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SSL33 M6G Schottky Diode 30V 3A DO-214AB Equivalent & Substitute Parts
Part Overview
The SSL33 M6G is a Schottky rectifier diode manufactured by Taiwan Semiconductor Corporation, rated for 30V DC reverse voltage and 3A average rectified current in a DO-214AB (SMC) surface mount package. This component is classified as discontinued at DiGi Electronics, necessitating identification of equivalent and substitute parts for ongoing design requirements and procurement needs. The part operates across a junction temperature range of -55°C to 125°C and complies with ROHS3 standards.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - DC Reverse (Vr) (Max) | 30 | V |
| Current - Average Rectified (Io) | 3 | A |
| Voltage - Forward (Vf) (Max) @ If | 410 mV @ 3 A | mV |
| Speed | Fast Recovery ≤ 500ns, > 200mA (Io) | ns |
| Current - Reverse Leakage @ Vr | 200 | µA @ 30 V |
| Mounting Type | Surface Mount | — |
| Package / Case | DO-214AB, SMC | — |
| Operating Temperature - Junction | -55 to 125 | °C |
| Technology | Schottky | — |
| RoHS Status | ROHS3 Compliant | — |
Substitute Part Grouping Explanation
Substitution of the SSL33 M6G is determined by strict alignment of electrical and mechanical parameters. The primary substitution criteria are:
Mandatory Matching Parameters:
- Voltage - DC Reverse (Vr) (Max): 30V
- Current - Average Rectified (Io): 3A minimum
- Mounting Type: Surface Mount
- Package / Case: DO-214AB or compatible SMC package
- Technology: Schottky
Secondary Compatibility Factors:
- Forward voltage (Vf) at rated current: Acceptable range up to 500 mV @ 3A
- Reverse leakage current: Acceptable up to 500 µA @ 30V
- Operating temperature range: Minimum -55°C to 125°C
- RoHS compliance status
Parts are grouped into three categories:
Category 1: Direct Equivalents (3A, 30V, DO-214AB SMC) Parts with identical current and voltage ratings in the same package footprint.
Category 2: Higher Current Capability (5A or greater, 30V, DO-214AB SMC) Parts with superior current handling in the same package, suitable for applications with design margin requirements.
Category 3: Alternative Package Variants (3A, 30V, different SMD packages) Parts with matching electrical specifications but different surface mount package geometries.
Parameter Comparison
| Manufacturer Part Number | Manufacturer | Vr (Max) [V] | Io [A] | Vf (Max) @ If [mV] | Reverse Leakage @ Vr [µA] | Package | Product Status | RoHS Status | Tj (Max) [°C] |
|---|---|---|---|---|---|---|---|---|---|
| SSL33 M6G | Taiwan Semiconductor Corporation | 30 | 3 | 410 @ 3A | 200 @ 30V | DO-214AB, SMC | Discontinued | ROHS3 | 125 |
| 5821SMJ/TR13 | Microchip Technology | 30 | 3 | 480 @ 3A | 1500 @ 30V | DO-214AB | Active | Non-compliant | 150 |
| 5821SMJE3/TR13 | Microchip Technology | 30 | 3 | 480 @ 3A | 1500 @ 30V | DO-214AB | Active | ROHS3 | 150 |
| B330-13-F | Diodes Incorporated | 30 | 3 | 500 @ 3A | 500 @ 30V | DO-214AB, SMC | Active | ROHS3 | 125 |
| B330A-13-F | Diodes Incorporated | 30 | 3 | 500 @ 3A | 500 @ 30V | DO-214AC, SMA | Active | ROHS3 | 150 |
| B330B-13-F | Diodes Incorporated | 30 | 3 | 500 @ 3A | 500 @ 30V | DO-214AA, SMB | Active | ROHS3 | 150 |
| B330Q-13-F | Diodes Incorporated | 30 | 3 | 500 @ 3A | 500 @ 30V | DO-214AB, SMC | Active | ROHS3 | 150 |
| B530C-13-F | Diodes Incorporated | 30 | 5 | 550 @ 5A | 500 @ 30V | DO-214AB, SMC | Active | ROHS3 | 150 |
| B530CQ-13-F | Diodes Incorporated | 30 | 5 | 700 @ 5A | 500 @ 30V | DO-214AB, SMC | Active | ROHS3 | 150 |
| HSM830J/TR13 | Microchip Technology | 30 | 8 | 620 @ 8A | 250 @ 30V | DO-214AB | Active | Non-compliant | 175 |
| HSM830JE3/TR13 | Microchip Technology | 30 | 8 | 620 @ 8A | 250 @ 30V | DO-214AB | Active | ROHS3 | 175 |
Engineering Selection Recommendations
Primary Substitutes (Direct Replacement - Same Electrical and Package Specifications):
The B330Q-13-F (Diodes Incorporated) and B330-13-F (Diodes Incorporated) are the preferred direct substitutes for the SSL33 M6G. Both parts maintain the 30V/3A electrical specification in the DO-214AB SMC package. The B330Q-13-F is supplied in Tape & Reel packaging and carries ROHS3 compliance with an extended operating temperature range to 150°C. The B330-13-F is available in Cut Tape & Digi-Reel format with equivalent compliance. Both parts exhibit forward voltage of 500 mV @ 3A, which is within acceptable tolerance for the SSL33 M6G application envelope.
