SPC5604BAMLL6 Equivalent & Substitute Parts

Part Overview

The SPC5604BAMLL6 is an e200z0h MPC56xx Qorivva 32-bit single-core microcontroller IC manufactured by NXP USA Inc. This embedded processor operates at 64MHz with 512KB FLASH program memory and is housed in a 100-LQFP (14x14) surface mount package. The device integrates CANbus, I2C, LINbus, SCI, and SPI connectivity interfaces alongside DMA, POR, PWM, and WDT peripherals. With an active product status and ROHS3 compliance, the SPC5604BAMLL6 serves automotive and industrial embedded applications requiring robust real-time processing capabilities. Equivalent substitute parts are identified based on matching core processor architecture, memory configuration, package form factor, and electrical specifications.

Substiute Parts

SPC5604BAMLL6

NXP USA Inc.In Stock: 2300SPC5604BAMLL6 Datasheet

Current PartRFQ

SPC5604BF2MLL6

NXP USA Inc.In Stock: 1966SPC5604BF2MLL6 Datasheet

Parametric EquivalentRFQ

SPC5604BAMLL6

NXP USA Inc.In Stock: 2300SPC5604BAMLL6 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the SPC5604BAMLL6 are identified through strict parametric equivalence across the following critical criteria:

Core Architecture Match: All substitute parts utilize the identical e200z0h core processor within the MPC56xx Qorivva series, ensuring instruction set compatibility and firmware portability.

Memory Configuration: Substitute parts maintain identical program memory (512KB FLASH), EEPROM (64K x 8), and RAM (32K x 8) specifications, guaranteeing functional equivalence in data storage and execution capacity.

Electrical Specifications: Supply voltage range (3V ~ 5.5V), operating temperature range (-40°C ~ 125°C), and analog-to-digital converter configuration (A/D 28x10b) remain constant across all equivalent parts.

Interface and Peripheral Set: CANbus, I2C, LINbus, SCI, and SPI connectivity, combined with DMA, POR, PWM, and WDT peripherals, are preserved across all substitute options.

Package and Mounting: All substitute parts are housed in the 100-LQFP (14x14) surface mount package, maintaining identical PCB footprint and land pattern compatibility.

Compliance and Certification: All substitute parts maintain ROHS3 compliance, identical MSL rating (3, 168 Hours), and active product status.

The only variable parameter among substitute parts is the packaging format (Tray vs. unspecified), which does not affect electrical or functional performance.

Parameter Comparison

Engineering Selection Recommendations

Both the SPC5604BAMLL6 and SPC5604BF2MLL6 are functionally equivalent microcontroller ICs with identical electrical, memory, and interface specifications. Selection between these parts is determined by supply chain availability and packaging requirements rather than technical performance criteria.

The SPC5604BAMLL6 is suitable for applications where packaging format is not a constraint or where unspecified packaging is acceptable. The SPC5604BF2MLL6, supplied in Tray packaging, is appropriate for high-volume manufacturing environments requiring standardized packaging formats for automated handling and inventory management.

Both parts maintain active product status with NXP USA Inc., ensuring long-term availability and continued manufacturer support. ROHS3 compliance and identical MSL ratings (3, 168 Hours) confirm equivalent environmental and handling requirements across both options.

Frequently Asked Questions (FAQ)

Q: Are SPC5604BAMLL6 and SPC5604BF2MLL6 pin-for-pin compatible?

A: Yes. Both parts utilize the identical 100-LQFP (14x14) package with 79 I/O pins in the same configuration. PCB footprint and land pattern are identical, enabling direct substitution without layout modifications.

Q: Can firmware developed for the SPC5604BAMLL6 run on the SPC5604BF2MLL6?

A: Yes. Both parts employ the identical e200z0h core processor within the MPC56xx Qorivva architecture. Instruction set, memory organization, and peripheral register maps are identical, ensuring complete firmware portability without modification.

Q: What is the difference between the two part numbers?

A: The primary difference is packaging format. The SPC5604BAMLL6 uses unspecified packaging, while the SPC5604BF2MLL6 is supplied in Tray format. All electrical, functional, and performance specifications are identical.

Q: Are there any differences in memory configuration between these parts?

A: No. Both parts contain identical program memory (512KB FLASH), EEPROM (64K x 8), and RAM (32K x 8) configurations. Memory performance and capacity are equivalent.

Q: Do both parts support the same connectivity interfaces?

A: Yes. Both parts integrate CANbus, I2C, LINbus, SCI, and SPI interfaces with identical peripheral support (DMA, POR, PWM, WDT). Interface functionality and performance are equivalent.

Q: What are the handling and storage requirements for these parts?

A: Both parts carry an MSL rating of 3 with a 168-hour floor life. Identical moisture sensitivity and handling precautions apply to both options. Storage conditions and reflow soldering parameters are equivalent.

Q: Can I use these parts interchangeably in production?

A: Yes. From an engineering perspective, these parts are fully interchangeable. Selection should be based on packaging availability, supply chain logistics, and manufacturing process requirements rather than technical performance differences.