SY89296UTI-TR Equivalent & Substitute Parts

Part Overview

The SY89296UTI-TR is a programmable delay line IC manufactured by Microchip Technology, featuring 1024 taps with a delay range of 3.2ns to 14.8ns in a 32-TQFP surface mount package. This component is discontinued at DiGi Electronics, necessitating identification of functionally equivalent alternatives for ongoing design requirements and production needs.

Substiute Parts

SY89296UTI-TR
Microchip TechnologyIn Stock: 1043SY89296UTI-TR Datasheet
SY89296UTI-TR
Current Part
MC100EP196FAG
onsemiIn Stock: 1417MC100EP196FAG Datasheet
MC100EP196FAG
MFR Recommended
MC100EP196FAR2G
onsemiIn Stock: 2132MC100EP196FAR2G Datasheet
MC100EP196FAR2G
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number SY89296UTI-TR
Manufacturer Microchip Technology
Category Clock/Timing
Number of Taps/Steps 1024
Function Programmable
Delay to 1st Tap 3.2ns
Tap Increment 10 ps
Available Total Delays 3.2ns ~ 14.8ns
Number of Independent Delays 1
Voltage - Supply 2.375V ~ 3.6V
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 32-TQFP
Product Status Discontinued at DiGi Electronics
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitute parts for the SY89296UTI-TR are identified based on the following critical parameters that determine functional equivalence:

  • Number of Taps/Steps: 1024 (exact match required)
  • Function: Programmable (exact match required)
  • Tap Increment: 10 ps (exact match required)
  • Number of Independent Delays: 1 (exact match required)
  • Operating Temperature Range: -40°C ~ 85°C (exact match required)
  • Mounting Type: Surface Mount (exact match required)
  • Package Type: 32-pin QFP variant (TQFP or LQFP acceptable)

The identified substitutes are onsemi MC100EP196FAG and MC100EP196FAR2G, both from the 100EP series. These parts maintain identical tap configuration, programmable function, tap increment, and operating temperature specifications. Package variants (32-LQFP vs. 32-TQFP) are mechanically compatible within the same footprint class, with pin-to-pin compatibility for the specified application.

Parameter Comparison

Parameter SY89296UTI-TR MC100EP196FAG MC100EP196FAR2G
Manufacturer Microchip Technology onsemi onsemi
Number of Taps/Steps 1024 1024 1024
Function Programmable Programmable Programmable
Delay to 1st Tap 3.2ns 2.36ns 2.36ns
Tap Increment 10 ps 10 ps 10 ps
Available Total Delays 3.2ns ~ 14.8ns 2.36ns ~ 12.258ns 2.36ns ~ 12.258ns
Number of Independent Delays 1 1 1
Voltage - Supply 2.375V ~ 3.6V 3V ~ 3.6V 3V ~ 3.6V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 32-TQFP (7x7) 32-LQFP (7x7) 32-LQFP (7x7)
Product Status Discontinued at DiGi Electronics Active Active
RoHS Status RoHS non-compliant ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 2 (1 Year) 2 (1 Year)
Packaging Tape & Reel (TR) Tray Tape & Reel (TR)

Engineering Selection Recommendations

Both MC100EP196FAG and MC100EP196FAR2G are active products with ROHS3 compliance, addressing regulatory requirements that the discontinued SY89296UTI-TR does not meet. The onsemi 100EP series maintains functional equivalence across all critical delay line parameters.

MC100EP196FAR2G is supplied in Tape & Reel packaging, matching the original SY89296UTI-TR format and supporting automated assembly processes. MC100EP196FAG is supplied in Tray packaging, suitable for manual or alternative handling workflows.

The MC100EP series exhibits improved moisture sensitivity characteristics (MSL 2 vs. MSL 3), reducing storage and handling constraints. Supply voltage range for the onsemi substitutes (3V ~ 3.6V) is narrower than the original part (2.375V ~ 3.6V), requiring verification that system supply voltages remain within the 3V to 3.6V window.

Frequently Asked Questions (FAQ)

Q: Are MC100EP196FAG and MC100EP196FAR2G pin-compatible with SY89296UTI-TR?

A: Both substitute parts use 32-pin QFP packages (LQFP variant) with 7x7mm footprints, matching the original 32-TQFP package. Pin assignments for delay line ICs in this category are standardized across TQFP and LQFP variants of equivalent tap configurations, supporting direct substitution at the PCB level.

Q: What is the difference between MC100EP196FAG and MC100EP196FAR2G?

A: Both parts are functionally identical onsemi MC100EP196 delay line ICs. The primary difference is packaging format: MC100EP196FAG is supplied in Tray, while MC100EP196FAR2G is supplied in Tape & Reel (TR). Selection depends on assembly process requirements and inventory handling procedures.

Q: Does the narrower supply voltage range of the onsemi substitutes affect compatibility?

A: The MC100EP196 series operates within 3V to 3.6V, compared to the SY89296UTI-TR range of 2.375V to 3.6V. Substitution is valid only if system supply voltages remain within the 3V to 3.6V specification. Applications requiring operation below 3V require alternative solutions.

Q: What are the implications of the different delay ranges?

A: The SY89296UTI-TR provides delays from 3.2ns to 14.8ns, while MC100EP196 variants provide 2.36ns to 12.258ns. The onsemi parts offer lower minimum delay but reduced maximum delay. Substitution is valid for applications requiring delays within the 3.2ns to 12.258ns overlap range.

Q: How do the RoHS compliance differences impact selection?

A: The SY89296UTI-TR is RoHS non-compliant, while both MC100EP196 variants are ROHS3 compliant. For applications subject to RoHS regulations or customer requirements, the onsemi substitutes provide regulatory compliance. For legacy systems without RoHS mandates, either part is functionally acceptable.

Q: What are the storage and handling differences related to MSL ratings?

A: The SY89296UTI-TR has MSL 3 (168 hours), requiring reflow within 168 hours of moisture exposure. MC100EP196 variants have MSL 2 (1 year), allowing extended storage and handling windows. The improved MSL rating reduces production scheduling constraints and moisture-related defect risk.

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