STF20N20 Equivalent & Substitute Parts

Part Overview

The STF20N20 is an N-Channel MOSFET manufactured by STMicroelectronics, rated for 200V drain-to-source voltage with 18A continuous drain current in a Through Hole TO-220FP package. This device is part of the STripFET™ II series and is classified as obsolete. Due to its obsolete status, equivalent and substitute parts from active product lines are necessary for new designs and ongoing production requirements. Substitute parts must maintain electrical compatibility across critical parameters including voltage rating, current capacity, and thermal characteristics.

Key Parameters

Parameter	STF20N20	Unit
Drain to Source Voltage (Vdss)	200	V
Continuous Drain Current (Id) @ 25°C	18	A
Rds On (Max) @ 10A, 10V	125	mOhm
Gate Threshold Voltage (Vgs(th)) @ 250µA	4	V
Gate Charge (Qg) @ 10V	39	nC
Power Dissipation (Max)	25	W
Operating Temperature Range	-55 to 150	°C
Package Type	TO-220FP	-
Product Status	Obsolete	-

Substitute Part Grouping Explanation

Substitution of the STF20N20 is determined by the following critical electrical and mechanical parameters:

Primary Substitution Criteria:

Drain-to-Source Voltage (Vdss): Must equal or exceed 200V
Continuous Drain Current (Id): Must equal or exceed 18A at rated conditions
On-State Resistance (Rds On): Must not significantly exceed 125mOhm to maintain thermal performance
Gate Threshold Voltage (Vgs(th)): Must be compatible with existing gate drive circuits (4V nominal)
Package Type: Through Hole TO-220 family packages (TO-220FP, TO-220F, TO-220FM acceptable)
Operating Temperature Range: Must support -55°C to 150°C minimum
RoHS Compliance: ROHS3 Compliant status required

Substitute Classification:

Direct Equivalent: STF20NF20 (STMicroelectronics) – Identical electrical specifications with improved power dissipation (30W vs 25W) and extended temperature range (-55°C to 175°C). Active product status. Identical Rds On and gate characteristics.

Similar Substitutes: Parts meeting voltage and current requirements with acceptable parameter variations:

RCX200N20 (Rohm Semiconductor) – 20A rating with 130mOhm Rds On, 40W power dissipation, active status
FQPF19N20 (Fairchild Semiconductor) – 11.8A rating with 150mOhm Rds On, 50W power dissipation, active status
FQPF32N20C (onsemi) – 28A rating with 82mOhm Rds On, 50W power dissipation, obsolete status

Parameter Comparison

Parameter	STF20N20	STF20NF20	RCX200N20	FQPF19N20	FQPF32N20C	Unit
Manufacturer	STMicroelectronics	STMicroelectronics	Rohm Semiconductor	Fairchild Semiconductor	onsemi	-
Vdss	200	200	200	200	200	V
Id @ 25°C	18	18	20	11.8	28	A
Rds On (Max) @ 10V	125	125	130	150	82	mOhm
Vgs(th) @ 250µA	4	4	5	5	4	V
Gate Charge (Qg) @ 10V	39	39	40	40	110	nC
Power Dissipation (Max)	25	30	40	50	50	W
Operating Temperature	-55 to 150	-55 to 175	-55 to 150	-55 to 150	-55 to 150	°C
Package	TO-220FP	TO-220FP	TO-220FM	TO-220F	TO-220F	-
Product Status	Obsolete	Active	Active	Active	Obsolete	-
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	Not Specified	ROHS3 Compliant	-

Engineering Selection Recommendations

Recommended Primary Substitute: STF20NF20

The STF20NF20 is the optimal substitute for the obsolete STF20N20. Both devices are manufactured by STMicroelectronics and share identical electrical specifications: 200V Vdss, 18A continuous drain current, 125mOhm Rds On, and 4V gate threshold voltage. The STF20NF20 offers improved performance with increased power dissipation rating (30W vs 25W) and extended maximum operating temperature (175°C vs 150°C). The device maintains ROHS3 compliance and is currently in active production status, ensuring long-term availability. Pin configuration and package footprint are compatible with the original STF20N20 in TO-220FP format.

