STP12NM50FD Equivalent & Substitute Parts

Part Overview

The STP12NM50FD is an N-Channel MOSFET manufactured by STMicroelectronics, rated for 500V drain-to-source voltage with 12A continuous drain current at 25°C. This device is packaged in a TO-220-3 through-hole configuration and is designed for high-voltage switching applications. The part carries an obsolete product status, making identification of equivalent and substitute components necessary for ongoing design support, maintenance, and production continuity.

Substiute Parts

STP12NM50FD
STMicroelectronicsIn Stock: 1444STP12NM50FD Datasheet
STP12NM50FD
Current Part
IRFB13N50APBF
Vishay SiliconixIn Stock: 15171IRFB13N50APBF Datasheet
IRFB13N50APBF
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IXFP12N50P
IXYSIn Stock: 1223IXFP12N50P Datasheet
IXFP12N50P
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IXFP16N50P
IXYSIn Stock: 1293IXFP16N50P Datasheet
IXFP16N50P
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IXTP16N50P
IXYSIn Stock: 1708IXTP16N50P Datasheet
IXTP16N50P
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Key Parameters

Parameter Value Unit
Drain-to-Source Voltage (Vdss) 500 V
Continuous Drain Current (Id) @ 25°C 12 A
On-State Resistance (Rds On) @ 6A, 10V 400 mOhm
Gate Threshold Voltage (Vgs(th)) @ 250µA 5 V
Power Dissipation (Max) 160 W
Operating Temperature Range -65 to 150 °C
Package Type TO-220-3
Mounting Type Through Hole

Substitute Part Grouping Explanation

Substitution of the STP12NM50FD is determined by the following critical electrical and mechanical parameters:

Primary Substitution Criteria:

  • Drain-to-Source Voltage (Vdss): Must equal or exceed 500V
  • Continuous Drain Current (Id): Must equal or exceed 12A at 25°C
  • Package Type: Must be TO-220-3 through-hole configuration
  • FET Type: Must be N-Channel MOSFET
  • Gate Voltage Rating (Vgs Max): Must accommodate ±30V
  • RoHS3 Compliance: Required for regulatory alignment

Secondary Compatibility Factors:

  • On-State Resistance (Rds On): Lower values indicate improved performance
  • Power Dissipation: Higher ratings provide thermal margin
  • Operating Temperature Range: Must support application requirements
  • Gate Charge (Qg): Affects switching speed and drive circuit requirements

Substitute parts are grouped into two categories: Direct Equivalents (matching current rating) and Upgraded Alternatives (higher current ratings with enhanced thermal performance).

Parameter Comparison

Parameter STP12NM50FD IXFP12N50P IRFB13N50APBF IXFP16N50P IXTP16N50P
Manufacturer STMicroelectronics IXYS Vishay Siliconix IXYS IXYS
Vdss (V) 500 500 500 500 500
Id @ 25°C (A) 12 12 14 16 16
Rds On @ 10V (mOhm) 400 @ 6A 500 @ 6A 450 @ 8.4A 400 @ 8A 400 @ 8A
Vgs(th) @ 250µA (V) 5 5.5 4 5.5 5.5
Gate Charge Qg @ 10V (nC) 12 29 81 43 43
Power Dissipation (W) 160 200 250 300 300
Operating Temperature (°C) -65 to 150 -55 to 150 -55 to 150 -55 to 150 -55 to 150
Package TO-220-3 TO-220-3 TO-220-3 TO-220-3 TO-220-3
Product Status Obsolete Active Active Active Active
RoHS3 Compliance Yes Yes Yes Yes Yes

Engineering Selection Recommendations

Direct Equivalent (Same Current Rating):

The IXFP12N50P from IXYS provides a direct current-rated equivalent to the STP12NM50FD. Both devices are rated for 12A continuous drain current at 500V with TO-220-3 packaging. The IXFP12N50P carries active product status and full RoHS3 compliance, ensuring long-term availability and regulatory alignment. The higher on-state resistance (500 mOhm vs. 400 mOhm) results in slightly increased power dissipation but remains within acceptable thermal limits for most applications. This part is suitable for direct pin-compatible replacement in existing designs.

