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SPD74R-682M Equivalent & Substitute Parts
Part Overview
The SPD74R-682M is a 6.8 µH shielded drum core wirewound inductor manufactured by API Delevan Inc., designed for surface mount applications requiring moderate current handling and low DC resistance. This component is classified as Active product status with full RoHS3 compliance and unlimited moisture sensitivity rating. Substitute parts become necessary when addressing specific application constraints such as package size optimization, current rating requirements, or supply chain availability while maintaining core electrical performance within the 6.8 µH inductance specification.
Substiute Parts
Key Parameters
| Parameter | Value | Unit | Significance for Substitution |
|---|---|---|---|
| Inductance | 6.8 | µH | Primary electrical specification; must match exactly |
| Inductance Tolerance | ±20% | % | Defines acceptable inductance range |
| Current Rating (Continuous) | 3.4 | A | Maximum continuous current handling capability |
| Current - Saturation (Isat) | 3.4 | A | Current at which inductance begins to degrade |
| DC Resistance (DCR) | 42 | mOhm Max | Determines power loss and thermal performance |
| Core Material | Ferrite | — | Affects frequency response and shielding effectiveness |
| Shielding | Shielded | — | Electromagnetic interference containment requirement |
| Operating Temperature Range | -55°C to 125°C | °C | Defines thermal operating envelope |
| Mounting Type | Surface Mount | — | PCB assembly compatibility |
| Package Type | Nonstandard | — | Physical footprint and height constraints |
| Size / Dimension | 7.30 x 7.30 x 4.70 | mm | PCB layout and thermal management space |
| RoHS Status | ROHS3 Compliant | — | Environmental and regulatory compliance |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | — | Storage and handling requirements |
Substitute Part Grouping Explanation
Substitution eligibility for the SPD74R-682M is determined by strict adherence to the following electrical and mechanical parameters:
Primary Substitution Criteria (Non-Negotiable):
- Inductance value: 6.8 µH (exact match required)
- Inductance tolerance: ±20% (matching tolerance band)
- Core material: Ferrite (maintains frequency response characteristics)
- Shielding: Shielded configuration (electromagnetic containment requirement)
- Mounting type: Surface Mount (PCB assembly compatibility)
- Inductance test frequency: 100 kHz (measurement standard consistency)
Secondary Substitution Criteria (Application-Dependent):
- Current rating: Substitute must meet or exceed application current requirements
- DC resistance: Lower or equal DCR values are acceptable; higher values increase power dissipation
- Operating temperature range: Substitute range must encompass application operating conditions
- Package dimensions: Physical constraints may limit substitution based on PCB layout
- Compliance certifications: RoHS3 and MSL ratings must match or exceed original specification
The VLS5045EX-6R8M-H qualifies as a substitute based on matching inductance, tolerance, core material, shielding, and mounting type. Differences in current rating, DCR, and package dimensions require application-specific evaluation.
Parameter Comparison
| Parameter | SPD74R-682M (API Delevan) | VLS5045EX-6R8M-H (TDK) | Compatibility Notes |
|---|---|---|---|
| Inductance | 6.8 µH | 6.8 µH | Exact match |
| Inductance Tolerance | ±20% | ±20% | Identical tolerance band |
| Current Rating (Amps) | 3.4 A | 2.9 A | TDK rated 0.5 A lower; verify application requirement |
| Current - Saturation (Isat) | 3.4 A | 3.6 A | TDK saturation point 0.2 A higher |
| DC Resistance (DCR) | 42 mOhm Max | 59.8 mOhm Max | TDK DCR 17.8 mOhm higher; increases power loss |
| Core Material | Ferrite | Ferrite | Identical core material |
| Shielding | Shielded | Shielded | Both provide EMI containment |
| Operating Temperature Range | -55°C to 125°C | -40°C to 125°C | API Delevan range 15°C wider at lower end |
| Mounting Type | Surface Mount | Surface Mount | Identical mounting technology |
| Size / Dimension (L x W x H) | 7.30 x 7.30 x 4.70 mm | 5.30 x 5.00 x 4.50 mm | TDK package 27% smaller footprint; height difference 0.2 mm |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Both meet environmental requirements |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | Identical MSL rating |
| Product Status | Active | Active | Both components actively manufactured |
| Ratings | — | AEC-Q200 | TDK includes automotive qualification |
Engineering Selection Recommendations
SPD74R-682M Selection Criteria:
- Applications requiring continuous current operation at 3.4 A or near maximum rating
