SPC5601DF1VLH4 Equivalent & Substitute Parts

Part Overview

The SPC5601DF1VLH4 is an e200z0h MPC56xx Qorivva 32-bit single-core microcontroller manufactured by NXP USA Inc. This embedded IC features 128KB FLASH program memory, 12KB RAM, and 4KB EEPROM, operating at 48MHz with integrated CANbus, LINbus, SCI, and SPI connectivity. The device is housed in a 64-LQFP (10x10) surface mount package and is actively produced. Identifying equivalent and substitute parts is essential for supply chain continuity, design flexibility, and procurement optimization when the primary part number becomes unavailable or when alternative sourcing is required.

Substiute Parts

SPC5601DF1VLH4

NXP USA Inc.In Stock: 4196SPC5601DF1VLH4 Datasheet

Current PartRFQ

SPC5601DF1VLH4

NXP USA Inc.In Stock: 4196SPC5601DF1VLH4 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the SPC5601DF1VLH4 is determined by strict alignment across the following critical parameters:

• Core processor architecture (e200z0h)
• Core configuration (32-bit single-core)
• Operating frequency (48MHz)
• Program memory capacity and type (128KB FLASH)
• RAM and EEPROM specifications (12K x 8 RAM, 4K x 16 EEPROM)
• Supply voltage range (3V ~ 5.5V)
• Integrated connectivity modules (CANbus, LINbus, SCI, SPI)
• Peripheral feature set (DMA, POR, PWM, WDT)
• I/O count (45 pins)
• Package form factor (64-LQFP 10x10)
• Operating temperature range (-40°C ~ 105°C)
• Compliance certifications (ROHS3, REACH Unaffected)

Only parts meeting all these specifications qualify as direct parametric equivalents.

Parameter Comparison

Engineering Selection Recommendations

The SPC5601DF1VLH4 maintains active product status with full ROHS3 compliance and REACH unaffected classification, ensuring regulatory alignment for current and future applications. When selecting equivalent parts, prioritize devices with identical active status and matching compliance certifications. The 64-LQFP package form factor and surface mount technology are standard for this microcontroller class and support automated assembly processes. Supply chain decisions should account for inventory availability, lead times, and manufacturer support continuity. All equivalent parts must maintain the specified operating temperature range (-40°C ~ 105°C) and moisture sensitivity level (MSL 3, 168 hours) to ensure reliability in target applications.

Frequently Asked Questions (FAQ)

Q: What defines a direct equivalent for the SPC5601DF1VLH4?

A: A direct equivalent must match all specified parameters: e200z0h core processor, 32-bit single-core architecture, 48MHz operation, 128KB FLASH, 12KB RAM, 4KB EEPROM, 3V–5.5V supply range, CANbus/LINbus/SCI/SPI connectivity, 45 I/O pins, 64-LQFP package, and -40°C to 105°C operating temperature.

Q: Can parts with different package types substitute for the SPC5601DF1VLH4?

A: No. The 64-LQFP (10x10) package is a critical specification. Different package types alter PCB layout, pin assignments, and thermal characteristics, making them incompatible for direct substitution.

Q: Are there variants of the SPC5601 with different memory configurations?

A: The provided data specifies only the SPC5601DF1VLH4 configuration with 128KB FLASH, 12KB RAM, and 4KB EEPROM. Variants with different memory sizes would be distinct part numbers and are not equivalent.

Q: What is the significance of the MSL 3 (168 Hours) rating?

A: MSL 3 indicates the device requires reflow soldering within 168 hours of moisture exposure. This affects storage, handling, and assembly procedures. Equivalent parts must maintain this same MSL rating.

Q: Does the SPC5601DF1VLH4 support in-circuit programming?

A: DiGi-Electronics programmability status is listed as Not Verified for this part number. Confirm programming requirements with application-specific documentation.

Q: What connectivity protocols are integrated into this microcontroller?

A: The SPC5601DF1VLH4 integrates CANbus, LINbus, SCI (Serial Communication Interface), and SPI (Serial Peripheral Interface) for automotive and industrial communication applications.