SS13 Schottky Diode 30V 1A DO-214AC Equivalent & Substitute Parts

Part Overview

The SS13 is a Schottky rectifier diode manufactured by Taiwan Semiconductor Corporation, rated for 30V DC reverse voltage and 1A average rectified current in a surface mount DO-214AC (SMA) package. This part is classified as Active product status with ROHS3 compliance and unlimited moisture sensitivity level (MSL 1). The SS13 is widely used in power supply circuits, reverse polarity protection, and high-frequency rectification applications where fast recovery characteristics are required.

Equivalent and substitute parts are necessary when the primary part becomes unavailable, when alternative packaging formats are required for design optimization, or when sourcing from multiple manufacturers is needed for supply chain resilience. The parts listed below maintain electrical compatibility within the specified parameter ranges while offering variations in package type, forward voltage characteristics, and reverse leakage specifications.

Key Parameters

Parameter	Value	Unit	Significance for Substitution
Voltage - DC Reverse (Vr) Max	30	V	Critical: Must match or exceed for circuit protection
Current - Average Rectified (Io)	1	A	Critical: Determines thermal and current handling capability
Voltage - Forward (Vf) Max @ If	500 mV @ 1 A	mV	Important: Affects power dissipation and efficiency
Speed - Fast Recovery	≤ 500ns, > 200mA (Io)	ns	Important: Determines switching performance in high-frequency circuits
Current - Reverse Leakage @ Vr	200	µA @ 30 V	Important: Affects standby power consumption
Package / Case	DO-214AC, SMA	—	Critical: Determines PCB layout and thermal performance
Operating Temperature - Junction	-55 to 125	°C	Important: Defines operating range and derating requirements
Technology	Schottky	—	Critical: Defines diode type and performance characteristics
RoHS Status	ROHS3 Compliant	—	Important: Regulatory compliance requirement

Substitute Part Grouping Explanation

Substitution logic for the SS13 is based on matching or exceeding the following critical electrical parameters: reverse voltage rating (30V minimum), average rectified current (1A minimum), fast recovery speed characteristic (≤500ns), and Schottky technology type. Package compatibility is evaluated separately, as the same electrical specifications may be available in different surface mount formats (DO-214AC/SMA, SOD-123W, SOD-123, DO-214AA/SMB).

Substitute parts are grouped into three categories:

Category 1: Parametric Equivalents (Same Package - DO-214AC/SMA) Parts that maintain identical or superior electrical specifications within the DO-214AC/SMA package format. These parts are direct mechanical and electrical replacements without PCB layout modification.

Category 2: Direct Manufacturer Alternatives (Different Package) Parts from alternative manufacturers that meet or exceed electrical specifications but utilize different surface mount packages (SOD-123W, SOD-123). These require PCB layout adjustment but maintain full electrical compatibility.

Category 3: Similar Specifications (Package Variants) Parts with matching voltage and current ratings but variations in forward voltage, reverse leakage, or package size (SMB, SOD-123). These are suitable when package footprint changes are acceptable or beneficial for thermal management.

The following parameters determine substitution eligibility:

Voltage - DC Reverse (Vr) ≥ 30V
Current - Average Rectified (Io) ≥ 1A
Technology = Schottky
Speed = Fast Recovery ≤ 500ns
RoHS3 Compliance = Required