Upgraded Alternative (Higher Current Rating):

The IRFB13N50APBF from Vishay Siliconix offers a 14A current rating with 250W power dissipation, providing thermal and current margin over the original specification. This device maintains 500V Vdss rating and TO-220-3 packaging with active product status. The lower gate threshold voltage (4V vs. 5V) may require drive circuit verification in applications with marginal gate voltage supplies.

The IXFP16N50P and IXTP16N50P from IXYS both provide 16A current ratings with 300W power dissipation, representing the highest performance option within the substitute group. Both devices maintain 500V Vdss and TO-220-3 packaging with active status. These parts are suitable for applications requiring enhanced thermal performance or higher current capacity than the original design specification.

Compliance and Availability:

All substitute parts maintain RoHS3 compliance and REACH unaffected status, matching the regulatory profile of the original component. Active product status across all substitutes ensures continued availability and manufacturing support. Inventory levels for active substitutes exceed 1,200 units, providing supply security for production requirements.

Frequently Asked Questions (FAQ)

Q: Can the IXFP12N50P be used as a direct replacement for the STP12NM50FD?

A: Yes. Both devices share identical voltage (500V) and current (12A) ratings with matching TO-220-3 packaging. Pin configuration is compatible. The higher on-state resistance of the IXFP12N50P (500 mOhm vs. 400 mOhm) results in approximately 25% higher conduction losses but remains within thermal design margins for most applications.

Q: What is the difference between the IXFP16N50P and IXTP16N50P?

A: Both devices are rated for 16A at 500V with identical electrical specifications and TO-220-3 packaging. The primary difference is series designation: IXFP16N50P belongs to the HiPerFET™ Polar series, while IXTP16N50P belongs to the Polar series. Electrical performance and substitution capability are equivalent.

Q: Why does the IRFB13N50APBF have a lower gate threshold voltage (4V vs. 5V)?

A: Gate threshold voltage variation is a normal manufacturing parameter within device families. The 4V threshold of the IRFB13N50APBF is within the specified range for this device class. Applications with gate drive circuits rated for 10V or higher operate without constraint. Circuits with marginal gate voltage supplies (below 8V) require verification of switching performance.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All substitute parts listed carry RoHS3 compliance certification, matching the regulatory status of the STP12NM50FD. All parts are REACH unaffected.

Q: What is the impact of higher gate charge (Qg) in substitute parts?

A: Gate charge affects switching speed and gate drive circuit power requirements. The STP12NM50FD has 12 nC gate charge, while substitutes range from 29 nC to 81 nC. Higher gate charge requires proportionally higher drive current to achieve equivalent switching speed. Gate drive circuits must be verified for adequate current sourcing capability when using higher gate charge devices.

Q: Can upgraded alternatives (16A rated parts) be used in applications designed for 12A?

A: Yes. Higher current-rated devices are suitable for applications designed for lower current operation. The 16A-rated parts provide thermal margin and current headroom. On-state resistance remains equivalent or superior (400 mOhm at 8A vs. 400 mOhm at 6A for the original), resulting in equal or lower conduction losses. No circuit modification is required.

Q: What is the operating temperature range difference between the original and substitutes?

A: The STP12NM50FD operates from -65°C to 150°C, while all active substitutes operate from -55°C to 150°C. The upper temperature limit is identical. The lower temperature limit difference (-65°C vs. -55°C) affects only applications requiring operation below -55°C. Most industrial and commercial applications operate within the -55°C to 150°C range supported by all substitutes.

Q: Is the TO-220-3 package identical across all parts?

A: Yes. All parts use TO-220-3 through-hole packaging with identical pin configuration (Gate, Drain, Source). Physical dimensions and mounting hole spacing are standardized. Direct mechanical substitution is possible without PCB modification.

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