SS-110-S-2 Equivalent & Substitute Parts

Part Overview

The SS-110-S-2 is a 10-position receptacle connector manufactured by Samtec Inc., designed for board-to-board applications with 0.100" (2.54mm) pitch through-hole mounting. This single-row socket strip features gold-plated mating contacts and tin-plated posts for reliable solder termination. The part is currently active in production with full inventory availability. Substitute parts are identified when equivalent electrical and mechanical parameters align with the original specification, enabling component interchangeability in applications where form factor and performance requirements match.

Substiute Parts

SS-110-S-2

Samtec Inc.In Stock: 1046SS-110-S-2 Datasheet

Current PartRFQ

346-93-110-41-013000

Mill-Max Manufacturing Corp.In Stock: 898346-93-110-41-013000 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

The substitute part 346-93-110-41-013000 (Mill-Max Manufacturing Corp.) qualifies as an equivalent based on the following critical parameters:

• Position Count & Pitch: Both parts provide 10 positions at 0.100" (2.54mm) mating pitch, ensuring mechanical and electrical compatibility in standard 0.1" grid applications
• Mounting Configuration: Both utilize through-hole mounting for PCB integration
• Contact Material & Finish: Both employ beryllium copper mating contacts with gold plating, meeting electrical conductivity and corrosion resistance requirements
• Operating Temperature: Both rated -55°C ~ 125°C, suitable for identical thermal environments
• Compliance: Both achieve ROHS3 compliance and MSL 1 rating, meeting regulatory and moisture handling requirements

The primary distinction lies in termination method (solder vs. press-fit) and post construction, which do not affect mating interface compatibility when proper PCB footprint design is applied.

Parameter Comparison

Engineering Selection Recommendations

Both the SS-110-S-2 and 346-93-110-41-013000 maintain active production status with confirmed inventory availability. Selection between these parts depends on PCB assembly process requirements: the SS-110-S-2 accommodates wave or reflow soldering workflows, while the 346-93-110-41-013000 integrates into press-fit assembly processes. Both achieve ROHS3 compliance and MSL 1 rating, confirming suitability for standard industrial and commercial applications across the specified -55°C to 125°C operating range. The increased gold plating thickness on the Mill-Max part (30.0µin vs. 10.0µin) provides enhanced contact durability in high-cycle mating applications.

Frequently Asked Questions (FAQ)

Q: Can the 346-93-110-41-013000 directly replace the SS-110-S-2 on existing PCBs?

A: Direct replacement requires PCB footprint compatibility. The SS-110-S-2 uses solder termination with specific post dimensions (0.125" length), while the 346-93-110-41-013000 uses press-fit termination with 0.175" post length. Footprint redesign may be necessary to accommodate the different post geometry and termination method.

Q: Are the mating interfaces electrically identical?

A: Yes. Both parts employ 10-position 0.100" pitch beryllium copper contacts with gold plating. Mating interface compatibility is confirmed for standard 0.1" grid header pins and receptacles.

Q: What is the significance of the gold plating thickness difference?

A: The Mill-Max part specifies 30.0µin (0.76µm) mating contact gold plating compared to 10.0µin (0.25µm) on the Samtec part. Thicker plating extends contact life in applications with frequent mating cycles and provides improved corrosion resistance in harsh environments.

Q: Do both parts meet the same compliance standards?

A: Yes. Both achieve ROHS3 compliance and carry MSL 1 (Unlimited) moisture sensitivity rating, confirming equivalence for regulatory and storage requirements.

Q: Which termination method is preferred for high-volume assembly?

A: Selection depends on existing assembly infrastructure. Solder termination (SS-110-S-2) integrates with wave and reflow processes; press-fit termination (346-93-110-41-013000) eliminates solder process steps and reduces thermal stress on components.