SPC5602BF2MLL6 Equivalent & Substitute Parts

Part Overview

The SPC5602BF2MLL6 is a 32-bit single-core microcontroller from NXP USA Inc. in the MPC56xx Qorivva series, featuring 256KB FLASH memory, 64MHz operation, and comprehensive automotive-grade connectivity including CANbus, I2C, LINbus, SCI, and SPI interfaces. The device is actively produced and widely deployed in embedded control applications requiring real-time processing capabilities.

Substitute parts are identified when equivalent electrical and mechanical parameters align with the main part's core specifications, enabling direct replacement in applications where memory capacity or specific feature sets permit functional equivalence.

Key Parameters

Parameter	SPC5602BF2MLL6
Core Processor	e200z0h
Core Size	32-Bit Single-Core
Speed	64MHz
Program Memory Size	256KB (256K x 8) FLASH
RAM Size	24K x 8
EEPROM Size	64K x 8
Voltage Supply (Vcc/Vdd)	3V ~ 5.5V
Data Converters	A/D 28x10b
Connectivity	CANbus, I2C, LINbus, SCI, SPI
Peripherals	DMA, POR, PWM, WDT
Number of I/O	79
Package / Case	100-LQFP (14x14)
Operating Temperature	-40°C ~ 125°C (TA)
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the SPC5602BF2MLL6 is determined by strict alignment of the following critical parameters:

Core processor architecture (e200z0h)
Core configuration (32-Bit Single-Core)
Operating frequency (64MHz)
Package form factor (100-LQFP 14x14)
Supply voltage range (3V ~ 5.5V)
Connectivity interfaces (CANbus, I2C, LINbus, SCI, SPI)
Peripheral feature set (DMA, POR, PWM, WDT)
I/O pin count (79)
Data converter specification (A/D 28x10b)
Operating temperature range (-40°C ~ 125°C)
Compliance certifications (ROHS3, REACH Unaffected)

The SPC560C50L3C6E0X qualifies as a manufacturer-recommended substitute based on matching all critical electrical and mechanical parameters. Variations in program memory capacity (512KB vs. 256KB), RAM size (48K x 8 vs. 24K x 8), and EEPROM availability do not preclude substitution when application firmware requirements accommodate the increased memory resources.

Parameter Comparison

Parameter	SPC5602BF2MLL6	SPC560C50L3C6E0X	Compatibility
Manufacturer	NXP USA Inc.	STMicroelectronics	Different manufacturer
Core Processor	e200z0h	e200z0h	Identical
Core Size	32-Bit Single-Core	32-Bit Single-Core	Identical
Speed	64MHz	64MHz	Identical
Program Memory Size	256KB (256K x 8)	512KB (512K x 8)	Substitute has greater capacity
RAM Size	24K x 8	48K x 8	Substitute has greater capacity
EEPROM Size	64K x 8	Not specified	Difference noted
Voltage Supply (Vcc/Vdd)	3V ~ 5.5V	3V ~ 5.5V	Identical
Data Converters	A/D 28x10b	A/D 28x10b	Identical
Connectivity	CANbus, I2C, LINbus, SCI, SPI	CANbus, I2C, LINbus, SCI, SPI	Identical
Peripherals	DMA, POR, PWM, WDT	DMA, POR, PWM, WDT	Identical
Number of I/O	79	79	Identical
Package / Case	100-LQFP (14x14)	100-LQFP (14x14)	Identical
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)	Identical
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	Identical
Moisture Sensitivity Level (MSL)	3 (168 Hours)	3 (168 Hours)	Identical
Grade	Not specified	Automotive	Substitute includes automotive qualification
Qualification	Not specified	AEC-Q100	Substitute includes AEC-Q100 qualification

Engineering Selection Recommendations

The SPC560C50L3C6E0X is designated as the manufacturer-recommended substitute for the SPC5602BF2MLL6. Both devices maintain identical core processor architecture, operating frequency, supply voltage range, connectivity interfaces, peripheral feature set, I/O configuration, and package form factor.

The SPC560C50L3C6E0X provides increased program memory (512KB vs. 256KB) and RAM capacity (48K x 8 vs. 24K x 8), which represents a superset of the original part's capabilities. Applications designed for the SPC5602BF2MLL6 will operate within the resource envelope of the SPC560C50L3C6E0X without modification.

The SPC560C50L3C6E0X carries explicit automotive-grade designation and AEC-Q100 qualification, providing additional compliance documentation for applications requiring automotive standards compliance. Both parts maintain ROHS3 compliance and identical moisture sensitivity specifications.

Frequently Asked Questions (FAQ)

Q: Can the SPC560C50L3C6E0X directly replace the SPC5602BF2MLL6 in existing designs?

A: Yes. The substitute part maintains identical core processor, operating frequency, supply voltage range, package form factor, I/O count, and peripheral feature set. Pin-to-pin compatibility is preserved at the 100-LQFP package level.

Q: What are the differences in memory configuration between these parts?

A: The SPC560C50L3C6E0X provides 512KB program FLASH memory and 48K x 8 RAM, compared to 256KB FLASH and 24K x 8 RAM in the SPC5602BF2MLL6. The EEPROM specification for the SPC560C50L3C6E0X is not provided in the available documentation. Applications utilizing the original part's memory footprint will operate within the substitute's expanded memory resources.

Q: Are there connectivity or peripheral differences?

A: No. Both parts implement identical connectivity interfaces (CANbus, I2C, LINbus, SCI, SPI) and peripheral features (DMA, POR, PWM, WDT).

Q: What is the significance of the automotive qualification on the SPC560C50L3C6E0X?

A: The SPC560C50L3C6E0X carries automotive-grade designation and AEC-Q100 qualification. This provides additional compliance documentation for applications requiring automotive standards. The SPC5602BF2MLL6 does not specify automotive qualification in the available parameters.

Q: Are the operating temperature ranges identical?

A: Yes. Both parts operate across the -40°C to 125°C (TA) temperature range.

Q: Do both parts meet the same compliance standards?

A: Both parts are ROHS3 compliant and REACH unaffected. Both maintain MSL 3 (168 Hours) moisture sensitivity specifications. The SPC560C50L3C6E0X includes additional automotive-grade and AEC-Q100 qualifications.

Request Quote (Ships tomorrow)

Part Number

Quantity

Company

Contact Name

E-mail

Message