SS39 V7G Schottky Diode Equivalent & Substitute Parts

Part Overview

The SS39 V7G is a surface mount Schottky diode manufactured by Taiwan Semiconductor Corporation, rated for 90 V DC reverse voltage and 3 A average rectified current in a DO-214AB (SMC) package. This component is classified as discontinued at DiGi Electronics, necessitating identification of equivalent alternatives for ongoing design requirements and procurement needs. The SS39 series remains active in manufacturer inventory, providing direct substitution pathways for applications requiring this rectifier specification.

Substiute Parts

SS39 V7G

Taiwan Semiconductor CorporationIn Stock: 1041SS39 V7G Datasheet

Current PartRFQ

SS39

Taiwan Semiconductor CorporationIn Stock: 1234SS39 Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SS39 V7G is determined by strict equivalence across the following critical parameters:

• Voltage Rating: DC reverse voltage must equal 90 V maximum
• Current Rating: Average rectified current must equal 3 A
• Technology: Schottky diode technology
• Recovery Speed: Fast recovery characteristic ≤ 500ns at > 200mA
• Reverse Leakage: Maximum 100 µA at 90 V
• Package: DO-214AB (SMC) surface mount configuration
• Temperature Range: Operating junction temperature -55°C to 150°C
• Compliance: ROHS3 compliance and MSL 1 rating

The SS39 (direct manufacturer part number) meets all substitution criteria as an active product with identical electrical and mechanical specifications.

Parameter Comparison

Engineering Selection Recommendations

The SS39 (active product) provides direct substitution for the SS39 V7G (discontinued variant). Both components share identical electrical specifications, package configuration, and compliance certifications. The SS39 maintains active status with manufacturer inventory of 1210 pieces available, compared to 960 pieces of the discontinued SS39 V7G variant. Both parts carry ROHS3 compliance, REACH unaffected status, and MSL 1 rating, ensuring compatibility with standard surface mount assembly processes and environmental regulations. Selection of the SS39 eliminates supply chain risk associated with discontinued product status while maintaining full functional equivalence.

Frequently Asked Questions (FAQ)

Q: Can the SS39 replace the SS39 V7G in existing designs?

A: Yes. The SS39 is electrically and mechanically identical to the SS39 V7G across all specified parameters, including voltage rating (90 V), current rating (3 A), package type (DO-214AB), and operating temperature range (-55°C to 150°C). Direct substitution is supported.

Q: What is the difference between SS39 V7G and SS39?

A: The SS39 V7G is a discontinued variant, while the SS39 is the active product designation from Taiwan Semiconductor Corporation. Both share identical electrical and mechanical specifications. The designation difference reflects product lifecycle status only.

Q: Are there any package compatibility concerns?

A: No. Both the SS39 V7G and SS39 use the DO-214AB (SMC) surface mount package. PCB footprints, solder pad layouts, and assembly processes are identical.

Q: What compliance certifications apply to the SS39 substitute?

A: The SS39 carries ROHS3 compliance, REACH unaffected status, and MSL 1 (unlimited moisture sensitivity level) rating. These certifications match the SS39 V7G specifications.

Q: Is forward voltage (Vf) a critical parameter for substitution?

A: Forward voltage is not specified for the SS39 V7G. The SS39 datasheet specifies 850 mV maximum at 3 A. This parameter does not affect substitution eligibility but may be relevant for circuit performance analysis in specific applications.

Q: What is the reverse leakage current specification?

A: Both parts specify maximum reverse leakage current of 100 µA at 90 V DC reverse voltage. This parameter is identical across both components.

Q: Can the SS39 be used in high-temperature applications?

A: Yes. The operating junction temperature range is -55°C to 150°C for both the SS39 V7G and SS39, supporting applications across this full thermal envelope.