SPMWHT541MK7XAVMS0 Equivalent & Substitute Parts

Part Overview

The SPMWHT541MK7XAVMS0 is a Samsung Semiconductor LM561C series warm white LED designed for surface mount applications. This component operates at 3000K color temperature with a forward voltage of 2.75V and 65mA test current, delivering 30 lumens at 25°C. The part is classified as Last Time Buy, indicating discontinued production status. Identifying equivalent substitute parts is necessary to ensure design continuity and maintain supply chain reliability for ongoing production requirements.

Substiute Parts

SPMWHT541MK7XAVMS0
Samsung Semiconductor, Inc.In Stock: 1080SPMWHT541MK7XAVMS0 Datasheet
SPMWHT541MK7XAVMS0
Current Part
SPMWHT541ML7XAVMS0
Samsung Semiconductor, Inc.In Stock: 1156SPMWHT541ML7XAVMS0 Datasheet
SPMWHT541ML7XAVMS0
MFR Recommended

Key Parameters

Parameter Value
Series LM561C
Color White, Warm
CCT (K) 3000K
Flux @ 25°C, Current - Test 30lm (28lm ~ 32lm)
Current - Test 65mA
Voltage - Forward (Vf) (Typ) 2.75V
Lumens/Watt @ Current - Test 168 lm/W
CRI (Color Rendering Index) 90
Current - Max 200mA
Viewing Angle 120°
Mounting Type Surface Mount
Thermal Resistance of Package 12°C/W
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the SPMWHT541MK7XAVMS0 is determined by the following critical parameters:

  • Series compatibility: LM561C
  • Color specification: White, Warm
  • Correlated color temperature: 3000K
  • Forward voltage: 2.75V (Typ)
  • Test current: 65mA
  • Maximum current rating: 200mA
  • Color rendering index: 90
  • Viewing angle: 120°
  • Thermal resistance: 12°C/W
  • Regulatory compliance: RoHS and REACH status

The substitute part SPMWHT541ML7XAVMS0 maintains all critical electrical and optical parameters within acceptable tolerances. Both parts belong to the LM561C series and share identical color temperature, forward voltage, test current, maximum current, CRI, viewing angle, and thermal characteristics. Package form factor differences (2212 versus 5630 metric designation) represent mechanical variations that do not affect electrical substitutability when PCB layout accommodates the dimensional change.

Parameter Comparison

Parameter SPMWHT541MK7XAVMS0 SPMWHT541ML7XAVMS0
Manufacturer Samsung Semiconductor, Inc. Samsung Semiconductor, Inc.
Series LM561C LM561C
Product Status Last Time Buy Active
Color White, Warm White, Warm
CCT (K) 3000K 3000K
Flux @ 25°C, Current - Test 30lm (28lm ~ 32lm) 28lm (25lm ~ 31lm)
Current - Test 65mA 65mA
Voltage - Forward (Vf) (Typ) 2.75V 2.75V
Lumens/Watt @ Current - Test 168 lm/W 157 lm/W
CRI (Color Rendering Index) 90 90
Current - Max 200mA 200mA
Viewing Angle 120° 120°
Mounting Type Surface Mount Surface Mount
Package / Case 2212 (5630 Metric) 4-SMD, Flat Leads (5630)
Size / Dimension 0.209" L x 0.118" W (5.30mm x 3.00mm) 0.197" L x 0.118" W (5.00mm x 3.00mm)
Height - Seated (Max) 0.035" (0.90mm) 0.031" (0.80mm)
Thermal Resistance of Package 12°C/W 12°C/W
RoHS Status ROHS3 Compliant RoHS Compliant
REACH Status REACH Unaffected Not specified
Packaging Tape & Reel (TR) Tape & Reel (TR)

Engineering Selection Recommendations

The SPMWHT541ML7XAVMS0 is the manufacturer-recommended substitute for the SPMWHT541MK7XAVMS0. The substitute part maintains Active product status, ensuring long-term availability and supply chain stability compared to the Last Time Buy status of the original part.

Both parts satisfy RoHS compliance requirements. The substitute achieves RoHS Compliant status while the original part is ROHS3 Compliant, both meeting current regulatory standards for electronic component manufacturing.

Electrical performance remains functionally equivalent across all critical parameters: identical forward voltage (2.75V), test current (65mA), maximum current (200mA), color temperature (3000K), CRI (90), and viewing angle (120°). Luminous flux at 25°C shows a minor variance of 2 lumens within the tolerance band, and lumens per watt efficiency decreases by 11 lm/W, representing acceptable performance variation for LED component substitution.

Mechanical differences include reduced package dimensions (5.00mm length versus 5.30mm, 0.80mm height versus 0.90mm) and package lead configuration change from 2212 to 4-SMD flat leads. These variations require PCB layout verification to confirm footprint compatibility and solder pad alignment before implementation.

Frequently Asked Questions (FAQ)

Q: Can SPMWHT541ML7XAVMS0 replace SPMWHT541MK7XAVMS0 in existing designs?

A: Electrical substitution is valid based on matching forward voltage, test current, color temperature, CRI, and thermal resistance. Mechanical compatibility requires PCB layout review due to package dimension and lead configuration differences.

Q: What are the key differences between these two parts?

A: The primary differences are product status (Last Time Buy versus Active), package form factor (2212 versus 4-SMD flat leads), physical dimensions (5.30mm x 3.00mm x 0.90mm versus 5.00mm x 3.00mm x 0.80mm), and luminous efficiency (168 lm/W versus 157 lm/W). Electrical characteristics remain equivalent.

Q: Are there compliance concerns with substitution?

A: Both parts meet RoHS requirements. The substitute part is RoHS Compliant while the original is ROHS3 Compliant. Both satisfy current regulatory standards for electronic component use.

Q: What is the luminous flux difference between these parts?

A: The original part delivers 30lm (28lm ~ 32lm) at 25°C, while the substitute delivers 28lm (25lm ~ 31lm). The 2-lumen difference falls within acceptable tolerance bands for LED component performance.

Q: Does the package change affect thermal performance?

A: Both parts maintain identical thermal resistance of 12°C/W. The reduced height of the substitute part (0.80mm versus 0.90mm) does not degrade thermal characteristics.

Q: What PCB modifications are necessary for substitution?

A: Footprint verification is required due to package dimension changes and lead configuration differences. The substitute part's smaller footprint (5.00mm length) and flat lead configuration may require solder pad repositioning or redesign of the component landing pattern.

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