Parameter Comparison

Manufacturer Part Number	Manufacturer	Vr (Max) V	Io (A)	Vf (Max) mV @ If	Reverse Leakage µA @ Vr	Package	Tj (°C)	Product Status
SS13	Taiwan Semiconductor Corporation	30	1	500 @ 1A	200 @ 30V	DO-214AC (SMA)	-55 to 125	Active
SS13 R3G	Taiwan Semiconductor Corporation	30	1	500 @ 1A	200 @ 30V	DO-214AC (SMA)	-55 to 125	Discontinued at DiGi Electronics
PMEG3010ER,115	Nexperia USA Inc.	30	1	360 @ 1A	1.5 @ 30V	SOD-123W	-55 to 150	Active
SL13	SMC Diode Solutions	30	1	380 @ 1A	500 @ 30V	DO-214AC (SMA)	-65 to 125	Active
B130-13-F	Diodes Incorporated	30	1	500 @ 1A	500 @ 30V	DO-214AC (SMA)	-65 to 150	Active
B130-E3/5AT	Vishay General Semiconductor - Diodes Division	30	1	520 @ 1A	200 @ 30V	DO-214AC (SMA)	-65 to 125	Active
B130-E3/61T	Vishay General Semiconductor - Diodes Division	30	1	520 @ 1A	200 @ 30V	DO-214AC (SMA)	-65 to 125	Active
B130B-13-F	Diodes Incorporated	30	1	500 @ 1A	500 @ 30V	DO-214AA (SMB)	-65 to 150	Active
B130L-13-F	Diodes Incorporated	30	1	410 @ 1A	1 @ 30V	DO-214AC (SMA)	-55 to 125	Active
B130LAW-7-F	Diodes Incorporated	30	1	420 @ 1A	1 @ 30V	SOD-123	-55 to 125	Active
B130LB-13-F	Diodes Incorporated	30	2	445 @ 2A	1 @ 30V	DO-214AA (SMB)	-55 to 125	Active

Engineering Selection Recommendations

For Direct Replacement (No PCB Modification Required)

Select from parts maintaining the DO-214AC (SMA) package format with Active product status:

B130L-13-F (Diodes Incorporated): Offers lower forward voltage (410 mV @ 1A) and reduced reverse leakage (1 µA @ 30V) compared to the SS13, resulting in improved efficiency and lower standby power consumption. Extended temperature range to 150°C provides additional thermal margin. ROHS3 compliant with unlimited MSL.
SL13 (SMC Diode Solutions): Maintains identical voltage and current ratings with lower forward voltage (380 mV @ 1A). Extended lower temperature limit (-65°C) provides broader operating range. ROHS3 compliant. Note: REACH Status is Affected.
B130-E3/5AT or B130-E3/61T (Vishay General Semiconductor - Diodes Division): Both provide identical electrical specifications with extended temperature range (-65°C to 125°C). Tape & Reel or Cut Tape packaging options available. ROHS3 compliant with REACH Unaffected status.

For Improved Thermal Performance (SMB Package)

B130B-13-F (Diodes Incorporated): Larger SMB package provides superior thermal dissipation compared to SMA. Maintains 30V/1A ratings with extended temperature range (-65°C to 150°C). Suitable for applications requiring enhanced heat sinking. ROHS3 compliant.

For Compact PCB Layouts (SOD-123 Package)

B130LAW-7-F (Diodes Incorporated): Smallest package footprint with improved forward voltage (420 mV @ 1A) and minimal reverse leakage (1 µA @ 30V). Requires PCB layout modification but provides space optimization. ROHS3 compliant.

For Superior Forward Voltage Performance (SOD-123W Package)

PMEG3010ER,115 (Nexperia USA Inc.): Lowest forward voltage specification (360 mV @ 1A) among all listed substitutes, delivering maximum efficiency in power conversion applications. Extended maximum junction temperature (150°C) supports high-ambient-temperature environments. Requires PCB layout modification. ROHS3 compliant.

For Higher Current Applications

B130LB-13-F (Diodes Incorporated): Rated for 2A average rectified current (double the SS13 rating) in SMB package. Suitable when circuit requirements exceed 1A. Forward voltage specified at 2A (445 mV). ROHS3 compliant.

Avoid

SS13 R3G (Taiwan Semiconductor Corporation): Discontinued at DiGi Electronics. While electrically identical to SS13, availability is limited and future sourcing is uncertain.

Frequently Asked Questions (FAQ)

Q: Can I use B130L-13-F as a direct replacement for SS13 without modifying my PCB?

