SPB35N10 G N-Channel MOSFET 100V 35A Equivalent & Substitute Parts

Part Overview

The SPB35N10 G is an N-Channel MOSFET manufactured by Infineon Technologies, rated for 100V drain-to-source voltage with 35A continuous drain current at 25°C. This device is packaged in TO-263-3 (D2PAK) surface mount configuration and is part of the SIPMOS® series. The SPB35N10 G is classified as obsolete, making identification of functionally equivalent substitute parts essential for ongoing design support and production continuity. Substitute parts must maintain electrical compatibility across voltage ratings, current handling, on-resistance characteristics, and thermal performance while supporting the same surface mount package family.

Substiute Parts

SPB35N10 G
Infineon TechnologiesIn Stock: 686SPB35N10 G Datasheet
SPB35N10 G
Current Part
IRF540NSTRLPBF
Infineon TechnologiesIn Stock: 35365IRF540NSTRLPBF Datasheet
IRF540NSTRLPBF
MFR Recommended
FDB3682
onsemiIn Stock: 15532FDB3682 Datasheet
FDB3682
MFR Recommended
FQB44N10TM
onsemiIn Stock: 1906FQB44N10TM Datasheet
FQB44N10TM
MFR Recommended
STB30NF10T4
STMicroelectronicsIn Stock: 16189STB30NF10T4 Datasheet
STB30NF10T4
MFR Recommended

Key Parameters

Parameter SPB35N10 G Unit
Drain-to-Source Voltage (Vdss) 100 V
Continuous Drain Current (Id) @ 25°C 35 A (Tc)
On-Resistance (Rds On Max) @ Id, Vgs 44 mOhm @ 26.4A, 10V
Gate Threshold Voltage (Vgs th Max) @ Id 4 V @ 83µA
Gate Charge (Qg Max) @ Vgs 65 nC @ 10V
Input Capacitance (Ciss Max) @ Vds 1570 pF @ 25V
Power Dissipation (Max) 150 W (Tc)
Operating Temperature Range -55 to 175 °C (TJ)
Package Type TO-263-3, D2PAK Surface Mount
Moisture Sensitivity Level (MSL) 1 Unlimited

Substitute Part Grouping Explanation

Substitution eligibility for the SPB35N10 G is determined by strict alignment of the following electrical and mechanical parameters:

Primary Substitution Criteria:

  • Drain-to-Source Voltage (Vdss): Must equal 100V
  • Continuous Drain Current (Id) @ 25°C: Must be ≥35A (Tc)
  • On-Resistance (Rds On): Must not exceed 44mOhm at rated conditions
  • Gate Threshold Voltage (Vgs th): Must be ≤4V
  • Operating Temperature Range: Must support -55°C to 175°C (TJ)
  • Package: Must be TO-263-3 or D2PAK (2 Leads + Tab) surface mount
  • Moisture Sensitivity: MSL 1 (Unlimited)

Substitute Parts Identified:

  1. IRF540NSTRLPBF (Infineon Technologies, HEXFET® series, Active status): Meets all primary criteria with 33A continuous drain current, 44mOhm on-resistance, and equivalent thermal performance.

  2. FDB3682 (onsemi, PowerTrench® series, Active status): Meets all primary criteria with 32A continuous drain current (Tc), superior on-resistance of 36mOhm, and reduced power dissipation of 95W.

  3. FQB44N10TM (onsemi, QFET® series, Active status): Exceeds primary criteria with 43.5A continuous drain current, 39mOhm on-resistance, and 146W power dissipation.

  4. STB30NF10T4 (STMicroelectronics, STripFET™ II series, Active status): Meets all primary criteria with 35A continuous drain current, 45mOhm on-resistance, and 115W power dissipation.

All substitute parts are RoHS3 compliant and REACH unaffected, supporting modern manufacturing and environmental standards.

Parameter Comparison

Parameter SPB35N10 G IRF540NSTRLPBF FDB3682 FQB44N10TM STB30NF10T4 Unit
Manufacturer Infineon Infineon onsemi onsemi STMicroelectronics
Vdss 100 100 100 100 100 V
Id @ 25°C (Tc) 35 33 32 43.5 35 A
Rds On (Max) @ Vgs 10V 44 44 36 39 45 mOhm
Vgs(th) Max @ Id 4 4 4 4 4 V
Qg Max @ 10V 65 71 28 62 55 nC
Ciss Max @ 25V 1570 1960 1250 1800 1180 pF
Power Dissipation (Max) 150 130 95 146 115 W (Tc)
Operating Temperature -55 to 175 -55 to 175 -55 to 175 -55 to 175 -55 to 175 °C (TJ)
Package TO-263-3, D2PAK D2PAK TO-263 (D2PAK) TO-263 (D2PAK) D2PAK
Product Status Obsolete Active Active Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

Primary Recommendation: STB30NF10T4

The STB30NF10T4 from STMicroelectronics provides the closest electrical match to the SPB35N10 G. It maintains identical 35A continuous drain current rating, equivalent 45mOhm on-resistance, and supports the full -55°C to 175°C operating temperature range. The device is in active production status with RoHS3 compliance, ensuring long-term availability and regulatory support. The STripFET™ II series technology provides proven reliability in high-volume applications.

