SSM6J409TU(TE85L,F Equivalent & Substitute Parts

Part Overview

The SSM6J409TU(TE85L,F is a P-Channel MOSFET manufactured by Toshiba Semiconductor and Storage, rated for 20V drain-to-source voltage with 9.5A continuous drain current at 25°C. This device is housed in a 6-SMD, Flat Leads (UF6) surface mount package and is designed for applications requiring P-channel switching and amplification in compact form factors.

The SSM6J409TU(TE85L,F carries an Obsolete product status. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for legacy systems and new designs requiring compatible performance characteristics.

Key Parameters

Parameter	Value	Unit
FET Type	P-Channel	—
Technology	MOSFET (Metal Oxide)	—
Drain to Source Voltage (Vdss)	20	V
Current - Continuous Drain (Id) @ 25°C	9.5	A
Rds On (Max) @ Id, Vgs	22.1	mOhm @ 3A, 4.5V
Vgs(th) (Max) @ Id	1	V @ 1mA
Gate Charge (Qg) (Max) @ Vgs	15	nC @ 4.5V
Vgs (Max)	±8	V
Input Capacitance (Ciss) (Max) @ Vds	1100	pF @ 10V
Power Dissipation (Max)	1	W
Operating Temperature (TJ)	150	°C
Mounting Type	Surface Mount	—
Package / Case	6-SMD, Flat Leads (UF6)	—
Moisture Sensitivity Level (MSL)	1 (Unlimited)	—

Substitute Part Grouping Explanation

Substitution of the SSM6J409TU(TE85L,F is determined by strict alignment of the following electrical and mechanical parameters:

Critical Matching Parameters:

FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 20V
Package / Case: 6-SMD, Flat Leads (UF6)
Mounting Type: Surface Mount
Operating Temperature (TJ): 150°C

Allowable Variation Parameters:

Current - Continuous Drain (Id) @ 25°C: Substitute must meet or exceed the original specification
Rds On (Max): Substitute must not exceed the original specification
Gate Charge (Qg): Substitute specifications are acceptable within design margin
Input Capacitance (Ciss): Substitute specifications are acceptable within design margin

The SSM6J414TU,LF qualifies as a substitute part. While it features a reduced continuous drain current rating of 6A compared to the original 9.5A, it maintains identical voltage ratings, package configuration, and thermal characteristics. The substitute is suitable for applications where the lower current rating is compatible with circuit requirements.

Parameter Comparison

Parameter	SSM6J409TU(TE85L,F	SSM6J414TU,LF	Unit
FET Type	P-Channel	P-Channel	—
Technology	MOSFET (Metal Oxide)	MOSFET (Metal Oxide)	—
Drain to Source Voltage (Vdss)	20	20	V
Current - Continuous Drain (Id) @ 25°C	9.5	6	A
Rds On (Max) @ Id, Vgs	22.1 @ 3A, 4.5V	22.5 @ 6A, 4.5V	mOhm
Vgs(th) (Max) @ Id	1 @ 1mA	1 @ 1mA	V
Gate Charge (Qg) (Max) @ Vgs	15 @ 4.5V	23.1 @ 4.5V	nC
Vgs (Max)	±8	±8	V
Input Capacitance (Ciss) (Max) @ Vds	1100 @ 10V	1650 @ 10V	pF
Power Dissipation (Max)	1	1	W
Operating Temperature (TJ)	150	150	°C
Mounting Type	Surface Mount	Surface Mount	—
Package / Case	6-SMD, Flat Leads (UF6)	6-SMD, Flat Leads (UF6)	—
Moisture Sensitivity Level (MSL)	1 (Unlimited)	1 (Unlimited)	—
Product Status	Obsolete	Active	—

Engineering Selection Recommendations

SSM6J414TU,LF Substitution Suitability:

The SSM6J414TU,LF is an active product with full manufacturing support and availability. It maintains electrical and mechanical compatibility with the SSM6J409TU(TE85L,F across all critical parameters: identical voltage ratings (20V Vdss), matching package configuration (6-SMD, Flat Leads UF6), and equivalent thermal performance (150°C TJ).

The primary design consideration is the reduced continuous drain current specification: 6A versus 9.5A. Selection of this substitute is appropriate for circuits where the maximum drain current requirement does not exceed 6A at 25°C ambient temperature.

The SSM6J414TU,LF carries Active product status and is RoHS3 Compliant, providing long-term supply chain stability and regulatory compliance. Moisture Sensitivity Level remains at MSL 1 (Unlimited), matching the original part.

Gate charge increases from 15 nC to 23.1 nC, and input capacitance increases from 1100 pF to 1650 pF. These parameter shifts are within acceptable design margins for most switching applications and do not preclude substitution.

Frequently Asked Questions (FAQ)

Q: Can the SSM6J414TU,LF be used as a direct replacement for the SSM6J409TU(TE85L,F?

A: The SSM6J414TU,LF is electrically and mechanically compatible with the SSM6J409TU(TE85L,F for applications where the continuous drain current requirement does not exceed 6A. Both devices share identical voltage ratings, package configuration, and thermal specifications. Verification that circuit maximum drain current remains below 6A is required before substitution.

Q: What is the primary difference between these two parts?

A: The primary difference is the continuous drain current rating. The SSM6J409TU(TE85L,F is rated for 9.5A, while the SSM6J414TU,LF is rated for 6A. Secondary differences include gate charge (15 nC versus 23.1 nC) and input capacitance (1100 pF versus 1650 pF). The SSM6J414TU,LF carries Active product status, whereas the original part is Obsolete.

Q: Are the packages identical?

A: Yes. Both parts use the 6-SMD, Flat Leads (UF6) surface mount package. PCB footprints and assembly processes are identical.

Q: What compliance certifications apply to the substitute part?

A: The SSM6J414TU,LF is RoHS3 Compliant and REACH Unaffected. Both parts carry Moisture Sensitivity Level 1 (Unlimited), indicating no moisture sensitivity restrictions.

Q: Does the increased gate charge affect circuit performance?

A: Gate charge increase from 15 nC to 23.1 nC may require adjustment to gate drive circuitry in high-frequency switching applications. For standard switching frequencies below 1 MHz, this parameter shift typically remains within acceptable design margins. Circuit-specific analysis is necessary for applications operating above 1 MHz.

Q: Is the SSM6J414TU,LF available in the same packaging format?

A: The SSM6J414TU,LF is supplied in Tape & Reel (TR) format, whereas the original part was supplied in standard packaging. Both use identical component packages (UF6). Tape & Reel format is standard for high-volume production and is compatible with automated assembly equipment.

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