Equivalent & Substitute Parts for T89C51CC02CA-SISIM

Part Overview

The T89C51CC02CA-SISIM is an 8-bit microcontroller from Microchip Technology's AT89C CAN series, featuring a 40MHz 80C51 core with 16KB FLASH program memory, 2KB EEPROM, and 512 bytes of RAM. This device integrates CANbus and UART/USART connectivity with peripheral support for Power-On Reset (POR), Pulse Width Modulation (PWM), and Watchdog Timer (WDT) functions.

The T89C51CC02CA-SISIM is classified as obsolete. Identifying equivalent substitute parts ensures design continuity and supply chain reliability for applications requiring compatible 80C51-based microcontroller functionality.

Key Parameters

Parameter	Value
Core Processor	80C51
Core Size	8-Bit
Speed	40MHz
Program Memory Size	16KB (16K x 8)
Program Memory Type	FLASH
EEPROM Size	2K x 8
RAM Size	512 x 8
Voltage Supply (Vcc/Vdd)	3V ~ 5.5V
Data Converters	A/D 8x10b
Connectivity	CANbus, UART/USART
Peripherals	POR, PWM, WDT
Number of I/O	20
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package / Case	28-LCC (J-Lead)
Supplier Device Package	28-PLCC (11.51x11.51)

Substitute Part Grouping Explanation

Substitution eligibility for the T89C51CC02CA-SISIM is determined by strict equivalence across the following critical parameters:

Core Architecture & Memory Configuration:

80C51 core processor
8-bit core size
40MHz operating speed
16KB FLASH program memory (16K x 8)
2KB EEPROM (2K x 8)
512 bytes RAM (512 x 8)

Electrical & Functional Specifications:

Voltage supply range: 3V ~ 5.5V
8x10-bit analog-to-digital converter
CANbus and UART/USART connectivity
Peripheral support: POR, PWM, WDT
20 I/O pins

Physical & Environmental Requirements:

Surface mount technology
28-LCC (J-Lead) package / 28-PLCC (11.51x11.51) footprint
Operating temperature: -40°C ~ 85°C

The identified substitute parts AT89C51CC02CA-SISUM and AT89C51CC02UA-SISUM maintain identical electrical, functional, and physical specifications. Differences in product status, RoHS compliance, and moisture sensitivity level do not affect functional interchangeability.

Parameter Comparison

Parameter	T89C51CC02CA-SISIM	AT89C51CC02CA-SISUM	AT89C51CC02UA-SISUM
Manufacturer	Microchip Technology	Microchip Technology	Microchip Technology
Series	AT89C CAN	AT89C CAN	AT89C CAN
Core Processor	80C51	80C51	80C51
Core Size	8-Bit	8-Bit	8-Bit
Speed	40MHz	40MHz	40MHz
Program Memory Size	16KB (16K x 8)	16KB (16K x 8)	16KB (16K x 8)
Program Memory Type	FLASH	FLASH	FLASH
EEPROM Size	2K x 8	2K x 8	2K x 8
RAM Size	512 x 8	512 x 8	512 x 8
Voltage Supply (Vcc/Vdd)	3V ~ 5.5V	3V ~ 5.5V	3V ~ 5.5V
Data Converters	A/D 8x10b	A/D 8x10b	A/D 8x10b
Connectivity	CANbus, UART/USART	CANbus, UART/USART	CANbus, UART/USART
Peripherals	POR, PWM, WDT	POR, PWM, WDT	POR, PWM, WDT
Number of I/O	20	20	20
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount	Surface Mount	Surface Mount
Package / Case	28-LCC (J-Lead)	28-LCC (J-Lead)	28-LCC (J-Lead)
Supplier Device Package	28-PLCC (11.51x11.51)	28-PLCC (11.51x11.51)	28-PLCC (11.51x11.51)
Product Status	Obsolete	Active	Active
RoHS Status	RoHS non-compliant	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	2 (1 Year)	3 (168 Hours)	3 (168 Hours)
REACH Status	REACH Unaffected	REACH Unaffected	REACH Unaffected

Engineering Selection Recommendations

Both AT89C51CC02CA-SISUM and AT89C51CC02UA-SISUM are functionally equivalent substitutes for the obsolete T89C51CC02CA-SISIM across all electrical, memory, connectivity, and physical specifications.

AT89C51CC02CA-SISUM is classified as active product status with ROHS3 compliance and verified programmability through DiGi-Electronics. This part is supplied in tube packaging with 853 units in current inventory.

AT89C51CC02UA-SISUM is classified as active product status with ROHS3 compliance. Programmability verification status is not confirmed. This part is supplied in tube packaging with 1293 units in current inventory.

Both substitutes meet REACH compliance requirements. The primary differentiators are product availability, packaging format, and regulatory compliance certifications. Selection between these two substitutes should be based on supply chain requirements, compliance mandates for the end application, and inventory availability.

Frequently Asked Questions (FAQ)

Q: Are AT89C51CC02CA-SISUM and AT89C51CC02UA-SISUM functionally interchangeable with T89C51CC02CA-SISIM?

A: Yes. Both substitute parts maintain identical core processor architecture, memory configuration (16KB FLASH, 2KB EEPROM, 512 bytes RAM), operating speed (40MHz), voltage supply range (3V ~ 5.5V), connectivity (CANbus, UART/USART), peripheral support (POR, PWM, WDT), I/O count (20 pins), and package specifications (28-LCC / 28-PLCC 11.51x11.51).

Q: What is the difference between the two substitute parts?

A: AT89C51CC02CA-SISUM and AT89C51CC02UA-SISUM differ in product status (both active), RoHS compliance (both ROHS3 compliant), moisture sensitivity level (both MSL 3 / 168 Hours), and programmability verification status. Both are electrically and functionally identical.

Q: Why is the original part T89C51CC02CA-SISIM classified as obsolete?

A: The T89C51CC02CA-SISIM is marked as obsolete by the manufacturer. Active substitute parts with identical specifications are available to ensure design continuity and supply chain reliability.

Q: Are there any package or pinout differences between these parts?

A: No. All three parts use identical 28-LCC (J-Lead) package configuration with 28-PLCC (11.51x11.51) footprint and 20 I/O pins.

Q: What is the difference in RoHS compliance between the original and substitute parts?

A: The original T89C51CC02CA-SISIM is RoHS non-compliant. Both substitute parts (AT89C51CC02CA-SISUM and AT89C51CC02UA-SISUM) are ROHS3 compliant, meeting current environmental and regulatory requirements.

Q: Does moisture sensitivity level affect functional performance?

A: Moisture sensitivity level (MSL) specifies storage and handling requirements. The original part has MSL 2 (1 Year floor life), while substitutes have MSL 3 (168 Hours floor life). This affects component storage protocols but does not impact electrical or functional performance once properly handled and soldered.

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