STTH30L06D Equivalent & Substitute Parts

Part Overview

The STTH30L06D is a general-purpose rectifier diode manufactured by STMicroelectronics, rated for 600 V DC reverse voltage and 30 A average rectified current in a through-hole TO-220AC package. This part is classified as obsolete, necessitating identification of active equivalent and substitute components for new designs and ongoing production requirements. The diode features fast recovery characteristics with a reverse recovery time of 90 ns, suitable for standard rectification applications requiring moderate switching speeds.

Key Parameters

Parameter	Value	Unit
Voltage - DC Reverse (Vr) (Max)	600	V
Current - Average Rectified (Io)	30	A
Voltage - Forward (Vf) (Max) @ If	1.55	V @ 30 A
Reverse Recovery Time (trr)	90	ns
Current - Reverse Leakage @ Vr	25	µA @ 600 V
Speed Classification	Fast Recovery ≤ 500ns, > 200mA (Io)	-
Mounting Type	Through Hole	-
Package / Case	TO-220-2	-
Operating Temperature - Junction (Max)	175	°C
RoHS Status	ROHS3 Compliant	-

Substitute Part Grouping Explanation

Substitution of the STTH30L06D is determined by the following critical parameters:

Electrical Equivalence Criteria:

Voltage - DC Reverse (Vr) (Max): 600 V minimum
Current - Average Rectified (Io): 30 A minimum
Voltage - Forward (Vf) (Max) @ If: 1.55 V or lower at 30 A
Speed Classification: Fast Recovery ≤ 500ns, > 200mA (Io)

Mechanical Compatibility Criteria:

Mounting Type: Through Hole (for direct PCB replacement)
Package / Case: TO-220-2 or equivalent TO-220AC footprint

Compliance Criteria:

RoHS Status: ROHS3 Compliant
Operating Temperature - Junction: 175°C or higher

Substitute parts are grouped into two categories:

Category 1: Direct Electrical and Mechanical Equivalents (Through-Hole TO-220AC) Parts meeting all electrical parameters and maintaining through-hole TO-220AC mounting for direct PCB substitution without layout modification.

Category 2: Electrical Equivalents with Mounting Variation (Surface Mount) Parts meeting all electrical parameters but requiring PCB layout modification due to different mounting technology (surface mount vs. through-hole).

Category 3: Partial Electrical Equivalents (Current Rating Reduction) Parts meeting voltage and speed requirements but with reduced current ratings, suitable only for applications with lower current demands than the original 30 A specification.

Parameter Comparison

Parameter	STTH30L06D (Main)	BYV30-600PQ	STTH30L06G-TR	DSEP29-06A	VS-ETH1506-M3
Manufacturer	STMicroelectronics	WeEn Semiconductors	STMicroelectronics	IXYS	Vishay General Semiconductor
Product Status	Obsolete	Active	Active	Active	Active
Voltage - DC Reverse (Vr) (Max)	600 V	600 V	600 V	600 V	600 V
Current - Average Rectified (Io)	30 A	30 A	30 A	30 A	15 A
Voltage - Forward (Vf) (Max) @ If	1.55 V @ 30 A	1.55 V @ 30 A	1.55 V @ 30 A	1.61 V @ 30 A	2.45 V @ 15 A
Reverse Recovery Time (trr)	90 ns	75 ns	90 ns	35 ns	29 ns
Current - Reverse Leakage @ Vr	25 µA @ 600 V	10 µA @ 600 V	25 µA @ 600 V	250 µA @ 600 V	15 µA @ 600 V
Speed Classification	Fast Recovery ≤ 500ns, > 200mA (Io)	Fast Recovery ≤ 500ns, > 200mA (Io)	Fast Recovery ≤ 500ns, > 200mA (Io)	Fast Recovery ≤ 500ns, > 200mA (Io)	Fast Recovery ≤ 500ns, > 200mA (Io)
Mounting Type	Through Hole	Through Hole	Surface Mount	Through Hole	Through Hole
Package / Case	TO-220-2	TO-220-2	TO-263-3, D2PAK	TO-220-2	TO-220-2
Operating Temperature - Junction (Max)	175°C	175°C	175°C	175°C	175°C
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant

Engineering Selection Recommendations

For Direct Through-Hole TO-220AC Replacement (No PCB Layout Modification Required):

The BYV30-600PQ (WeEn Semiconductors) is the primary equivalent for the STTH30L06D. This part maintains identical electrical specifications (600 V, 30 A, 1.55 V forward voltage) and through-hole TO-220AC packaging. The BYV30-600PQ is active in production with ROHS3 compliance and demonstrates superior reverse leakage characteristics (10 µA vs. 25 µA), providing enhanced reliability. The reverse recovery time of 75 ns is faster than the original 90 ns specification, offering improved switching performance.

