TAP337K010HSB Equivalent & Substitute Parts

Part Overview

The TAP337K010HSB is a 330 µF conformal coated tantalum capacitor rated at 10 V with radial through-hole mounting. Manufactured by KYOCERA AVX, this component is designed for general-purpose applications requiring reliable energy storage in compact form factors. The part maintains Active product status with full RoHS3 compliance and REACH unaffected designation. Substitute parts may be required due to inventory constraints, lead time considerations, or specific application requirements while maintaining electrical and mechanical compatibility.

Substiute Parts

TAP337K010HSB

KYOCERA AVXIn Stock: 789TAP337K010HSB Datasheet

Current PartRFQ

TAP337K010CCS

KYOCERA AVXIn Stock: 2515TAP337K010CCS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the TAP337K010HSB is determined by strict equivalence across the following critical parameters:

• Capacitance value: 330 µF (exact match required)
• Voltage rating: 10 V (exact match required)
• Tolerance: ±10% (exact match required)
• Type: Conformal Coated (exact match required)
• ESR: 500 mOhm (exact match required)
• Operating temperature range: -55°C to 125°C (exact match required)
• Lifetime specification: 1000 Hrs @ 85°C (exact match required)
• Mounting type: Through Hole (exact match required)
• Package: Radial (exact match required)
• Regulatory compliance: RoHS3 Compliant, REACH Unaffected (exact match required)

The TAP337K010CCS qualifies as a direct substitute based on full alignment with all electrical and mechanical parameters. Minor variations in lead spacing (0.197" vs 0.250") represent the only dimensional difference and do not affect functional equivalence in applications designed for radial through-hole tantalum capacitors.

Parameter Comparison

Engineering Selection Recommendations

Both TAP337K010HSB and TAP337K010CCS maintain Active product status with identical electrical specifications and full regulatory compliance. Selection between these parts should be based on:

• Lead spacing requirements: The TAP337K010HSB features 0.250" (6.35 mm) lead spacing, while the TAP337K010CCS provides 0.197" (5.00 mm) spacing. PCB layout and hole pattern design determine which spacing is appropriate for your application.
• Inventory availability: The TAP337K010CCS currently maintains higher stock levels (2438 Pcs) compared to the TAP337K010HSB (766 Pcs).
• Supply chain considerations: Both parts carry identical RoHS3 and REACH compliance certifications, ensuring regulatory equivalence across all markets.

Frequently Asked Questions (FAQ)

Q: Can TAP337K010CCS be used as a direct replacement for TAP337K010HSB?

A: Yes, provided your PCB design accommodates the 0.197" (5.00 mm) lead spacing of the TAP337K010CCS. All electrical parameters, thermal characteristics, and regulatory certifications are identical. If your PCB is designed for 0.250" (6.35 mm) spacing, physical modification or redesign is required.

Q: What is the significance of the lead spacing difference?

A: Lead spacing determines the distance between the two radial leads on the component. This dimension must match the hole pattern on your PCB. The TAP337K010HSB uses 0.250" spacing while the TAP337K010CCS uses 0.197" spacing. Mismatched spacing will prevent proper component insertion and soldering.

Q: Are there any electrical performance differences between these parts?

A: No. Both parts share identical capacitance (330 µF), voltage rating (10 V), tolerance (±10%), ESR (500 mOhm), operating temperature range (-55°C to 125°C), and lifetime specification (1000 Hrs @ 85°C).

Q: Do both parts meet the same compliance standards?

A: Yes. Both TAP337K010HSB and TAP337K010CCS are RoHS3 Compliant and REACH Unaffected, ensuring equivalent regulatory status for all applications and markets.

Q: What should I verify before substituting these parts?

A: Confirm that your PCB layout accommodates the lead spacing of your selected part. All other parameters are equivalent, so no additional electrical or thermal verification is required.