STTH3002G Equivalent & Substitute Parts

Part Overview

The STTH3002G is a general-purpose rectifier diode manufactured by STMicroelectronics, rated for 200 V DC reverse voltage and 30 A average rectified current in a D2PAK surface mount package. This component is classified as obsolete, making identification of equivalent substitute parts necessary for ongoing design support and procurement continuity. The part features fast recovery characteristics with a 50 ns reverse recovery time and is RoHS3 compliant.

Substiute Parts

STTH3002G
STMicroelectronicsIn Stock: 5218STTH3002G Datasheet
STTH3002G
Current Part
APT30D20SG
Microchip TechnologyIn Stock: 753APT30D20SG Datasheet
APT30D20SG
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Key Parameters

Parameter Value
Voltage - DC Reverse (Vr) (Max) 200 V
Current - Average Rectified (Io) 30 A
Voltage - Forward (Vf) (Max) @ If 1.05 V @ 30 A
Speed Classification Fast Recovery ≤ 500 ns, > 200 mA (Io)
Reverse Recovery Time (trr) 50 ns
Current - Reverse Leakage @ Vr 20 µA @ 200 V
Mounting Type Surface Mount
Package / Case TO-263-3, D2PAK (2 Leads + Tab)
Operating Temperature - Junction (Max) 175°C
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the STTH3002G is determined by matching the following critical electrical and mechanical parameters:

Electrical Matching Criteria:

  • Voltage - DC Reverse (Vr) (Max): 200 V minimum
  • Current - Average Rectified (Io): 30 A minimum
  • Speed Classification: Fast Recovery ≤ 500 ns, > 200 mA (Io)
  • Operating Temperature - Junction: 175°C maximum

Mechanical Matching Criteria:

  • Mounting Type: Surface Mount
  • Package compatibility: D2PAK or equivalent three-lead surface mount packages

The APT30D20SG from Microchip Technology meets these substitution criteria with identical voltage and current ratings, fast recovery speed classification, and compatible surface mount packaging in the D3PAK form factor. Both parts maintain RoHS3 compliance and are suitable for applications requiring 200 V, 30 A rectification.

Parameter Comparison

Parameter STTH3002G (STMicroelectronics) APT30D20SG (Microchip Technology)
Voltage - DC Reverse (Vr) (Max) 200 V 200 V
Current - Average Rectified (Io) 30 A 30 A
Voltage - Forward (Vf) (Max) @ If 1.05 V @ 30 A 1.3 V @ 30 A
Speed Classification Fast Recovery ≤ 500 ns, > 200 mA (Io) Fast Recovery ≤ 500 ns, > 200 mA (Io)
Reverse Recovery Time (trr) 50 ns 24 ns
Current - Reverse Leakage @ Vr 20 µA @ 200 V 250 µA @ 200 V
Mounting Type Surface Mount Surface Mount
Package / Case TO-263-3, D2PAK TO-268-3, D3PAK
Operating Temperature - Junction (Max) 175°C 175°C
RoHS Status ROHS3 Compliant ROHS3 Compliant
Product Status Obsolete Active

Engineering Selection Recommendations

The APT30D20SG is a direct functional substitute for the STTH3002G based on matching electrical ratings and fast recovery speed classification. The substitute part is currently in active production status, ensuring long-term availability and supply chain continuity compared to the obsolete STTH3002G.

Both parts maintain identical voltage and current specifications (200 V, 30 A) and are RoHS3 compliant. The APT30D20SG features a faster reverse recovery time (24 ns versus 50 ns) and lower maximum junction temperature operating range, which may provide performance advantages in specific applications. The forward voltage drop is higher in the substitute part (1.3 V versus 1.05 V at 30 A), and reverse leakage current is elevated (250 µA versus 20 µA at 200 V).

Package form factors differ between the two parts: the STTH3002G uses D2PAK (TO-263-3) while the APT30D20SG uses D3PAK (TO-268-3). Both are three-lead surface mount packages with similar thermal and electrical characteristics, though PCB layout modifications may be required to accommodate the different package footprints.

Frequently Asked Questions (FAQ)

Q: Can the APT30D20SG directly replace the STTH3002G without circuit modifications?

A: The APT30D20SG meets the core electrical requirements (200 V, 30 A, fast recovery) for functional substitution. However, the different package footprints (D2PAK versus D3PAK) require PCB layout changes. The higher forward voltage drop (1.3 V versus 1.05 V) and elevated reverse leakage current (250 µA versus 20 µA) should be evaluated in thermal and efficiency calculations for the specific application.

Q: What is the primary reason for seeking a substitute for the STTH3002G?

A: The STTH3002G is classified as obsolete. The APT30D20SG is an active product from Microchip Technology, ensuring continued availability and manufacturing support.

Q: Are both parts RoHS compliant?

A: Yes, both the STTH3002G and APT30D20SG are RoHS3 compliant and REACH unaffected.

Q: How do the package differences affect component selection?

A: The STTH3002G uses TO-263-3 (D2PAK) packaging while the APT30D20SG uses TO-268-3 (D3PAK) packaging. Both are three-lead surface mount packages with tab configurations. PCB footprint modifications are required when transitioning between these packages. Thermal performance characteristics are comparable between the two package types.

Q: What are the key electrical differences between these parts?

A: The primary electrical differences are forward voltage drop (1.05 V versus 1.3 V at 30 A), reverse recovery time (50 ns versus 24 ns), and reverse leakage current (20 µA versus 250 µA at 200 V). Voltage and current ratings are identical at 200 V and 30 A respectively.

Q: Is the faster reverse recovery time of the APT30D20SG beneficial?

A: The APT30D20SG features a 24 ns reverse recovery time compared to 50 ns for the STTH3002G. This faster recovery may reduce switching losses and improve efficiency in high-frequency rectification applications. Application-specific circuit analysis is necessary to determine if this performance difference provides measurable benefits.

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