T520D157M008ASE025 Equivalent & Substitute Parts

Part Overview

The T520D157M008ASE025 is a 150 µF molded tantalum polymer capacitor rated at 8 V, manufactured by KEMET as part of the KO-CAP® T520 series. This component is designed for surface mount applications in the 2917 (7343 Metric) package format with an ESR of 25 mOhm @ 100 kHz.

The T520D157M008ASE025 carries an Obsolete product status. Locating direct equivalents or suitable substitutes is necessary for ongoing production support, design updates, or component replenishment when original stock becomes unavailable.

Substiute Parts

T520D157M008ASE025

KEMETIn Stock: 750T520D157M008ASE025 Datasheet

Current PartRFQ

T520D157M008ATE025

KEMETIn Stock: 886T520D157M008ATE025 Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the T520D157M008ASE025 is determined by strict equivalence across the following critical parameters:

• Capacitance Value: 150 µF (exact match required)
• Voltage Rating: 8 V (exact match required)
• Package Format: 2917 (7343 Metric) (exact match required)
• ESR Specification: 25 mOhm @ 100 kHz (exact match required)
• Mounting Type: Surface Mount (exact match required)
• Operating Temperature Range: -55°C ~ 105°C (exact match required)
• Type: Molded Tantalum Polymer (exact match required)

The primary substitute identified is T520D157M008ATE025, which maintains identical electrical and mechanical specifications while differing only in packaging format (Tape & Reel versus bulk) and product status (Active versus Obsolete).

Parameter Comparison

Engineering Selection Recommendations

The T520D157M008ATE025 is the direct functional equivalent of the T520D157M008ASE025. Both components share identical electrical performance, thermal characteristics, and physical dimensions. The substitute part is preferred for new designs and ongoing production due to its Active product status and ROHS3 compliance certification.

The primary distinction between the two parts is packaging format: the main part is supplied in bulk configuration, while the substitute is supplied in Tape & Reel format. This difference does not affect electrical or mechanical compatibility in circuit applications.

For applications requiring RoHS compliance, the T520D157M008ATE025 is the appropriate selection. For legacy systems or applications where RoHS non-compliant components are acceptable, either part may be used interchangeably provided electrical specifications remain within design tolerances.

Frequently Asked Questions (FAQ)

Q: Can T520D157M008ATE025 be used as a direct replacement for T520D157M008ASE025?

A: Yes. Both parts are electrically and mechanically identical. They share the same capacitance (150 µF), voltage rating (8 V), ESR (25 mOhm @ 100 kHz), package format (2917/7343 Metric), and operating temperature range (-55°C ~ 105°C). The only differences are packaging format (Tape & Reel versus bulk) and product status (Active versus Obsolete).

Q: What is the difference between the packaging formats?

A: T520D157M008ASE025 is supplied in bulk packaging, while T520D157M008ATE025 is supplied in Tape & Reel (TR) format. Tape & Reel packaging is standard for automated assembly processes. Bulk packaging is typically used for manual assembly or lower-volume applications. The components themselves are identical.

Q: Does the RoHS compliance difference affect circuit performance?

A: No. RoHS compliance is a regulatory and material composition designation, not an electrical performance specification. Both parts meet the same electrical and thermal requirements. The T520D157M008ATE025 is ROHS3 compliant, making it suitable for applications subject to RoHS regulations.

Q: Are the physical dimensions identical?

A: Yes. Both parts are housed in the 2917 (7343 Metric) package with dimensions of 0.287" L x 0.169" W (7.30mm x 4.30mm) and a maximum seated height of 0.122" (3.10mm). They are footprint-compatible on PCBs designed for either part.

Q: What is the MSL rating and why does it matter?

A: Both parts carry an MSL rating of 3 (168 Hours). This indicates the component can be exposed to ambient conditions of 30°C / 85% RH for up to 168 hours before soldering. Proper moisture handling during storage and assembly is required to prevent solder joint defects.