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SS19HM2G Equivalent & Substitute Parts
Part Overview
The SS19HM2G is a Schottky rectifier diode manufactured by Taiwan Semiconductor Corporation, rated for 90 V DC reverse voltage and 1 A average rectified current in a DO-214AC (SMA) surface mount package. This component is classified as discontinued at DiGi Electronics, necessitating identification of equivalent alternatives for ongoing design requirements and production needs. Substitute parts must maintain electrical equivalence across voltage, current, and thermal specifications while accommodating package and compliance variations.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - DC Reverse (Vr) (Max) | 90 | V |
| Current - Average Rectified (Io) | 1 | A |
| Voltage - Forward (Vf) (Max) @ If | 800 mV @ 1 A | mV |
| Speed | Fast Recovery ≤ 500ns, > 200mA (Io) | ns |
| Current - Reverse Leakage @ Vr | 100 | µA @ 90 V |
| Operating Temperature - Junction | -55 to 150 | °C |
| Package / Case | DO-214AC, SMA | — |
| Technology | Schottky | — |
| RoHS Status | ROHS3 Compliant | — |
| Grade | Automotive | — |
| Qualification | AEC-Q101 | — |
Substitute Part Grouping Explanation
Substitution of the SS19HM2G is determined by equivalence in the following critical parameters:
Electrical Equivalence Requirements:
- Voltage - DC Reverse (Vr) (Max): 90 V
- Current - Average Rectified (Io): 1 A
- Technology: Schottky
- Speed: Fast Recovery ≤ 500ns, > 200mA (Io)
Thermal Compatibility:
- Operating Temperature - Junction range must accommodate the application's thermal environment
Compliance & Certification:
- RoHS Status: ROHS3 Compliant preferred for new designs
- AEC-Q101 qualification for automotive applications
Package Considerations: Substitute parts are grouped by package type: DO-214AC (SMA), DO-214AA (SMB), and DO-214BA. While package differences exist, electrical performance within the specified parameters determines functional substitutability. Package selection depends on PCB layout constraints and assembly equipment compatibility.
Parameter Comparison
| Part Number | Manufacturer | Vr (Max) [V] | Io [A] | Vf (Max) @ If [mV] | Reverse Leakage @ Vr [µA] | Package | Tj (Max) [°C] | RoHS Status | Product Status |
|---|---|---|---|---|---|---|---|---|---|
| SS19HM2G | Taiwan Semiconductor Corporation | 90 | 1 | 800 @ 1 A | 100 @ 90 V | DO-214AC (SMA) | 150 | ROHS3 Compliant | Discontinued |
| B190B-13-F | Diodes Incorporated | 90 | 1 | 790 @ 1 A | 500 @ 90 V | DO-214AA (SMB) | 150 | ROHS3 Compliant | Active |
| HSM190JE3/TR13 | Microchip Technology | 90 | 1 | 840 @ 1 A | 100 @ 90 V | DO-214BA | 175 | ROHS3 Compliant | Active |
| SK19E3/TR13 | Microsemi Corporation | 90 | 1 | 800 @ 1 A | 500 @ 90 V | DO-214AA (SMB) | 175 | ROHS3 Compliant | Active |
| SS1H9-E3/61T | Vishay General Semiconductor - Diodes Division | 90 | 1 | 770 @ 1 A | 1 @ 90 V | DO-214AC (SMA) | 175 | ROHS3 Compliant | Active |
| SS1H9-E3/5AT | Vishay General Semiconductor - Diodes Division | 90 | 1 | 770 @ 1 A | 1 @ 90 V | DO-214AC (SMA) | 175 | ROHS3 Compliant | Active |
| SS1H9-M3/5AT | Vishay General Semiconductor - Diodes Division | 90 | 1 | 860 @ 2 A | 1 @ 90 V | DO-214AC (SMA) | 175 | ROHS3 Compliant | Active |
| SS1H9-M3/61T | Vishay General Semiconductor - Diodes Division | 90 | 1 | 860 @ 2 A | 1 @ 90 V | DO-214AC (SMA) | 175 | ROHS3 Compliant | Active |
| SS1H9 | Vishay General Semiconductor - Diodes Division | 90 | 1 | 770 @ 1 A | 1 @ 90 V | DO-214AC (SMA) | 175 | RoHS non-compliant | Active |
Engineering Selection Recommendations
Primary Substitutes (Highest Compatibility):
The SS1H9-E3/61T, SS1H9-E3/5AT, SS1H9-M3/5AT, and SS1H9-M3/61T from Vishay General Semiconductor maintain the same DO-214AC (SMA) package as the SS19HM2G, eliminating PCB layout modifications. All four variants are ROHS3 compliant and active in production. The E3 variants feature forward voltage of 770 mV @ 1 A with reverse leakage of 1 µA @ 90 V. The M3 variants specify forward voltage at 2 A (860 mV) with identical reverse leakage characteristics. Both packaging options (Cut Tape CT and Tape & Reel TR) are available.
