SPC5603BAVLL4 Equivalent & Substitute Parts

Part Overview

The SPC5603BAVLL4 is a 32-bit single-core embedded microcontroller from NXP USA Inc.'s MPC56xx Qorivva series. This device integrates an e200z0h processor core operating at 48MHz with 384KB FLASH program memory, 64KB EEPROM, and 28KB RAM in a 100-LQFP surface mount package. The microcontroller supports multiple communication protocols including CANbus, I2C, LINbus, SCI, and SPI, making it suitable for automotive and industrial control applications. With active product status and ROHS3 compliance, the SPC5603BAVLL4 remains in production. Equivalent substitute parts are available within the same product family to address inventory availability or specific procurement requirements.

Substiute Parts

SPC5603BAVLL4
NXP USA Inc.In Stock: 743SPC5603BAVLL4 Datasheet
SPC5603BAVLL4
Current Part
SPC5603BK0VLL4
NXP USA Inc.In Stock: 1179SPC5603BK0VLL4 Datasheet
SPC5603BK0VLL4
Parametric Equivalent
SPC5603BF2VLL4
NXP USA Inc.In Stock: 788SPC5603BF2VLL4 Datasheet
SPC5603BF2VLL4
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer NXP USA Inc.
Series MPC56xx Qorivva
Core Processor e200z0h
Core Size 32-Bit Single-Core
Speed 48MHz
Program Memory Size 384KB (384K x 8)
Program Memory Type FLASH
EEPROM Size 64K x 8
RAM Size 28K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 28x10b
Number of I/O 79
Connectivity CANbus, I2C, LINbus, SCI, SPI
Peripherals DMA, POR, PWM, WDT
Operating Temperature -40°C ~ 105°C (TA)
Package / Case 100-LQFP (14x14)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Product Status Active

Substitute Part Grouping Explanation

Substitute parts for the SPC5603BAVLL4 are identified based on identical electrical and mechanical specifications. The substitution criteria are strictly defined by the following parameters:

  • Core processor architecture (e200z0h)
  • Processing speed (48MHz)
  • Memory configuration (384KB FLASH, 64KB EEPROM, 28KB RAM)
  • Voltage supply range (3V ~ 5.5V)
  • I/O count (79 pins)
  • Communication interfaces (CANbus, I2C, LINbus, SCI, SPI)
  • Peripheral set (DMA, POR, PWM, WDT)
  • Package type (100-LQFP 14x14)
  • Operating temperature range (-40°C ~ 105°C)
  • Compliance certifications (ROHS3, REACH Unaffected)

Parts meeting all these criteria are classified as parametric equivalents and direct substitutes. Variations in part number suffix indicate different manufacturing batches or internal revisions that do not affect functional or electrical compatibility.

Parameter Comparison

Parameter SPC5603BAVLL4 SPC5603BK0VLL4 SPC5603BF2VLL4
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc.
Series MPC56xx Qorivva MPC56xx Qorivva MPC56xx Qorivva
Core Processor e200z0h e200z0h e200z0h
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 48MHz 48MHz 48MHz
Program Memory Size 384KB (384K x 8) 384KB (384K x 8) 384KB (384K x 8)
Program Memory Type FLASH FLASH FLASH
EEPROM Size 64K x 8 64K x 8 64K x 8
RAM Size 28K x 8 28K x 8 28K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V
Data Converters A/D 28x10b A/D 28x10b A/D 28x10b
Number of I/O 79 79 79
Connectivity CANbus, I2C, LINbus, SCI, SPI CANbus, I2C, LINbus, SCI, SPI CANbus, I2C, LINbus, SCI, SPI
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Package / Case 100-LQFP (14x14) 100-LQFP (14x14) 100-LQFP (14x14)
Mounting Type Surface Mount Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours) 3 (168 Hours)
Product Status Active Active Active

Engineering Selection Recommendations

All three parts—SPC5603BAVLL4, SPC5603BK0VLL4, and SPC5603BF2VLL4—are active products from NXP USA Inc. with identical electrical and mechanical specifications. Selection between these parts is based on availability and procurement requirements rather than functional differences.

Both substitute parts maintain full compliance with ROHS3 and REACH standards. Moisture sensitivity level (MSL 3, 168 hours) is consistent across all variants, requiring identical handling and storage protocols during manufacturing and assembly.

The 100-LQFP package format is standardized across all three parts, ensuring pin-for-pin compatibility and identical PCB footprint requirements. No design modifications are necessary when substituting between these part numbers.

Frequently Asked Questions (FAQ)

Q: Are SPC5603BK0VLL4 and SPC5603BF2VLL4 direct replacements for SPC5603BAVLL4?

A: Yes. All three parts share identical core processor architecture, memory configuration, operating speed, voltage specifications, I/O count, communication interfaces, and package format. They are parametric equivalents with no functional differences.

Q: Do these substitute parts require different PCB layouts or design modifications?

A: No. The 100-LQFP (14x14) package is identical across all three parts. Pin assignments, signal routing, and PCB footprints remain unchanged. No design modifications are required.

Q: Are there differences in compliance certifications between these parts?

A: No. All three parts maintain identical ROHS3 compliance and REACH unaffected status. Moisture sensitivity level (MSL 3, 168 hours) is consistent, requiring the same handling and storage protocols.

Q: Can these parts be used interchangeably in production?

A: Yes. The parts are functionally and electrically identical. Firmware and software compatibility is maintained across all variants. Production assembly processes remain unchanged.

Q: What determines the part number suffix differences (BAVLL4, BK0VLL4, BF2VLL4)?

A: Part number suffixes indicate manufacturing batch codes or internal revision identifiers. These variations do not affect electrical performance, memory configuration, or operational characteristics.

Q: Are operating temperature ranges identical across all three parts?

A: Yes. All parts operate across the same temperature range of -40°C to 105°C (TA), ensuring compatibility in identical thermal environments.

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