STD25NF20 Equivalent & Substitute Parts

Part Overview

The STD25NF20 is an N-Channel MOSFET manufactured by STMicroelectronics, rated for 200V drain-to-source voltage with 18A continuous drain current at 25°C. This device operates in the STripFET™ series and is housed in a DPAK (TO-252-3) surface mount package. The part maintains Active product status and carries AEC-Q101 automotive qualification with ROHS3 compliance.

Substitute parts are identified when equivalent electrical performance can be achieved within the specified parameter tolerances while maintaining the same package form factor and compliance certifications. The STD25NF20 has two identified substitutes that share the same drain-to-source voltage rating and surface mount DPAK packaging.

Substiute Parts

STD25NF20
STMicroelectronicsIn Stock: 889308STD25NF20 Datasheet
STD25NF20
Current Part
FDD18N20LZ
onsemiIn Stock: 17657FDD18N20LZ Datasheet
FDD18N20LZ
Similar
FDD2670
onsemiIn Stock: 25253FDD2670 Datasheet
FDD2670
Similar

Key Parameters

Parameter Value Unit
Drain to Source Voltage (Vdss) 200 V
Current - Continuous Drain (Id) @ 25°C 18 A (Tc)
Rds On (Max) @ Id, Vgs 125 mOhm @ 10A, 10V Ω
Vgs(th) (Max) @ Id 4 V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 39 nC @ 10V
Power Dissipation (Max) 110 W (Tc)
Operating Temperature Range -55 to 175 °C (TJ)
Package Type DPAK (TO-252-3) Surface Mount
RoHS Status ROHS3 Compliant -
Qualification AEC-Q101 Automotive

Substitute Part Grouping Explanation

Substitution eligibility for the STD25NF20 is determined by the following critical parameters:

Primary Matching Criteria:

  • Drain to Source Voltage (Vdss): 200V (exact match required)
  • Package Type: DPAK/TO-252-3 surface mount (form factor compatibility)
  • FET Type: N-Channel MOSFET (functional equivalence)
  • Technology: Metal Oxide MOSFET (process compatibility)

Secondary Compatibility Parameters:

  • Continuous Drain Current (Id): Substitute must support application requirements
  • Rds On (Max): On-resistance characteristics for thermal and efficiency considerations
  • Gate Charge (Qg): Drive circuit compatibility
  • Operating Temperature Range: Application thermal envelope
  • RoHS and MSL Compliance: Environmental and handling requirements

The identified substitutes (FDD18N20LZ and FDD2670) share the 200V Vdss rating and DPAK packaging. However, they differ in continuous drain current capacity and power dissipation ratings, which determines their suitability for specific application requirements.

Parameter Comparison

Parameter STD25NF20 (STMicroelectronics) FDD18N20LZ (onsemi) FDD2670 (onsemi)
Manufacturer STMicroelectronics onsemi onsemi
Series STripFET™ UniFET™ PowerTrench®
Drain to Source Voltage (Vdss) 200 V 200 V 200 V
Current - Continuous Drain (Id) @ 25°C 18 A (Tc) 16 A (Tc) 3.6 A (Ta)
Rds On (Max) @ Id, Vgs 125 mOhm @ 10A, 10V 125 mOhm @ 8A, 10V 130 mOhm @ 3.6A, 10V
Vgs(th) (Max) @ Id 4 V @ 250µA 2.5 V @ 250µA 4.5 V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 39 nC @ 10V 40 nC @ 10V 43 nC @ 10V
Power Dissipation (Max) 110 W (Tc) 89 W (Tc) 70 W (Tc)
Operating Temperature Range -55 to 175 °C (TJ) -55 to 150 °C (TJ) -55 to 150 °C (TJ)
Package Type DPAK (TO-252-3) TO-252AA (DPAK) TO-252AA (DPAK)
Product Status Active Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

STD25NF20 (Primary Part): The STD25NF20 is the specified component with Active product status, AEC-Q101 automotive qualification, and the highest continuous drain current rating (18A) among the three options. It supports the widest operating temperature range (-55 to 175°C) and highest power dissipation capability (110W). This part is suitable for high-current applications requiring maximum thermal headroom.

FDD18N20LZ (Primary Substitute): The FDD18N20LZ provides near-equivalent performance with 16A continuous drain current and 89W power dissipation. It maintains the same 200V Vdss rating and DPAK packaging. The lower gate threshold voltage (2.5V vs. 4V) may affect drive circuit compatibility. The operating temperature range is limited to 150°C maximum. This substitute is suitable for applications where the 2A current reduction and 21W power dissipation reduction are acceptable.

FDD2670 (Limited Substitute): The FDD2670 shares the 200V Vdss rating and DPAK package but provides significantly reduced continuous drain current (3.6A) and power dissipation (70W). This part is not suitable as a direct substitute for the STD25NF20 in high-current applications. It is applicable only in low-current switching applications where the current and power requirements are substantially lower than the primary part specifications.

All three parts maintain ROHS3 compliance, MSL Level 1 (Unlimited), and REACH Unaffected status, ensuring regulatory equivalence for component selection.

Frequently Asked Questions (FAQ)

Q: Can the FDD18N20LZ directly replace the STD25NF20 in all applications?

A: The FDD18N20LZ shares the same 200V Vdss rating and DPAK package, but has a 2A lower continuous drain current rating (16A vs. 18A) and 21W lower power dissipation (89W vs. 110W). Substitution is valid only when the application current requirement does not exceed 16A and thermal dissipation does not exceed 89W. The lower gate threshold voltage (2.5V vs. 4V) requires verification of drive circuit compatibility.

Q: Is the FDD2670 a suitable substitute for the STD25NF20?

A: The FDD2670 is not a suitable direct substitute for high-current applications. While it shares the 200V Vdss rating and DPAK package, its continuous drain current is limited to 3.6A compared to the STD25NF20's 18A. The FDD2670 is applicable only in low-current switching applications with substantially different electrical requirements.

Q: What is the significance of the operating temperature range difference?

A: The STD25NF20 supports operation up to 175°C junction temperature, while both onsemi substitutes are limited to 150°C. Applications requiring operation above 150°C junction temperature must use the STD25NF20. For applications with maximum junction temperatures at or below 150°C, the temperature range difference is not a limiting factor.

Q: Are all three parts automotive qualified?

A: The STD25NF20 carries AEC-Q101 automotive qualification. The FDD18N20LZ and FDD2670 specifications provided do not indicate AEC-Q101 qualification status. Applications requiring automotive qualification should confirm qualification status with the manufacturer before substitution.

Q: How do the gate charge specifications affect substitution?

A: Gate charge values are similar across all three parts (39-43 nC @ 10V), indicating compatible drive circuit requirements. The gate threshold voltage differs more significantly: STD25NF20 and FDD2670 are 4V and 4.5V respectively, while FDD18N20LZ is 2.5V. Drive circuits designed for the STD25NF20 may require adjustment for the FDD18N20LZ due to the lower threshold voltage.

Q: Do all parts meet the same compliance standards?

A: All three parts are ROHS3 compliant, carry MSL Level 1 (Unlimited) moisture sensitivity rating, and have REACH Unaffected status. Regulatory compliance is equivalent across all options for general industrial and commercial applications.

Q: What packaging considerations apply to these substitutes?

A: All three parts use DPAK (TO-252-3) surface mount packaging with identical pin configurations. Physical board layout compatibility is maintained across all substitutes. Thermal management considerations differ due to varying power dissipation ratings: the STD25NF20 (110W) requires more robust thermal design than the FDD18N20LZ (89W) or FDD2670 (70W).

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