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SP485ECP-L Equivalent & Substitute Parts
Part Overview
The SP485ECP-L is a half-duplex RS422/RS485 transceiver manufactured by MaxLinear, Inc., housed in an 8-pin DIP package for through-hole mounting. This part is classified as obsolete, making equivalent substitutes necessary for new designs and ongoing production support. The device operates within a 4.75V to 5.25V supply range and supports data rates up to 10 Mbps with a receiver hysteresis of 20 mV. Substitution is required to ensure design continuity and access to active inventory.
Substiute Parts
Key Parameters
| Parameter | SP485ECP-L |
|---|---|
| Manufacturer | MaxLinear, Inc. |
| Protocol | RS422, RS485 |
| Type | Transceiver Half |
| Number of Drivers/Receivers | 1/1 |
| Duplex | Half |
| Data Rate | 10 Mbps |
| Receiver Hysteresis | 20 mV |
| Voltage - Supply | 4.75V ~ 5.25V |
| Operating Temperature | 0°C ~ 70°C |
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300", 7.62mm) |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitution of the SP485ECP-L is determined by strict adherence to the following electrical and mechanical parameters:
Primary Substitution Criteria:
- Protocol: RS422/RS485 half-duplex transceiver
- Number of Drivers/Receivers: 1/1 configuration
- Voltage Supply Range: 4.75V ~ 5.25V (mandatory overlap)
- Mounting Type: Through Hole (8-DIP package)
- Package Compatibility: 8-PDIP (0.300", 7.62mm)
Secondary Compatibility Factors:
- Operating Temperature Range: Must encompass or match the original 0°C ~ 70°C range
- Data Rate: Minimum 10 Mbps to maintain functional equivalence
- Receiver Hysteresis: Acceptable range 20 mV to 70 mV for signal integrity
Substitutes are grouped into two categories: direct replacements maintaining identical specifications, and functional upgrades offering enhanced performance while maintaining backward compatibility.
Parameter Comparison
| Part Number | Manufacturer | Protocol | Data Rate | Receiver Hysteresis | Operating Temperature | Voltage - Supply | Package / Case | Product Status | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|
| SP485ECP-L | MaxLinear, Inc. | RS422, RS485 | 10 Mbps | 20 mV | 0°C ~ 70°C | 4.75V ~ 5.25V | 8-DIP (0.300", 7.62mm) | Obsolete | Not Specified |
| LTC1485CN8#PBF | Analog Devices Inc. | RS422, RS485 | — | 60 mV | 0°C ~ 70°C | 4.75V ~ 5.25V | 8-DIP (0.300", 7.62mm) | Active | ROHS3 Compliant |
| LTC1485IN8#PBF | Analog Devices Inc. | RS422, RS485 | — | 60 mV | -40°C ~ 85°C | 4.75V ~ 5.25V | 8-DIP (0.300", 7.62mm) | Active | ROHS3 Compliant |
| ADM1485JNZ | Analog Devices Inc. | RS422, RS485 | 30 Mbps | 70 mV | 0°C ~ 70°C | 4.75V ~ 5.25V | 8-DIP (0.300", 7.62mm) | Active | ROHS3 Compliant |
| ADM1485ANZ | Analog Devices Inc. | RS422, RS485 | 30 Mbps | 70 mV | -40°C ~ 85°C | 4.75V ~ 5.25V | 8-DIP (0.300", 7.62mm) | Active | ROHS3 Compliant |
| ADM485JNZ | Analog Devices Inc. | RS422, RS485 | 5 Mbps | 70 mV | 0°C ~ 70°C | 4.75V ~ 5.25V | 8-DIP (0.300", 7.62mm) | Active | ROHS3 Compliant |
| ADM485ANZ | Analog Devices Inc. | RS422, RS485 | 5 Mbps | 70 mV | -40°C ~ 85°C | 4.75V ~ 5.25V | 8-DIP (0.300", 7.62mm) | Active | ROHS3 Compliant |
| LTC1487CN8#PBF | Analog Devices Inc. | RS422, RS485 | 250 kbps | 45 mV | 0°C ~ 70°C | 4.75V ~ 5.25V | 8-DIP (0.300", 7.62mm) | Active | ROHS3 Compliant |
| LTC485CN8#PBF | Analog Devices Inc. | RS422, RS485 | — | 70 mV | 0°C ~ 70°C | 4.75V ~ 5.25V | 8-DIP (0.300", 7.62mm) | Active | ROHS3 Compliant |
| LTC485IN8#PBF | Analog Devices Inc. | RS422, RS485 | — | 70 mV | -40°C ~ 85°C | 4.75V ~ 5.25V | 8-DIP (0.300", 7.62mm) | Active | ROHS3 Compliant |
Engineering Selection Recommendations
For Direct Replacement (0°C ~ 70°C Operating Range):
LTC1485CN8#PBF and LTC485CN8#PBF are active, ROHS3-compliant alternatives maintaining the original operating temperature range. Both support RS422/RS485 protocols with 8-DIP through-hole packaging identical to the SP485ECP-L. These parts are suitable for designs where the 0°C to 70°C temperature specification is sufficient.
For Extended Temperature Range (-40°C ~ 85°C):
LTC1485IN8#PBF, LTC485IN8#PBF, ADM1485ANZ, and ADM485ANZ extend the operating temperature range, providing enhanced reliability in industrial and automotive environments. ADM1485ANZ and ADM485ANZ offer higher data rates (30 Mbps and 5 Mbps respectively) compared to the original 10 Mbps specification.
For Matched Temperature and Performance:
ADM1485JNZ delivers 30 Mbps data rate capability while maintaining the 0°C ~ 70°C operating range, offering performance enhancement without temperature extension. All recommended substitutes carry ROHS3 compliance and REACH unaffected status, ensuring regulatory alignment.
Frequently Asked Questions (FAQ)
Q: Can I use ADM485JNZ as a direct replacement for SP485ECP-L?
A: ADM485JNZ is functionally compatible. Both operate within 0°C ~ 70°C and use 8-DIP through-hole packaging. The ADM485JNZ operates at 5 Mbps versus the original 10 Mbps, which is acceptable for applications not requiring the full 10 Mbps bandwidth. Electrical characteristics remain compatible within the 4.75V ~ 5.25V supply range.
Q: What is the difference between LTC1485CN8#PBF and LTC1485IN8#PBF?
A: Both are LTC1485 variants in 8-DIP packages with identical electrical specifications. The primary difference is operating temperature: LTC1485CN8#PBF operates 0°C ~ 70°C, while LTC1485IN8#PBF extends to -40°C ~ 85°C. Select based on your application's thermal requirements.
Q: Does the receiver hysteresis difference affect compatibility?
A: The SP485ECP-L specifies 20 mV hysteresis. Substitute parts range from 45 mV to 70 mV. Higher hysteresis values provide improved noise immunity and are functionally compatible with the original specification. No circuit modifications are required.
Q: Are all substitute parts ROHS3 compliant?
A: All listed Analog Devices substitutes carry ROHS3 compliance certification. The original SP485ECP-L does not specify RoHS status. Compliance is confirmed for all active alternatives.
Q: Can I use the surface-mount SP485ECN-L/TR instead of the through-hole SP485ECP-L?
A: SP485ECN-L/TR is electrically equivalent but uses 8-SOIC surface-mount packaging instead of 8-DIP through-hole. Board redesign is required for PCB layout and assembly process changes. Use only if your design supports surface-mount components.
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