TCA9534DBR Equivalent & Substitute Parts

Part Overview

The TCA9534DBR is an 8-bit I/O expander interface component manufactured by Texas Instruments, currently in active product status with ROHS3 compliance. This component is used in applications requiring I2C-based digital input/output expansion. Substitute parts become necessary when addressing packaging constraints, supply chain availability, or specific mounting requirements while maintaining functional equivalence across the I/O expansion interface.

Substiute Parts

TCA9534DBR

Texas InstrumentsIn Stock: 920TCA9534DBR Datasheet

Current PartRFQ

MAX7324AEG+

Analog Devices Inc./Maxim IntegratedIn Stock: 1149MAX7324AEG+ Datasheet

SimilarRFQ

MAX7324ATG+

Analog Devices Inc./Maxim IntegratedIn Stock: 1239MAX7324ATG+ Datasheet

SimilarRFQ

MAX7324ATG+T

Analog Devices Inc./Maxim IntegratedIn Stock: 1015MAX7324ATG+T Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the TCA9534DBR are qualified based on the following electrical and mechanical parameters:

• Interface Protocol: I2C communication standard
• I/O Count: 8-bit configuration
• Clock Frequency: 400 kHz operation
• Interrupt Output: Presence of interrupt capability
• Output Type: Push-Pull configuration
• Current Rating: 20mA source/sink capability
• Supply Voltage Range: 1.71V ~ 5.5V compatibility
• Operating Temperature: -40°C ~ 125°C range
• RoHS Compliance: ROHS3 Compliant status
• REACH Compliance: REACH Unaffected status
• Product Status: Active components only

The MAX7324 series (Analog Devices Inc./Maxim Integrated) meets all functional and compliance requirements. Substitution differences are limited to packaging format and tape/reel availability.

Parameter Comparison

Engineering Selection Recommendations

All substitute parts maintain functional equivalence with the TCA9534DBR across electrical specifications, interface protocol, and compliance certifications. Selection between substitute options is determined by packaging and delivery format requirements:

MAX7324AEG+: 24-SSOP package format, tube packaging. Suitable for applications with SSOP footprint requirements.

MAX7324ATG+: 24-TQFN (4x4) package format, tube packaging. Suitable for applications with TQFN footprint requirements and reduced board space.

MAX7324ATG+T: 24-TQFN (4x4) package format, tape & reel packaging. Suitable for high-volume production environments requiring automated assembly with tape & reel delivery.

All substitute parts carry ROHS3 compliance and REACH unaffected status, matching the regulatory requirements of the primary component.

Frequently Asked Questions (FAQ)

Q: Are MAX7324 series parts functionally equivalent to TCA9534DBR? A: Yes. All electrical parameters, I2C interface specifications, I/O configuration, clock frequency, interrupt output capability, and supply voltage range are identical across the TCA9534DBR and all MAX7324 substitute options.

Q: What is the primary difference between MAX7324AEG+, MAX7324ATG+, and MAX7324ATG+T? A: The primary differences are package format and delivery method. MAX7324AEG+ uses 24-SSOP packaging in tube format. MAX7324ATG+ and MAX7324ATG+T both use 24-TQFN (4x4) packaging, with the distinction that MAX7324ATG+T is supplied in tape & reel format for automated assembly, while MAX7324ATG+ is supplied in tube format.

Q: Can I substitute MAX7324 parts on an existing PCB designed for TCA9534DBR? A: Substitution is possible only if the PCB footprint matches the selected MAX7324 package format. TCA9534DBR uses a specific package type; verify the footprint compatibility with the chosen substitute part's package specification before implementation.

Q: Do all substitute parts meet the same compliance standards as TCA9534DBR? A: Yes. All substitute parts are ROHS3 compliant and REACH unaffected, matching the compliance profile of the TCA9534DBR.

Q: Which substitute part should I select for high-volume production? A: MAX7324ATG+T is optimized for high-volume production due to tape & reel packaging, which supports automated pick-and-place assembly processes.