Alternative Substitutes for Specific Applications:

RCX200N20 (Rohm Semiconductor) is suitable for applications requiring higher current capacity (20A) with comparable on-state resistance (130mOhm). This device is active and ROHS3 compliant. The TO-220FM package is mechanally compatible with TO-220FP footprints. Gate threshold voltage is 5V, requiring verification of gate drive circuit compatibility.

FQPF19N20 (Fairchild Semiconductor) is applicable in designs where lower current requirements (11.8A) are acceptable. Higher on-state resistance (150mOhm) and gate charge (40nC) result in increased power dissipation. This device is active and suitable for lower-power applications within the 200V voltage class.

FQPF32N20C (onsemi) provides higher current capacity (28A) and lower on-state resistance (82mOhm) for high-current applications. However, this device is obsolete and significantly higher gate charge (110nC) requires gate drive circuit evaluation. Use is not recommended for new designs.

Compliance Considerations:

All recommended substitutes maintain ROHS3 compliance and REACH unaffected status consistent with the original STF20N20. Moisture sensitivity level remains at MSL 1 (Unlimited) for all active alternatives, indicating no special storage or handling requirements.

Frequently Asked Questions (FAQ)

Q: Can STF20NF20 be used as a direct replacement for STF20N20?

A: Yes. The STF20NF20 is a direct equivalent with identical electrical specifications and compatible TO-220FP packaging. The device is currently in active production, addressing the obsolescence of the original STF20N20.

Q: What is the primary difference between STF20N20 and STF20NF20?

A: Both devices share identical voltage, current, and on-state resistance ratings. The STF20NF20 offers improved power dissipation (30W vs 25W) and extended operating temperature range (-55°C to 175°C vs -55°C to 150°C). The STF20NF20 is active while the STF20N20 is obsolete.

Q: Can RCX200N20 replace STF20N20 in all applications?

A: RCX200N20 is suitable for most applications due to comparable electrical characteristics and higher current rating (20A vs 18A). The gate threshold voltage is 5V instead of 4V; verify gate drive circuit compatibility. The TO-220FM package is mechanically compatible with TO-220FP footprints.

Q: Why is FQPF19N20 listed as a substitute if it has lower current rating?

A: FQPF19N20 is classified as a similar substitute for applications where the 11.8A continuous current rating is sufficient. The 200V voltage rating and TO-220F package provide mechanical compatibility. This device is not recommended for applications requiring the full 18A capacity of the original STF20N20.

Q: Is FQPF32N20C recommended for new designs?

A: No. Although FQPF32N20C offers superior electrical performance (28A, 82mOhm Rds On), the device is obsolete. Additionally, the significantly higher gate charge (110nC vs 39nC) requires gate drive circuit re-evaluation. New designs should use STF20NF20 or RCX200N20.

Q: Are all substitute parts ROHS3 compliant?

A: STF20NF20, RCX200N20, and FQPF32N20C are ROHS3 compliant. FQPF19N20 compliance status is not specified in available documentation. Verify compliance requirements for your specific application before selection.

Q: What is the difference between TO-220FP, TO-220F, and TO-220FM packages?

A: All three are Through Hole TO-220 family packages with compatible pin configurations and mechanical footprints. The suffix designations (FP, F, FM) indicate manufacturer-specific variations in lead frame design and thermal characteristics. All are suitable for PCB mounting in standard TO-220 footprints.

Q: Can I use FQPF32N20C if my application requires higher current capacity?

A: FQPF32N20C provides 28A capacity with lower on-state resistance (82mOhm). However, the obsolete product status and significantly higher gate charge (110nC) make this unsuitable for new designs. For high-current applications, evaluate RCX200N20 (20A) or consult with component suppliers for active alternatives.

Q: What are the key parameters I should verify when substituting STF20N20?

A: Verify Vdss (200V minimum), continuous drain current (18A minimum for equivalent performance), on-state resistance (125mOhm reference), gate threshold voltage (4V nominal for gate drive compatibility), and operating temperature range (-55°C to 150°C minimum). Confirm package compatibility with existing PCB footprints.

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