SP2996BEN-L Equivalent & Substitute Parts

Part Overview

The SP2996BEN-L is a DDR voltage regulator IC manufactured by MaxLinear, Inc., designed for power management applications requiring single-output conversion. This device operates with input voltage range of 1.6V to 6V and provides adjustable output voltage. The part is currently classified as obsolete, making identification of suitable substitute components essential for ongoing system support and new design implementations.

Substiute Parts

SP2996BEN-L

MaxLinear, Inc.In Stock: 115304SP2996BEN-L Datasheet

Current PartRFQ

XRP2997IDBTR-F

MaxLinear, Inc.In Stock: 15630XRP2997IDBTR-F Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SP2996BEN-L is determined by the following critical parameters:

• Functional equivalence: Single-output DDR voltage regulator IC with adjustable output voltage
• Package compatibility: 8-SOIC form factor with 0.154" (3.90mm) width
• Electrical specifications: Input voltage range, output voltage adjustability, and operating temperature range
• Mounting type: Surface mount technology
• Manufacturer continuity: MaxLinear, Inc. product line

The XRP2997IDBTR-F qualifies as a direct substitute based on matching functional category, package form factor, adjustable output voltage capability, and identical operating temperature range. Both devices are DDR voltage regulator ICs in 8-SOIC packaging from the same manufacturer.

Parameter Comparison

Engineering Selection Recommendations

The XRP2997IDBTR-F is available as an active product from MaxLinear, Inc., providing continuity for applications currently using the obsolete SP2996BEN-L. The substitute part maintains functional equivalence through identical DDR voltage regulator operation, adjustable output voltage capability, and matching operating temperature specifications.

The XRP2997IDBTR-F offers RoHS compliance certification, which may be required for new designs or regulatory compliance in certain markets. The exposed pad variant of the 8-SOIC package provides enhanced thermal performance compared to the standard package.

Input voltage range differs between the two parts: the SP2996BEN-L operates from 1.6V to 6V, while the XRP2997IDBTR-F operates from 1.1V to 5.5V. Circuit designs must verify that the substitute part's input voltage range accommodates the system's power supply specifications.

Moisture sensitivity classification increases from MSL 1 to MSL 3, requiring adherence to appropriate storage and handling procedures during manufacturing and assembly.

Frequently Asked Questions (FAQ)

Q: Can the XRP2997IDBTR-F directly replace the SP2996BEN-L in existing designs?

A: The XRP2997IDBTR-F is functionally equivalent for DDR voltage regulation applications. Pin compatibility and package form factor are identical. However, verify that your system's input voltage range (1.1V to 5.5V for the substitute) accommodates the XRP2997IDBTR-F specifications. If your design requires input voltages below 1.1V or above 5.5V, the substitute part is not suitable.

Q: What is the difference between the 8-SOIC and 8-HSOIC package designations?

A: The XRP2997IDBTR-F uses an 8-HSOIC package with an exposed pad, which provides improved thermal dissipation compared to the standard 8-SOIC package. Both maintain the same 0.154" (3.90mm) width and are mechanically compatible for PCB layout purposes.

Q: Does the increased MSL rating affect my manufacturing process?

A: The XRP2997IDBTR-F has MSL 3 (168 hours) compared to the SP2996BEN-L's MSL 1 (unlimited). This requires stricter moisture control during storage and handling. Components must be stored in dry conditions and baked according to IPC standards before reflow soldering if the package has been exposed to ambient humidity for extended periods.

Q: Is the XRP2997IDBTR-F suitable for new product designs?

A: Yes. The XRP2997IDBTR-F is an active product with RoHS compliance certification, making it appropriate for new designs requiring regulatory compliance and long-term supply availability.

Q: What are the key parameters I must verify before substitution?

A: Verify input voltage range compatibility, output voltage adjustability requirements, operating temperature range, and package thermal requirements. Confirm that your PCB layout accommodates the exposed pad variant if thermal performance is critical to your application.