The DSEP29-06A (IXYS HiPerFRED™ series) is an alternative through-hole equivalent meeting the 600 V, 30 A electrical requirements. This part features significantly faster reverse recovery (35 ns) compared to the original specification, suitable for applications requiring enhanced switching speed. However, the forward voltage specification of 1.61 V is marginally higher, and reverse leakage of 250 µA is substantially elevated, requiring thermal management evaluation in high-temperature environments.

For Surface Mount Applications (PCB Layout Modification Required):

The STTH30L06G-TR (STMicroelectronics) provides electrical equivalence with identical specifications (600 V, 30 A, 1.55 V, 90 ns) in a surface-mount D2PAK package. This part is active in production and suitable for new designs utilizing surface-mount assembly processes. Direct footprint substitution from through-hole to surface mount requires PCB redesign.

For Current-Reduced Applications (15 A Maximum):

The VS-ETH1506-M3 (Vishay FRED Pt® series) is suitable only for applications with maximum current requirements of 15 A. This part meets the 600 V voltage specification and provides superior reverse recovery characteristics (29 ns). The forward voltage specification of 2.45 V at 15 A reflects the reduced current rating and is not directly comparable to 30 A specifications. This part is not suitable as a direct replacement for 30 A applications.

Compliance and Production Status:

All recommended active substitutes maintain ROHS3 compliance and unlimited moisture sensitivity level (MSL 1), ensuring compatibility with standard manufacturing and environmental requirements. Selection between BYV30-600PQ and DSEP29-06A depends on application-specific requirements for reverse recovery speed and leakage current characteristics.

Frequently Asked Questions (FAQ)

Q: Can the STTH30L06D be directly replaced with the BYV30-600PQ without PCB modification?

A: Yes. The BYV30-600PQ maintains identical electrical specifications (600 V, 30 A, 1.55 V forward voltage) and through-hole TO-220AC packaging, enabling direct PCB substitution without layout modification.

Q: What is the primary difference between the BYV30-600PQ and DSEP29-06A?

A: Both parts meet the 600 V, 30 A electrical requirements and through-hole TO-220AC packaging. The DSEP29-06A features faster reverse recovery (35 ns vs. 75 ns) but exhibits higher reverse leakage current (250 µA vs. 10 µA). Selection depends on application requirements for switching speed versus leakage current performance.

Q: Why is the STTH30L06G-TR listed as an equivalent if it uses surface-mount packaging?

A: The STTH30L06G-TR is an electrical equivalent with identical voltage, current, and speed specifications. However, it requires PCB layout modification due to D2PAK surface-mount packaging versus the through-hole TO-220AC of the original part. This part is suitable for new designs utilizing surface-mount assembly.

Q: Can the VS-ETH1506-M3 replace the STTH30L06D in all applications?

A: No. The VS-ETH1506-M3 is rated for 15 A maximum current, compared to the 30 A specification of the STTH30L06D. This part is suitable only for applications with current requirements of 15 A or lower. Using this part in 30 A applications will result in thermal stress and potential component failure.

Q: What does "Fast Recovery ≤ 500ns, > 200mA (Io)" mean?

A: This classification indicates the diode exhibits fast recovery characteristics with reverse recovery time not exceeding 500 nanoseconds when switching currents greater than 200 milliamps. All listed substitute parts meet this speed classification.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All active substitute parts listed (BYV30-600PQ, STTH30L06G-TR, DSEP29-06A, and VS-ETH1506-M3) are ROHS3 compliant, meeting environmental and regulatory requirements for new designs and production.

Q: What is the significance of reverse leakage current differences between substitute parts?

A: Reverse leakage current affects heat generation during reverse bias operation. Lower leakage (BYV30-600PQ at 10 µA) reduces thermal load, while higher leakage (DSEP29-06A at 250 µA) increases heat dissipation requirements. Application-specific thermal analysis determines acceptable leakage levels.

Q: Can I use the STTH30L06G-TR as a drop-in replacement for through-hole applications?

A: No. The STTH30L06G-TR uses D2PAK surface-mount packaging and cannot be directly installed in through-hole PCB footprints. PCB redesign is required to accommodate surface-mount assembly.

Q: What is the operating temperature range for substitute parts?

A: The STTH30L06D, BYV30-600PQ, and STTH30L06G-TR are rated to 175°C maximum junction temperature. The DSEP29-06A and VS-ETH1506-M3 support extended temperature ranges (-55°C to 175°C and -65°C to 175°C respectively), providing additional thermal margin in low-temperature environments.

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