STL6N3LLH6 Equivalent & Substitute Parts

Part Overview

The STL6N3LLH6 is an N-Channel 30 V MOSFET manufactured by STMicroelectronics, designed for surface mount applications in the PowerFlat™ (2x2) package. This device operates within the DeepGATE™ and STripFET™ VI series and is classified as Active product status. The STL6N3LLH6 delivers 13A continuous drain current at 25°C with a maximum power dissipation of 2.4W, making it suitable for moderate to high-current switching applications. Equivalent and substitute parts are identified to provide design flexibility, support supply chain alternatives, and accommodate specific application requirements while maintaining electrical and mechanical compatibility.

Substiute Parts

STL6N3LLH6
STMicroelectronicsIn Stock: 3836STL6N3LLH6 Datasheet
STL6N3LLH6
Current Part
NTLUS4930NTAG
onsemiIn Stock: 3795NTLUS4930NTAG Datasheet
NTLUS4930NTAG
Similar
NTLUS4930NTBG
onsemiIn Stock: 823NTLUS4930NTBG Datasheet
NTLUS4930NTBG
Similar

Key Parameters

Parameter Value Unit
Drain to Source Voltage (Vdss) 30 V
Continuous Drain Current (Id) @ 25°C 13 A
Rds On (Max) @ Id, Vgs 25 mOhm @ 3A, 10V mOhm
Gate Charge (Qg) (Max) @ Vgs 3.6 nC @ 4.5V nC
Input Capacitance (Ciss) (Max) @ Vds 283 pF @ 24V pF
Power Dissipation (Max) 2.4 W
Operating Temperature Range -55 to 150 °C
Package Type PowerFlat™ (2x2) / 6-PowerWDFN
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitute parts for the STL6N3LLH6 are identified based on the following critical electrical and mechanical parameters:

Electrical Compatibility Criteria:

  • Drain to Source Voltage (Vdss): 30 V minimum
  • FET Type: N-Channel MOSFET technology
  • Gate Voltage Range (Vgs): ±20 V maximum
  • Operating Temperature Range: -55°C to 150°C
  • RoHS3 Compliance and REACH Unaffected status

Mechanical Compatibility Criteria:

  • Mounting Type: Surface Mount
  • Package Family: 6-pin configurations (PowerWDFN or UDFN variants)
  • Moisture Sensitivity Level: MSL 1 (Unlimited)

The substitute parts identified (NTLUS4930NTAG and NTLUS4930NTBG from onsemi) share the same Vdss rating, FET type, gate voltage specifications, operating temperature range, and compliance certifications. Both substitute parts are housed in 6-UDFN (2x2) packages with exposed pads, which are mechanically compatible with surface mount assembly processes. The primary electrical differences relate to continuous drain current capacity and power dissipation ratings, which are lower in the substitute parts but remain within acceptable parameters for applications where the full 13A capability of the STL6N3LLH6 is not required.

Parameter Comparison

Parameter STL6N3LLH6 (Main) NTLUS4930NTAG (Substitute) NTLUS4930NTBG (Substitute)
Manufacturer STMicroelectronics onsemi onsemi
FET Type N-Channel N-Channel N-Channel
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 30 V 30 V 30 V
Continuous Drain Current (Id) @ 25°C 13 A (Tc) 3.8 A (Ta) 3.8 A (Ta)
Rds On (Max) @ Id, Vgs 25 mOhm @ 3A, 10V 28.5 mOhm @ 6.1A, 10V 28.5 mOhm @ 6.1A, 10V
Gate Charge (Qg) (Max) @ Vgs 3.6 nC @ 4.5V 8.7 nC @ 10V 8.7 nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds 283 pF @ 24V 476 pF @ 15V 476 pF @ 15V
Power Dissipation (Max) 2.4 W (Tc) 650 mW (Ta) 650 mW (Ta)
Vgs (Max) ±20 V ±20 V ±20 V
Operating Temperature Range -55°C to 150°C (TJ) -55°C to 150°C (TJ) -55°C to 150°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount
Package Type PowerFlat™ (2x2) / 6-PowerWDFN 6-UDFN (2x2) Exposed Pad 6-UDFN (2x2) Exposed Pad
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected
Product Status Active Active Active

