SPMWHT541MD5WAR0SB LED Equivalent & Substitute Parts

Part Overview

The SPMWHT541MD5WAR0SB is a Samsung Semiconductor LM561B series cool white LED (5000K) designed for surface mount lighting applications. This component features a 5630 package format with 4-SMD flat lead exposed pad configuration, delivering 31 lumens at 65mA test current with 2.95V forward voltage.

The SPMWHT541MD5WAR0SB carries a "Not For New Designs" product status designation. This status necessitates identification of functionally equivalent substitute components for ongoing production requirements and new design implementations. Substitute parts must maintain electrical compatibility across critical parameters including color temperature, forward voltage, test current, viewing angle, and package dimensions.

Substiute Parts

SPMWHT541MD5WAR0SB

Samsung Semiconductor, Inc.In Stock: 630SPMWHT541MD5WAR0SB Datasheet

Current PartRFQ

SPMWHT541MP5WARKS4

Samsung Semiconductor, Inc.In Stock: 73422SPMWHT541MP5WARKS4 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the SPMWHT541MD5WAR0SB is determined by strict alignment across the following critical parameters:

Electrical Compatibility Requirements:

• Color and correlated color temperature (CCT): White, Cool 5000K
• Forward voltage (Vf): 2.95V nominal
• Test current: 65mA
• Viewing angle: 120°
• CRI: 80

Mechanical Compatibility Requirements:

• Package type: 4-SMD configuration
• Supplier device package: 5630
• Physical dimensions: 5.00mm × 3.00mm
• Mounting type: Surface Mount

Environmental & Compliance Requirements:

• RoHS compliance status
• Moisture sensitivity level: 2A (4 Weeks)

The SPMWHT541MP5WARKS4 qualifies as a direct substitute based on matching all electrical and mechanical parameters. Both components operate at identical test conditions (65mA, 2.95V) and share the same 5630 package footprint and viewing angle specification.

Parameter Comparison

Engineering Selection Recommendations

For Existing Production (SPMWHT541MD5WAR0SB Replacement):

The SPMWHT541MP5WARKS4 provides direct functional substitution. Both components operate at identical electrical specifications (2.95V, 65mA test current) and share the same 5630 package footprint. The substitute delivers enhanced luminous efficacy (177 lm/W versus 162 lm/W) and higher maximum current rating (180mA versus 150mA), representing a performance improvement within the same form factor.

For New Design Implementation:

The SPMWHT541MP5WARKS4 is the recommended selection. This component carries "Active" product status, ensuring long-term availability and supply chain continuity. The LM561B Plus series designation indicates an enhanced generation of the LM561B platform with improved efficiency metrics. ROHS3 compliance provides enhanced environmental regulatory alignment compared to the RoHS Compliant status of the main part.

Packaging Consideration:

The main part (SPMWHT541MD5WAR0SB) is supplied in Tape & Reel (TR) format, while the substitute (SPMWHT541MP5WARKS4) is supplied in Cut Tape (CT) format. Both packaging formats are suitable for surface mount assembly processes. Procurement and inventory management workflows should account for this packaging difference.

Thermal Performance:

The substitute component exhibits marginally superior thermal characteristics (15°C/W versus 16°C/W), indicating improved heat dissipation capability. This parameter difference is negligible for most application contexts but provides a minor advantage in thermally constrained designs.

Frequently Asked Questions (FAQ)

Q: Can SPMWHT541MP5WARKS4 be used as a direct replacement for SPMWHT541MD5WAR0SB in existing PCB designs?

A: Yes. Both components share identical electrical operating parameters (2.95V forward voltage, 65mA test current) and the same 5630 package footprint with 5.00mm × 3.00mm dimensions. PCB layout and schematic integration require no modification. The substitute is electrically and mechanically interchangeable.

Q: What is the difference between "Flat Lead Exposed Pad" and "Flat Leads" package descriptions?

A: Both designations refer to 4-SMD surface mount configurations within the 5630 package family. The exposed pad variant includes a thermal pad for enhanced heat dissipation. The flat leads variant uses standard lead configuration. Both are compatible with standard surface mount assembly equipment and reflow processes.

Q: Why does the substitute part show higher luminous flux (34 lm versus 31 lm) at identical test conditions?

A: The SPMWHT541MP5WARKS4 represents the LM561B Plus series, which is an enhanced generation of the LM561B platform. The higher flux output (34 lm at 65mA) reflects improved LED die efficiency and manufacturing process enhancements. This represents a performance upgrade, not a compatibility issue.

Q: Are there any thermal management differences between these components?

A: The substitute exhibits lower thermal resistance (15°C/W versus 16°C/W), indicating marginally improved heat dissipation. This difference is minor and does not affect thermal design calculations for most applications. Both components operate within the same thermal envelope for standard lighting applications.

Q: What is the significance of "Not For New Designs" status on the main part?

A: This designation indicates that the SPMWHT541MD5WAR0SB is in mature or end-of-life phase and is not recommended for new product development. The SPMWHT541MP5WARKS4 carries "Active" status, confirming ongoing manufacturing and supply availability. New designs should specify the substitute component.

Q: Do both components require identical moisture handling procedures?

A: Yes. Both components carry MSL 2A (4 Weeks) rating, requiring identical moisture sensitivity management. Storage, handling, and reflow procedures specified for MSL 2A components apply uniformly to both parts.

Q: What is the difference between Tape & Reel (TR) and Cut Tape (CT) packaging?

A: Tape & Reel packaging supplies components on continuous carrier tape wound on reels, suitable for high-volume automated assembly. Cut Tape packaging supplies components on cut segments of carrier tape, suitable for lower-volume or mixed-component assembly runs. Both formats are compatible with standard pick-and-place equipment. Procurement quantities and inventory management may differ based on packaging format selection.