TDA21103 Equivalent & Substitute Parts

Part Overview

The TDA21103 is a half-bridge driver IC manufactured by Infineon Technologies, designed for power management applications including DC-DC converters and voltage regulators. This device features integrated bootstrap circuitry and shoot-through/over-voltage fault protection for driving power MOSFETs in half-bridge configurations.

The TDA21103 is classified as obsolete. Identifying equivalent substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support legacy system maintenance where this component is specified in existing designs.

Substiute Parts

TDA21103

Infineon TechnologiesIn Stock: 1340TDA21103 Datasheet

Current PartRFQ

ISL6614ACBZ

Renesas Electronics CorporationIn Stock: 1876ISL6614ACBZ Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TDA21103 is determined by the following critical parameters:

Electrical Compatibility:

• Half-bridge driver configuration with dual output channels
• Supply voltage range: 10.8V ~ 13.2V
• Operating temperature range: 0°C ~ 125°C (TJ)
• Package type: 14-SOIC form factor
• Bootstrap circuit functionality for high-side gate drive

Mechanical Compatibility:

• Surface mount technology
• 14-SOIC (0.154", 3.90mm Width) package footprint

The ISL6614ACBZ from Renesas Electronics Corporation meets these substitution criteria as a half-bridge gate driver IC in the same 14-SOIC package with matching supply voltage and temperature specifications.

Parameter Comparison

Engineering Selection Recommendations

Compliance Considerations:

The ISL6614ACBZ is ROHS3 compliant, whereas the TDA21103 is RoHS non-compliant. For new designs or systems requiring regulatory compliance with current environmental standards, the ISL6614ACBZ is the preferred substitute. Both parts are classified as obsolete and carry REACH Unaffected status.

Electrical Equivalence:

Both devices operate within the same supply voltage range (10.8V ~ 13.2V) and temperature range (0°C ~ 125°C TJ), ensuring functional compatibility in existing circuit topologies. The ISL6614ACBZ provides specified peak output current ratings (1.25A source, 2A sink) and bootstrap voltage capability (36V maximum), which support the half-bridge driver application requirements.

Package and Mechanical Compatibility:

Both parts use identical 14-SOIC surface mount packaging, enabling direct PCB footprint compatibility without layout modifications.

Frequently Asked Questions (FAQ)

Q: Can the ISL6614ACBZ directly replace the TDA21103 on existing PCBs?

A: Yes. Both devices use the 14-SOIC package with identical pinout compatibility for half-bridge driver applications. No PCB layout changes are required.

Q: What are the key electrical differences between these parts?

A: The ISL6614ACBZ provides specified peak output current ratings (1.25A source, 2A sink) and documented rise/fall times (26ns, 18ns), whereas these parameters are not specified for the TDA21103. Both operate within the same supply voltage (10.8V ~ 13.2V) and temperature ranges (0°C ~ 125°C TJ).

Q: Does the RoHS compliance difference affect substitution?

A: The ISL6614ACBZ is ROHS3 compliant while the TDA21103 is RoHS non-compliant. For applications requiring current environmental compliance standards, the ISL6614ACBZ is the appropriate choice. For legacy system maintenance where original specifications must be preserved, the RoHS status difference should be evaluated against system requirements.

Q: Are both parts suitable for DC-DC converter and voltage regulator applications?

A: Yes. Both devices are half-bridge driver ICs with bootstrap circuit functionality, designed for power management applications including DC-DC converters and voltage regulators with inductive loads.

Q: What is the moisture sensitivity level difference?

A: The TDA21103 has MSL 1 (Unlimited), while the ISL6614ACBZ has MSL 3 (168 Hours). This affects storage and handling requirements, with the ISL6614ACBZ requiring more controlled moisture exposure during storage and prior to reflow soldering.