STPS1545R Equivalent & Substitute Parts

Part Overview

The STPS1545R is a Schottky rectifier diode manufactured by STMicroelectronics, rated for 45 V DC reverse voltage and 15 A average rectified current. The device is packaged in a Through Hole I2PAK (TO-262-3 Long Leads) configuration and is classified as obsolete. Due to its obsolete product status, identification of equivalent substitute components is necessary for ongoing design support, maintenance, and production continuity. The STPS1545R remains in stock inventory with 1,171 pieces available as new original units.

Substiute Parts

STPS1545R
STMicroelectronicsIn Stock: 1201STPS1545R Datasheet
STPS1545R
Current Part
STPS15L45CB
STMicroelectronicsIn Stock: 2169STPS15L45CB Datasheet
STPS15L45CB
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Key Parameters

Parameter Value Unit
Manufacturer Part Number STPS1545R
Manufacturer STMicroelectronics
Category Diodes, Rectifiers
Technology Schottky
Voltage - DC Reverse (Vr) (Max) 45 V
Current - Average Rectified (Io) 15 A
Voltage - Forward (Vf) (Max) @ If 840 mV @ 30 A
Speed Fast Recovery ≤ 500 ns, > 200 mA (Io)
Current - Reverse Leakage @ Vr 200 µA @ 45 V
Mounting Type Through Hole
Package / Case TO-262-3 Long Leads, I2PAK, TO-262AA
Operating Temperature - Junction (Max) 175 °C
Product Status Obsolete
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the STPS1545R is determined by the following critical electrical and mechanical parameters:

Electrical Compatibility Criteria:

  • Voltage - DC Reverse (Vr) (Max): Substitute must equal or exceed 45 V
  • Current - Average Rectified (Io): Substitute must support the required current rating
  • Technology: Schottky diode technology maintained across substitutes
  • Speed: Fast Recovery characteristic (≤ 500 ns, > 200 mA) preserved

Mechanical Compatibility Criteria:

  • Mounting Type: Through Hole or Surface Mount configurations
  • Package / Case: Physical form factor and lead configuration
  • Operating Temperature - Junction: Thermal performance envelope

Regulatory & Compliance Criteria:

  • RoHS Status: ROHS3 Compliant maintained
  • Moisture Sensitivity Level: MSL 1 (Unlimited) preserved
  • REACH Status: REACH Unaffected maintained

The substitute part STPS15L45CB shares the same base product number (STPS15), identical reverse voltage rating (45 V), and equivalent Schottky technology. However, it operates as a diode array with 1 Pair Common Cathode configuration at 7.5 A per diode, uses Surface Mount packaging (DPAK), and is classified as Active product status.

Parameter Comparison

Parameter STPS1545R (Main Part) STPS15L45CB (Substitute) Compatibility Notes
Manufacturer STMicroelectronics STMicroelectronics Same manufacturer
Category Diodes, Rectifiers Diodes, Rectifiers Same category
Technology Schottky Schottky Identical technology
Voltage - DC Reverse (Vr) (Max) 45 V 45 V Identical rating
Current - Average Rectified (Io) 15 A 7.5 A per diode Substitute rated at 50% of main part current
Voltage - Forward (Vf) (Max) @ If 840 mV @ 30 A 520 mV @ 7.5 A Lower forward voltage in substitute
Speed Fast Recovery ≤ 500 ns, > 200 mA (Io) Fast Recovery ≤ 500 ns, > 200 mA (Io) Identical speed characteristic
Current - Reverse Leakage @ Vr 200 µA @ 45 V 1 mA @ 45 V Substitute exhibits higher leakage current
Mounting Type Through Hole Surface Mount Different mounting technology
Package / Case TO-262-3 Long Leads, I2PAK, TO-262AA TO-252-3, DPAK (2 Leads + Tab), SC-63 Different physical packages
Diode Configuration Single diode 1 Pair Common Cathode Substitute is diode array
Operating Temperature - Junction (Max) 175°C 150°C Main part rated 25°C higher
Product Status Obsolete Active Substitute is active product
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical compliance
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) Identical MSL rating

Engineering Selection Recommendations

Product Status Consideration: The STPS1545R is classified as obsolete, while the STPS15L45CB is an active product. Selection of the substitute part ensures access to ongoing manufacturing support, documented supply chains, and current quality assurance protocols from STMicroelectronics.

