Equivalent & Substitute Parts for T110D107M020AS

Part Overview

The T110D107M020AS is a 100 µF hermetically sealed tantalum capacitor rated at 20 V with axial through-hole mounting. This component is classified as active and available in bulk packaging. Hermetically sealed tantalum capacitors are used in applications requiring high reliability and stable performance across extended temperature ranges. Alternative models may be required due to inventory constraints, design revisions, or specific compliance requirements for end applications.

Substiute Parts

T110D107M020AS

KEMETIn Stock: 709T110D107M020AS Datasheet

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T322F107K020AT

KEMETIn Stock: 953T322F107K020AT Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the T110D107M020AS is permissible with components that maintain electrical equivalence across the following critical parameters:

• Capacitance Value: 100 µF (exact match required)
• Voltage Rating: 20 V (minimum, equal or higher acceptable)
• ESR: 600 mOhm (electrical performance equivalence)
• Operating Temperature Range: -55°C to 125°C (minimum coverage required)
• Mounting Configuration: Through-hole axial package (mechanical compatibility)

The T322F107K020AT qualifies as a substitute based on these criteria. While the encapsulation type differs (molded versus hermetically sealed), the electrical parameters and mechanical form factor remain compatible for standard applications. Tolerance variation (±10% versus ±20%) represents an improvement in precision.

Parameter Comparison

Engineering Selection Recommendations

T110D107M020AS Selection Criteria:

• Applications requiring hermetically sealed construction for enhanced moisture protection
• Legacy designs or systems already qualified with hermetically sealed tantalum capacitors
• Environments where hermeticity is a specified requirement

T322F107K020AT Selection Criteria:

• New designs or design revisions where RoHS3 compliance is mandatory
• Applications where improved tolerance (±10%) provides circuit performance benefits
• Space-constrained PCB layouts where the smaller physical footprint (0.300" Dia x 0.710" L) is advantageous
• General-purpose applications where molded encapsulation meets reliability requirements

Both components share identical electrical performance (100 µF, 20 V, 600 mOhm ESR) and thermal operating range. The primary differentiation is encapsulation type and regulatory compliance status. Selection should be based on specific application requirements and compliance mandates.

Frequently Asked Questions (FAQ)

Q: Can T322F107K020AT directly replace T110D107M020AS in existing designs?

A: Electrical substitution is valid. Both components provide 100 µF capacitance at 20 V with 600 mOhm ESR. Physical dimensions differ slightly; verify PCB layout clearances. The primary consideration is encapsulation type: hermetically sealed versus molded. For applications where hermeticity is specified, substitution requires design review.

Q: What is the significance of the tolerance difference (±20% versus ±10%)?

A: The T322F107K020AT offers tighter tolerance, resulting in more predictable capacitance values across production batches. This is advantageous for circuits with tight capacitance specifications. The T110D107M020AS with ±20% tolerance is acceptable for general-purpose filtering and energy storage applications where wider tolerance is tolerable.

Q: Are there physical installation differences?

A: Both components use through-hole axial mounting. The T322F107K020AT is physically smaller (0.300" Dia x 0.710" L versus 0.351" Dia x 0.786" L). Verify that PCB hole spacing and component clearances accommodate the substitute. The smaller size typically presents no installation obstacles and may provide layout advantages.

Q: What does RoHS3 compliance mean for the T322F107K020AT?

A: RoHS3 compliance indicates the component meets current Restriction of Hazardous Substances regulations. The T110D107M020AS is RoHS non-compliant. For applications subject to RoHS requirements or end-market regulations, the T322F107K020AT is the appropriate selection.

Q: Are both components suitable for the same temperature range?

A: Yes. Both components operate across -55°C to 125°C. Thermal performance is equivalent, and either component is suitable for applications within this temperature specification.

Q: What is the difference between hermetically sealed and molded encapsulation?

A: Hermetically sealed encapsulation (T110D107M020AS) provides superior moisture barrier properties through glass-to-metal sealing. Molded encapsulation (T322F107K020AT) uses epoxy or similar material. For standard industrial and commercial applications, molded construction is functionally equivalent. Hermetically sealed construction is preferred in high-reliability, high-humidity, or aerospace applications.