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T89C51CC02UA-SITIM Equivalent & Substitute Parts
Part Overview
The T89C51CC02UA-SITIM is an 80C51-based 8-bit microcontroller manufactured by Microchip Technology, featuring 16KB FLASH program memory, 2KB EEPROM, and 512 bytes of RAM. This device integrates CANbus and UART/USART connectivity with a 40MHz operating frequency in a 28-PLCC surface mount package. The part is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and new design implementations.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Technology |
| Core Processor | 80C51 |
| Core Size | 8-Bit |
| Speed | 40MHz |
| Program Memory Size | 16KB (16K x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | 2K x 8 |
| RAM Size | 512 x 8 |
| Voltage Supply (Vcc/Vdd) | 3V ~ 5.5V |
| Connectivity | CANbus, UART/USART |
| Peripherals | POR, PWM, WDT |
| Number of I/O | 20 |
| Data Converters | A/D 8x10b |
| Oscillator Type | External |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 28-LCC (J-Lead) |
| Supplier Device Package | 28-PLCC (11.51x11.51) |
Substitute Part Grouping Explanation
Substitute parts for the T89C51CC02UA-SITIM are identified based on strict electrical and mechanical parameter matching. The following criteria determine substitution eligibility:
Core Substitution Parameters:
- Identical core processor architecture (80C51)
- Matching core size (8-Bit)
- Identical operating frequency (40MHz)
- Identical program memory configuration (16KB FLASH)
- Identical EEPROM capacity (2K x 8)
- Identical RAM capacity (512 x 8)
- Matching voltage supply range (3V ~ 5.5V)
- Identical connectivity interfaces (CANbus, UART/USART)
- Identical peripheral set (POR, PWM, WDT)
- Matching I/O count (20)
- Identical data converter specification (A/D 8x10b)
- Identical package type (28-PLCC, 28-LCC J-Lead)
- Matching operating temperature range (-40°C ~ 85°C)
The substitute parts AT89C51CC02CA-SISUM and AT89C51CC02UA-SISUM meet all electrical and mechanical parameters required for direct substitution. Differences exist only in product status, RoHS compliance, and packaging format (Tube vs. unspecified for main part).
Parameter Comparison
| Parameter | T89C51CC02UA-SITIM | AT89C51CC02CA-SISUM | AT89C51CC02UA-SISUM |
|---|---|---|---|
| Manufacturer | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Processor | 80C51 | 80C51 | 80C51 |
| Core Size | 8-Bit | 8-Bit | 8-Bit |
| Speed | 40MHz | 40MHz | 40MHz |
| Program Memory Size | 16KB (16K x 8) | 16KB (16K x 8) | 16KB (16K x 8) |
| Program Memory Type | FLASH | FLASH | FLASH |
| EEPROM Size | 2K x 8 | 2K x 8 | 2K x 8 |
| RAM Size | 512 x 8 | 512 x 8 | 512 x 8 |
| Voltage Supply (Vcc/Vdd) | 3V ~ 5.5V | 3V ~ 5.5V | 3V ~ 5.5V |
| Connectivity | CANbus, UART/USART | CANbus, UART/USART | CANbus, UART/USART |
| Peripherals | POR, PWM, WDT | POR, PWM, WDT | POR, PWM, WDT |
| Number of I/O | 20 | 20 | 20 |
| Data Converters | A/D 8x10b | A/D 8x10b | A/D 8x10b |
| Oscillator Type | External | External | External |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | 28-LCC (J-Lead) | 28-LCC (J-Lead) | 28-LCC (J-Lead) |
| Supplier Device Package | 28-PLCC (11.51x11.51) | 28-PLCC (11.51x11.51) | 28-PLCC (11.51x11.51) |
| Product Status | Obsolete | Active | Active |
| RoHS Status | RoHS non-compliant | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 2 (1 Year) | 3 (168 Hours) | 3 (168 Hours) |
Engineering Selection Recommendations
Both AT89C51CC02CA-SISUM and AT89C51CC02UA-SISUM are functionally equivalent substitutes for the obsolete T89C51CC02UA-SITIM based on complete electrical and mechanical parameter alignment.
AT89C51CC02CA-SISUM is classified as Active product status with ROHS3 compliance verification. This part carries DiGi-Electronics Programmable verification status.
AT89C51CC02UA-SISUM is classified as Active product status with ROHS3 compliance. This part does not carry DiGi-Electronics Programmable verification status.
Both substitute parts exhibit higher moisture sensitivity levels (MSL 3, 168 Hours) compared to the main part (MSL 2, 1 Year), requiring appropriate handling and storage protocols during component management.
Frequently Asked Questions (FAQ)
Q: Can AT89C51CC02CA-SISUM and AT89C51CC02UA-SISUM be used interchangeably with T89C51CC02UA-SITIM?
A: Yes. Both substitute parts match all electrical and mechanical parameters of the main part, including processor architecture, memory configuration, operating frequency, voltage supply range, connectivity interfaces, peripheral set, I/O count, package type, and operating temperature range.
Q: What are the differences between the substitute parts?
A: AT89C51CC02CA-SISUM carries DiGi-Electronics Programmable verification status, while AT89C51CC02UA-SISUM does not. Both are Active products with ROHS3 compliance. Moisture sensitivity levels are identical between the two substitutes (MSL 3, 168 Hours).
Q: Why is the main part classified as obsolete?
A: The T89C51CC02UA-SITIM is marked as obsolete. The substitute parts AT89C51CC02CA-SISUM and AT89C51CC02UA-SISUM are Active products, ensuring ongoing availability and support.
Q: Are there package compatibility considerations?
A: Both substitute parts use identical package specifications: 28-PLCC (11.51x11.51) with 28-LCC (J-Lead) case type. Direct PCB footprint compatibility is maintained.
Q: What is the impact of different RoHS compliance status?
A: The main part is RoHS non-compliant, while both substitute parts are ROHS3 compliant. This affects material composition and environmental regulatory compliance for new designs and manufacturing processes.
Q: How do moisture sensitivity levels affect component handling?
A: The main part has MSL 2 (1 Year shelf life), while substitutes have MSL 3 (168 Hours shelf life). Substitutes require more stringent moisture control during storage and require baking before reflow soldering if exposed to ambient humidity for extended periods.
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