Secondary Recommendation: IRF540NSTRLPBF

The IRF540NSTRLPBF from Infineon Technologies offers continuity with the original manufacturer while maintaining full electrical compatibility. With 33A continuous drain current and 44mOhm on-resistance, it operates within acceptable margins for the SPB35N10 G application envelope. Active production status and ROHS3 compliance support modern supply chain requirements. The HEXFET® series represents established technology with extensive field deployment history.

Alternative for Improved Performance: FQB44N10TM

The FQB44N10TM from onsemi exceeds the SPB35N10 G specifications with 43.5A continuous drain current and superior 39mOhm on-resistance. This device is suitable for applications requiring enhanced current handling or reduced thermal dissipation. Active production status and RoHS3 compliance are confirmed. Gate charge of 62nC remains comparable to the original part.

Conservative Alternative: FDB3682

The FDB3682 from onsemi provides the lowest power dissipation at 95W (Tc) with superior on-resistance of 36mOhm. This device is appropriate for thermally constrained applications. Continuous drain current of 32A (Tc) represents a 9% reduction from the SPB35N10 G specification and must be evaluated against application current requirements. Active production status and RoHS3 compliance are confirmed.

All substitute parts are available in active production with confirmed RoHS3 compliance and REACH unaffected status, supporting regulatory and supply chain continuity.

Frequently Asked Questions (FAQ)

Q1: Can the IRF540NSTRLPBF replace the SPB35N10 G in all applications?

The IRF540NSTRLPBF is electrically compatible with the SPB35N10 G across all specified parameters. The 33A continuous drain current rating is 6% lower than the original 35A specification. Applications operating at or near the 35A maximum rating must be evaluated to confirm the 33A rating provides adequate margin. All other electrical parameters, including voltage rating, on-resistance, and thermal characteristics, are equivalent or superior.

Q2: What is the primary difference between the FDB3682 and other substitute options?

The FDB3682 features the lowest on-resistance at 36mOhm and lowest power dissipation at 95W (Tc). These characteristics make it suitable for applications prioritizing thermal efficiency. The continuous drain current rating of 32A (Tc) is 9% lower than the SPB35N10 G. Applications requiring the full 35A rating should select STB30NF10T4 or FQB44N10TM instead.

Q3: Are all substitute parts pin-compatible with the SPB35N10 G?

All substitute parts use TO-263-3 or D2PAK (2 Leads + Tab) surface mount packaging, which maintains identical pin configuration and PCB footprint compatibility with the SPB35N10 G. No PCB layout modifications are required for mechanical substitution.

Q4: What is the significance of the "Active" product status for substitute parts?

Active product status indicates the manufacturer maintains current production, technical support, and supply chain availability. The SPB35N10 G is classified as obsolete, meaning Infineon no longer manufactures this device. All identified substitute parts are in active production, ensuring long-term availability and manufacturer support for design questions or technical issues.

Q5: Do all substitute parts meet RoHS3 compliance?

All four substitute parts are confirmed RoHS3 compliant. The SPB35N10 G compliance status is not specified in the provided data. RoHS3 compliance is required for applications subject to European Union Restriction of Hazardous Substances regulations and is standard for modern electronic component manufacturing.

Q6: How do gate charge differences affect circuit design?

Gate charge (Qg) ranges from 28nC (FDB3682) to 71nC (IRF540NSTRLPBF) across the substitute options. Lower gate charge reduces driver power dissipation and switching losses in high-frequency applications. The SPB35N10 G specifies 65nC. Applications with gate driver circuits designed for the original 65nC specification will function with all substitutes, though FDB3682 (28nC) offers improved efficiency and STB30NF10T4 (55nC) provides the closest match.

Q7: Which substitute part offers the best thermal performance?

The FDB3682 provides the lowest power dissipation at 95W (Tc), followed by STB30NF10T4 at 115W (Tc). Both devices feature superior on-resistance characteristics that reduce I²R losses. Applications with thermal constraints should prioritize FDB3682 if the 32A continuous drain current rating is acceptable, or STB30NF10T4 if the full 35A rating is required.

Q8: Can multiple substitute parts be used interchangeably in production?

All substitute parts maintain electrical compatibility within the specified parameter ranges. However, production standardization on a single substitute part is recommended to simplify inventory management, technical documentation, and field service procedures. If multiple substitutes are used, design verification must confirm all parts operate within acceptable margins for the specific application.

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