Secondary Substitutes (Electrical Equivalence with Package Variants):
The B330A-13-F (SMA package, DO-214AC) and B330B-13-F (SMB package, DO-214AA) provide electrical equivalence to the SSL33 M6G with alternative surface mount package geometries. These parts are suitable only when PCB layout accommodates the different footprints. Both carry AEC-Q101 automotive qualification and ROHS3 compliance.
The 5821SMJE3/TR13 (Microchip Technology) provides electrical equivalence with ROHS3 compliance and extended temperature range to 150°C. This part exhibits higher reverse leakage current (1.5 mA @ 30V) compared to the SSL33 M6G (200 µA @ 30V) and slightly elevated forward voltage (480 mV @ 3A).
Higher Current Capability Substitutes (Design Margin Applications):
The B530C-13-F and B530CQ-13-F (Diodes Incorporated) provide 5A current capability at 30V in the DO-214AB SMC package. These parts are suitable for applications requiring design margin above the 3A specification. The B530C-13-F exhibits 550 mV forward voltage @ 5A, while the B530CQ-13-F carries AEC-Q101 automotive qualification with 700 mV forward voltage @ 5A.
The HSM830JE3/TR13 (Microchip Technology) provides 8A current capability at 30V with ROHS3 compliance and extended temperature range to 175°C. This part is suitable for applications with significant current margin requirements.
Compliance Considerations:
All recommended substitutes maintain ROHS3 compliance status. The SSL33 M6G is ROHS3 compliant; therefore, non-compliant alternatives (5821SMJ/TR13, HSM830J/TR13) are not recommended for new designs subject to ROHS3 requirements.
Frequently Asked Questions (FAQ)
Q: Can the B330Q-13-F directly replace the SSL33 M6G without PCB modification?
A: Yes. The B330Q-13-F maintains identical electrical specifications (30V, 3A) and package geometry (DO-214AB SMC). No PCB layout changes are required. The part is pin-compatible and footprint-compatible with the SSL33 M6G.
Q: What is the difference between B330-13-F and B330Q-13-F?
A: Both parts are electrically identical (30V, 3A, DO-214AB SMC package). The primary difference is packaging format: B330-13-F is supplied in Cut Tape & Digi-Reel format, while B330Q-13-F is supplied in Tape & Reel format. Selection depends on procurement and assembly process requirements.
Q: Why does the 5821SMJE3/TR13 show higher reverse leakage current than the SSL33 M6G?
A: The 5821SMJE3/TR13 exhibits 1.5 mA reverse leakage @ 30V compared to 200 µA for the SSL33 M6G. This difference reflects different semiconductor manufacturing processes and die designs between Microchip Technology and Taiwan Semiconductor Corporation. The elevated leakage remains within acceptable limits for most rectifier applications but should be evaluated for low-leakage-sensitive circuits.
Q: Can I use the B330A-13-F (SMA package) as a substitute?
A: The B330A-13-F is electrically equivalent but uses a different surface mount package (DO-214AC SMA instead of DO-214AB SMC). Substitution requires PCB redesign to accommodate the different footprint. This part is suitable only when layout modifications are feasible.
Q: What is the advantage of using B530C-13-F over the SSL33 M6G?
A: The B530C-13-F provides 5A current capability compared to 3A for the SSL33 M6G, while maintaining the same 30V voltage rating and DO-214AB SMC package. This part is suitable for applications requiring design margin or where current requirements may increase. The trade-off is slightly higher forward voltage (550 mV @ 5A vs. 410 mV @ 3A).
Q: Are the Microchip HSM830 series parts suitable replacements?
A: The HSM830JE3/TR13 is electrically compatible at 30V but provides 8A current capability. This part is suitable only for applications where higher current capacity is beneficial or required. The significantly higher forward voltage (620 mV @ 8A) may impact circuit performance in voltage-sensitive applications. The HSM830J/TR13 (non-compliant version) is not recommended for ROHS3-regulated designs.
Q: What packaging format should I specify for high-volume production?
A: For automated assembly, specify Tape & Reel (TR) packaging. The B330Q-13-F and 5821SMJE3/TR13 are available in TR format. For lower volumes or manual assembly, Cut Tape (CT) & Digi-Reel format (B330-13-F) is acceptable.
Q: Does the SSL33 M6G have any automotive qualification?
A: The SSL33 M6G does not carry AEC-Q101 automotive qualification. If automotive-grade components are required, the B330A-13-F, B330B-13-F, and B530CQ-13-F all carry AEC-Q101 qualification.
Q: What is the temperature operating range difference between SSL33 M6G and its substitutes?
A: The SSL33 M6G operates to 125°C junction temperature. Most active substitutes (B330 series, 5821SMJE3/TR13, HSM830JE3/TR13) extend to 150°C or higher. This extended range provides additional thermal margin in high-temperature applications but does not affect compatibility in standard operating conditions.
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