A: Yes. Both parts use the DO-214AC (SMA) package with identical mechanical dimensions and pin configuration. No PCB layout modification is required. The B130L-13-F offers superior electrical performance with lower forward voltage (410 mV vs. 500 mV) and reduced reverse leakage (1 µA vs. 200 µA).

Q: What is the difference between B130-13-F and B130L-13-F?

A: Both are manufactured by Diodes Incorporated in DO-214AC (SMA) packages with 30V/1A ratings. The B130L-13-F variant features lower forward voltage (410 mV vs. 500 mV) and significantly lower reverse leakage (1 µA vs. 500 µA). The B130L-13-F is the preferred choice for applications sensitive to power dissipation or standby current.

Q: Can I substitute the SMA package (SS13) with the SMB package (B130B-13-F)?

A: Electrically, yes. Both maintain 30V/1A Schottky specifications. However, SMB and SMA packages have different physical dimensions and PCB footprints. PCB layout modification is required. The SMB package provides superior thermal performance due to larger surface area, making it beneficial for high-power applications.

Q: What is the advantage of PMEG3010ER,115 over SS13?

A: The PMEG3010ER,115 offers significantly lower forward voltage (360 mV vs. 500 mV @ 1A), reducing power dissipation by approximately 28%. It also features extended maximum junction temperature (150°C vs. 125°C). The trade-off is a different package format (SOD-123W vs. DO-214AC), requiring PCB layout modification.

Q: Are all listed substitutes ROHS3 compliant?

A: Yes. All substitute parts listed carry ROHS3 compliance certification. However, note that SL13 (SMC Diode Solutions) has REACH Status listed as Affected, while all other parts have REACH Status Unaffected. Verify REACH compliance requirements for your specific application and end-market.

Q: What does "Fast Recovery ≤ 500ns, > 200mA (Io)" mean?

A: This specification indicates the diode's reverse recovery time is 500 nanoseconds or less when switching from forward conduction to reverse blocking at currents exceeding 200 milliamps. This fast recovery characteristic is essential for high-frequency switching applications and reduces switching losses in power supply circuits.

Q: Can I use B130LB-13-F (2A rated) in place of SS13 (1A rated)?

A: Yes, electrically and mechanically. The B130LB-13-F is rated for 2A average rectified current, making it suitable for applications requiring higher current capacity. However, it uses the SMB package instead of SMA, requiring PCB layout modification. Use this part only when higher current capability is needed or when thermal performance improvement is desired.

Q: What is the difference between Cut Tape (CT) and Tape & Reel (TR) packaging?

A: Both formats contain identical electronic components. Cut Tape packaging is supplied in individual strips suitable for manual assembly or small-volume production. Tape & Reel packaging is supplied on continuous reels optimized for automated pick-and-place assembly in high-volume manufacturing. Select based on your assembly process requirements.

Q: Why does SL13 have a higher reverse leakage (500 µA) compared to SS13 (200 µA)?

A: Reverse leakage current varies based on semiconductor manufacturing process, die design, and quality control parameters. While both parts meet the 30V/1A specification, the SL13 exhibits higher leakage. For applications sensitive to standby power consumption, select parts with lower reverse leakage specifications such as B130L-13-F (1 µA) or B130LAW-7-F (1 µA).

Q: Is the SS13 R3G still available for purchase?

A: SS13 R3G is listed as Discontinued at DiGi Electronics. While inventory may exist at other distributors, future availability is not guaranteed. For new designs or long-term production, select from Active status parts such as B130L-13-F, SL13, or PMEG3010ER,115.

Q: What operating temperature range should I select for my application?

A: The SS13 operates from -55°C to 125°C junction temperature. Most substitute parts offer extended ranges: B130-13-F and B130B-13-F extend to 150°C maximum. Select based on your application's ambient temperature, PCB thermal design, and component power dissipation. Higher maximum junction temperature provides additional thermal margin and extended component life.

Request Quote (Ships tomorrow)

Part Number

Quantity

Company

Contact Name

E-mail

Message