- Systems operating at temperatures below -40°C (extended low-temperature range requirement)
- Designs where DC resistance must remain at or below 42 mOhm to minimize thermal dissipation
- PCB layouts accommodating 7.30 x 7.30 mm footprint
- Non-automotive applications or those not requiring AEC-Q200 qualification
VLS5045EX-6R8M-H Selection Criteria:
- Applications with continuous current requirements at 2.9 A or lower
- Designs requiring compact package footprint (5.30 x 5.00 mm, 27% smaller than API Delevan)
- Automotive or mission-critical applications benefiting from AEC-Q200 qualification
- Systems where higher DC resistance (59.8 mOhm) is acceptable within thermal budget
- Operating temperature range limited to -40°C minimum (does not extend to -55°C)
Compliance Basis: Both components maintain RoHS3 compliance and unlimited MSL rating, ensuring equivalent environmental and handling requirements. The TDK component includes AEC-Q200 automotive qualification, providing additional reliability assurance for automotive and high-reliability applications. Product status is Active for both manufacturers, ensuring continued availability and supply chain stability.
Frequently Asked Questions (FAQ)
Q: Can VLS5045EX-6R8M-H directly replace SPD74R-682M in all applications?
A: Direct substitution requires verification of three parameters: (1) application continuous current requirement must not exceed 2.9 A, (2) acceptable DC resistance must accommodate the additional 17.8 mOhm increase, and (3) minimum operating temperature must remain at -40°C or higher. If all three conditions are met, substitution is electrically and mechanically compatible.
Q: What is the impact of the 17.8 mOhm DCR difference between these components?
A: At 2.9 A continuous current, the TDK component dissipates approximately 0.50 W (2.9² × 0.0598), compared to 0.35 W for the API Delevan component (2.9² × 0.042). This 0.15 W additional dissipation requires thermal management evaluation in power-sensitive applications. At the API Delevan rated current of 3.4 A, the TDK component would dissipate 0.69 W, exceeding its continuous current rating.
Q: Why does the TDK component have a higher saturation current (3.6 A) but lower continuous current rating (2.9 A)?
A: Saturation current and continuous current rating are distinct parameters. Saturation current indicates the point at which inductance begins to degrade; continuous current rating reflects the maximum current the component can sustain indefinitely without exceeding thermal limits. The TDK component's higher saturation point does not permit higher continuous operation due to thermal constraints of the smaller package.
Q: Are there temperature range implications for substitution?
A: The API Delevan component operates from -55°C to 125°C, while the TDK component operates from -40°C to 125°C. Applications requiring operation below -40°C must use the API Delevan component. Both components support the full 125°C upper temperature limit.
Q: What does AEC-Q200 qualification mean for the TDK component?
A: AEC-Q200 is an automotive industry standard qualification for passive components, requiring compliance with specific reliability, environmental stress, and performance testing protocols. This qualification is relevant for automotive applications, industrial equipment subject to automotive-grade reliability standards, and mission-critical systems. Non-automotive applications do not require this certification.
Q: How do the package dimension differences affect PCB design?
A: The TDK component footprint is 5.30 x 5.00 mm compared to the API Delevan 7.30 x 7.30 mm, representing approximately 27% reduction in board area. Height difference is minimal (4.50 mm vs 4.70 mm). Substitution to the smaller TDK package provides PCB layout flexibility but requires verification that the smaller footprint is compatible with existing PCB design and assembly equipment.
Q: Can the SPD74R-682M be substituted with VLS5045EX-6R8M-H in a 3.4 A application?
A: No. The TDK component is rated for 2.9 A continuous current. Operating at 3.4 A would exceed the component's thermal rating and void performance specifications. The API Delevan component must be retained for applications requiring 3.4 A continuous operation.
Q: Are both components suitable for high-frequency switching applications?
A: Both components are tested at 100 kHz inductance measurement frequency and feature ferrite core material with shielding, making them suitable for switching power supply and RF filtering applications within their respective current ratings. Frequency response characteristics are equivalent between the two components.
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