.

Q: What is the significance of the ESR specification on the substitute part?

A: The TAP227K010HSB specifies 600 mOhm ESR, providing quantified performance data. The original part does not specify ESR. This additional specification on the substitute part represents enhanced documentation without altering functional compatibility.

Q: Are both parts RoHS compliant?

A: Yes. Both the TDC227K010WSG-F and TAP227K010HSB are ROHS3 compliant, meeting current environmental and regulatory standards for electronic components.

Q: What is the lead spacing, and is it identical between parts?

A: Lead spacing is 0.250" (6.35mm) for both parts, ensuring identical PCB footprint compatibility and eliminating any layout redesign requirements.