Compliance & Certification: Both the main part and substitute maintain ROHS3 compliance, MSL 1 (Unlimited) rating, and REACH Unaffected status. These regulatory alignments support seamless integration into compliant manufacturing and supply chain environments.

Current Rating Differential: The STPS15L45CB is rated at 7.5 A per diode within a common cathode pair configuration, compared to the STPS1545R single diode rated at 15 A. Applications requiring the full 15 A rating necessitate parallel connection of both diodes within the STPS15L45CB array or identification of alternative single-diode substitutes with equivalent current capacity.

Thermal Performance: The STPS1545R operates to a maximum junction temperature of 175°C, while the STPS15L45CB is rated to 150°C. Thermal design margins must account for this 25°C differential in maximum operating temperature.

Packaging & Mounting: The STPS1545R uses Through Hole I2PAK packaging, while the STPS15L45CB employs Surface Mount DPAK technology. PCB layout, assembly process, and mechanical mounting requirements differ significantly between these package types and require design revision.

Frequently Asked Questions (FAQ)

Q: Can the STPS15L45CB directly replace the STPS1545R in existing designs?

A: Direct replacement is not possible without design modification. The STPS15L45CB differs in mounting technology (Surface Mount vs. Through Hole), package form factor (DPAK vs. I2PAK), current rating per diode (7.5 A vs. 15 A), and diode configuration (array with common cathode vs. single diode). PCB layout, assembly process, and circuit topology require revision.

Q: What is the current capacity relationship between these parts?

A: The STPS1545R provides 15 A average rectified current as a single diode. The STPS15L45CB contains two Schottky diodes in a common cathode configuration, each rated at 7.5 A. Parallel connection of both diodes within the array yields a combined 15 A capacity, provided the common cathode configuration permits such application.

Q: Are the reverse voltage ratings equivalent?

A: Yes. Both the STPS1545R and STPS15L45CB are rated for 45 V DC reverse voltage (Vr). This parameter is identical across both components.

Q: What are the key differences in forward voltage characteristics?

A: The STPS1545R exhibits a maximum forward voltage of 840 mV at 30 A, while the STPS15L45CB shows 520 mV at 7.5 A. Forward voltage varies with current density; direct comparison at different current levels requires reference to detailed device datasheets.

Q: How do the thermal ratings compare?

A: The STPS1545R is rated to a maximum junction temperature of 175°C, while the STPS15L45CB is rated to 150°C. Thermal design calculations must account for this 25°C difference in maximum operating temperature envelope.

Q: Are both parts RoHS compliant?

A: Yes. Both the STPS1545R and STPS15L45CB are ROHS3 Compliant and maintain REACH Unaffected status, supporting integration into compliant manufacturing environments.

Q: What is the significance of the product status difference?

A: The STPS1545R is classified as obsolete, indicating discontinued manufacturing and limited long-term availability. The STPS15L45CB is an active product with ongoing manufacturing support, documented supply chains, and current quality assurance protocols from STMicroelectronics.

Q: Can the STPS15L45CB be used in high-temperature applications above 150°C?

A: No. The STPS15L45CB is rated to a maximum junction temperature of 150°C. Applications requiring operation above this temperature require alternative components rated for higher thermal envelopes, such as the STPS1545R at 175°C maximum junction temperature, though this part is obsolete.

Q: What mounting considerations apply to each part?

A: The STPS1545R uses Through Hole mounting with I2PAK packaging and long leads, suitable for through-hole PCB assembly. The STPS15L45CB uses Surface Mount technology with DPAK packaging, requiring surface mount assembly processes and different PCB pad layouts. These mounting technologies are not interchangeable without complete PCB redesign.

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