Secondary Substitutes (Package Variation):
The B190B-13-F from Diodes Incorporated and SK19E3/TR13 from Microsemi Corporation provide electrical equivalence with package transitions to DO-214AA (SMB). Both are ROHS3 compliant and active. The B190B-13-F exhibits forward voltage of 790 mV @ 1 A with higher reverse leakage of 500 µA @ 90 V. The SK19E3/TR13 matches the original forward voltage specification at 800 mV @ 1 A, also with 500 µA reverse leakage. These substitutes require PCB layout verification due to package geometry differences.
Extended Temperature Range Option:
The HSM190JE3/TR13 from Microchip Technology operates to 175°C junction temperature (versus 150°C for the original), providing thermal margin for high-temperature applications. This part uses the DO-214BA package and maintains 90 V / 1 A electrical ratings with forward voltage of 840 mV @ 1 A and reverse leakage of 100 µA @ 90 V, matching the original leakage specification.
Compliance Consideration:
All recommended substitutes maintain ROHS3 compliance. The SS1H9 variant from Vishay is RoHS non-compliant and is not recommended for new designs requiring environmental compliance.
Frequently Asked Questions (FAQ)
Q: Can the SS19HM2G be directly replaced with SS1H9-E3/61T without PCB modifications?
A: Yes. Both parts use the DO-214AC (SMA) package with identical pinout and footprint. The SS1H9-E3/61T is electrically equivalent, with forward voltage of 770 mV @ 1 A (lower than the original 800 mV), reverse leakage of 1 µA @ 90 V (lower than the original 100 µA), and extended maximum junction temperature to 175°C. No PCB layout changes are required.
Q: What is the difference between SS1H9-E3/61T and SS1H9-M3/61T?
A: Both parts share the same package (DO-214AC, SMA), voltage rating (90 V), and current rating (1 A). The primary difference is the forward voltage specification: E3 variants specify 770 mV @ 1 A, while M3 variants specify 860 mV @ 2 A. The M3 specification is measured at higher current. Both have identical reverse leakage (1 µA @ 90 V) and operating temperature range (-65°C to 175°C).
Q: Why do some substitutes have different package designations (SMB vs. SMA)?
A: DO-214AA (SMB) and DO-214AC (SMA) are distinct surface mount packages with different physical dimensions and footprints. SMB packages are larger than SMA packages. Substitutes using different packages require PCB layout verification to confirm footprint compatibility with existing assembly equipment and board space constraints.
Q: Is the B190B-13-F suitable for automotive applications?
A: The B190B-13-F is ROHS3 compliant and electrically equivalent at 90 V / 1 A ratings. However, the provided data does not specify AEC-Q101 qualification for this part. The original SS19HM2G carries AEC-Q101 automotive qualification. Verification of automotive qualification status is necessary before deployment in automotive circuits.
Q: What is the significance of the reverse leakage difference between SS19HM2G (100 µA) and SS1H9-E3/61T (1 µA)?
A: Lower reverse leakage reduces standby current and heat dissipation in the reverse-biased state. The SS1H9-E3/61T's 1 µA leakage is 100 times lower than the original specification, providing improved efficiency in applications sensitive to leakage current. This is a beneficial characteristic for direct substitution.
Q: Can I use B190B-13-F in place of SS19HM2G if my PCB layout accommodates the SMB package?
A: Yes, provided the application tolerates the package transition and higher reverse leakage (500 µA @ 90 V versus 100 µA). The B190B-13-F maintains 90 V / 1 A electrical ratings with forward voltage of 790 mV @ 1 A. Thermal design must account for increased leakage current dissipation. ROHS3 compliance is maintained.
Q: What is the difference between Cut Tape (CT) and Tape & Reel (TR) packaging for SS1H9-E3/61T and SS1H9-E3/5AT?
A: Cut Tape (CT) and Tape & Reel (TR) represent different supply formats for the same electrical component. CT packaging is suitable for manual assembly or small-volume production. TR packaging is optimized for automated pick-and-place assembly in high-volume manufacturing. Electrical specifications are identical; selection depends on assembly process requirements.
Q: Does HSM190JE3/TR13 offer advantages over SS1H9-E3/61T for high-temperature applications?
A: Yes. The HSM190JE3/TR13 operates to 175°C junction temperature, matching the SS1H9 variants, but uses the DO-214BA package instead of DO-214AC. Both provide extended temperature capability beyond the original SS19HM2G (150°C maximum). Package selection depends on PCB layout constraints. The HSM190JE3/TR13 forward voltage is 840 mV @ 1 A, slightly higher than SS1H9 variants at 770 mV @ 1 A.
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