Engineering Selection Recommendations

Primary Selection Criteria:

The STL6N3LLH6 remains the primary choice for applications requiring 13A continuous drain current capacity and 2.4W power dissipation. All three parts maintain Active product status, ensuring long-term availability and supply chain stability.

Substitute Part Selection:

The NTLUS4930NTAG and NTLUS4930NTBG are suitable substitutes for applications where continuous drain current requirements do not exceed 3.8A and power dissipation remains below 650mW. Both substitute parts share identical electrical specifications and differ only in packaging designation and inventory availability. NTLUS4930NTAG provides 3725 units in stock, while NTLUS4930NTBG provides 751 units.

Compliance Considerations:

All three parts maintain ROHS3 compliance and REACH Unaffected status, satisfying regulatory requirements for commercial and industrial applications. Moisture Sensitivity Level 1 (Unlimited) across all parts eliminates moisture-related handling constraints during assembly and storage.

Package Compatibility:

The STL6N3LLH6 uses PowerFlat™ (2x2) packaging, while substitute parts use 6-UDFN (2x2) with exposed pad. Both package families are 2x2mm surface mount configurations suitable for standard reflow assembly processes. PCB layout modifications may be required due to different pin configurations between PowerWDFN and UDFN packages.

Frequently Asked Questions (FAQ)

Q: Can the NTLUS4930NTAG or NTLUS4930NTBG directly replace the STL6N3LLH6 in existing designs?

A: Direct replacement depends on application current requirements. The substitute parts support maximum 3.8A continuous drain current compared to 13A for the STL6N3LLH6. If the application draws less than 3.8A, substitution is electrically viable. PCB layout modifications are required due to different package pin configurations (PowerWDFN versus UDFN).

Q: What are the key electrical differences between the main part and substitutes?

A: The primary differences are continuous drain current (13A versus 3.8A), power dissipation (2.4W versus 650mW), gate charge (3.6nC versus 8.7nC), and input capacitance (283pF versus 476pF). Drain to source voltage, gate voltage range, and operating temperature specifications are identical across all three parts.

Q: Are the substitute parts suitable for high-frequency switching applications?

A: The substitute parts exhibit higher gate charge (8.7nC versus 3.6nC) and input capacitance (476pF versus 283pF), which may increase switching losses in high-frequency applications. Application-specific analysis is required to determine suitability based on switching frequency and thermal constraints.

Q: Do all three parts meet the same regulatory and compliance standards?

A: Yes. All three parts are ROHS3 compliant, REACH Unaffected, and classified as Active product status. Moisture Sensitivity Level 1 (Unlimited) applies to all parts, eliminating moisture-related handling requirements.

Q: What is the difference between NTLUS4930NTAG and NTLUS4930NTBG?

A: Both parts are electrically and mechanically identical. The difference is in packaging designation and inventory availability. NTLUS4930NTAG has 3725 units in stock, while NTLUS4930NTBG has 751 units in stock.

Q: Are there thermal management differences between the main part and substitutes?

A: The STL6N3LLH6 supports 2.4W maximum power dissipation, while substitute parts support 650mW. Applications requiring higher power dissipation must use the STL6N3LLH6. Thermal management requirements differ based on application current and switching frequency.

Q: Can the substitute parts be used in applications originally designed for the STL6N3LLH6?

A: Substitution is viable only if application current requirements do not exceed 3.8A and thermal dissipation remains below 650mW. PCB layout redesign is necessary due to package differences. Electrical performance characteristics (Rds On, gate charge, capacitance) differ and may affect circuit behavior.

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