TCA0372DP2G Equivalent & Substitute Parts

Part Overview

The TCA0372DP2G is a power amplifier integrated circuit containing two independent circuits in a 16-pin DIP package. Manufactured by onsemi, this device is classified as a linear power amplifier suitable for applications requiring dual-channel amplification with moderate output current capability. The TCA0372DP2G is currently listed as obsolete, making identification of compatible substitute parts essential for design continuity and procurement planning. The primary substitute maintains identical electrical performance while offering alternative packaging and mounting technologies.

Substiute Parts

TCA0372DP2G

onsemiIn Stock: 20264TCA0372DP2G Datasheet

Current PartRFQ

TCA0372DWR2G

onsemiIn Stock: 38301TCA0372DWR2G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TCA0372DP2G is determined by equivalence in the following core electrical and functional parameters:

• Amplifier Type: Power amplifier classification
• Number of Circuits: Dual-channel configuration (2 circuits)
• Slew Rate: 1.4 V/µs
• Gain Bandwidth Product: 1.4 MHz
• Current - Input Bias: 100 nA
• Voltage - Input Offset: 1 mV
• Current - Output / Channel: 1 A per channel
• Voltage - Supply Span: 5 V to 40 V operating range
• Operating Temperature Range: -40°C to 125°C
• Base Product Number: TCA0372

The TCA0372DWR2G qualifies as a direct substitute because it maintains identical electrical specifications across all critical parameters. The primary difference is packaging format: the substitute uses surface-mount 16-SOIC technology instead of through-hole 16-DIP, and includes different supply current characteristics and moisture sensitivity ratings appropriate to its package type.

Parameter Comparison

Engineering Selection Recommendations

For Through-Hole PCB Designs: The TCA0372DP2G remains the appropriate choice if the circuit board layout requires through-hole mounting technology. However, given the obsolete status of this part, long-term availability is limited. Procurement should prioritize existing inventory or consider design migration to surface-mount technology.

For Surface-Mount PCB Designs or New Designs: The TCA0372DWR2G is the recommended substitute. This part is currently in active production status, ensuring long-term availability and supply chain stability. The electrical performance is functionally equivalent across all critical amplifier specifications. The surface-mount 16-SOIC package provides improved thermal characteristics and reduced board space compared to the through-hole DIP package.

Compliance Considerations: The TCA0372DWR2G carries ROHS3 compliance certification, making it suitable for applications subject to RoHS directives. Both parts maintain REACH Unaffected status and EAR99 export classification. The substitute part's lower supply current (5 mA versus 8 mA) may provide marginal power efficiency benefits in battery-powered or power-constrained applications.

Packaging and Handling: The TCA0372DWR2G requires moisture-controlled storage (MSL 3, 168 hours), whereas the TCA0372DP2G has unlimited moisture tolerance (MSL 1). This difference affects storage and handling procedures but does not impact electrical performance or functional compatibility.

Frequently Asked Questions (FAQ)

Q: Can the TCA0372DWR2G directly replace the TCA0372DP2G in an existing through-hole PCB design?

A: No. The TCA0372DWR2G uses surface-mount 16-SOIC packaging, while the TCA0372DP2G uses through-hole 16-DIP packaging. Direct PCB substitution is not possible without circuit board redesign. However, the electrical specifications are identical, so the substitute can be used in new designs or redesigned boards.

Q: Are the electrical specifications identical between these two parts?

A: Yes. Both parts share identical specifications for slew rate (1.4 V/µs), gain bandwidth product (1.4 MHz), input bias current (100 nA), input offset voltage (1 mV), output current per channel (1 A), and supply voltage range (5 V to 40 V). Operating temperature range is also identical (-40°C to 125°C).

Q: What is the significance of the different supply current values (8 mA vs. 5 mA)?

A: The supply current difference reflects the different package technologies and manufacturing processes. The surface-mount TCA0372DWR2G exhibits lower quiescent current consumption, which may provide minor power efficiency improvements in applications with strict power budgets.

Q: Why is the TCA0372DP2G listed as obsolete?

A: The TCA0372DP2G is an older through-hole technology product. onsemi has transitioned this product line to surface-mount packaging (TCA0372DWR2G), which is now in active production. Obsolete status indicates that the through-hole version is no longer manufactured.

Q: Does the moisture sensitivity level difference affect performance?

A: No. Moisture sensitivity level (MSL) affects storage, handling, and reflow soldering procedures, not electrical performance or functional operation. The TCA0372DWR2G (MSL 3) requires controlled storage conditions, while the TCA0372DP2G (MSL 1) has no moisture restrictions.

Q: Are both parts suitable for industrial temperature applications?

A: Yes. Both parts operate across the full industrial temperature range of -40°C to 125°C, making them suitable for industrial, automotive, and harsh environment applications.

Q: What is the pin count and configuration for both parts?

A: Both parts contain 16 pins. The TCA0372DP2G uses a 16-pin DIP package with 0.300" (7.62mm) body width. The TCA0372DWR2G uses a 16-pin SOIC package with 0.295" (7.50mm) body width. Pin configurations are functionally equivalent.