SN74LVC74AMDREP Equivalent & Substitute Parts

Part Overview

The SN74LVC74AMDREP is a dual D-type flip-flop logic integrated circuit manufactured by Texas Instruments in a 14-SOIC surface mount package. This device functions as a 2-element D-type flip-flop with complementary outputs, set/preset and reset capabilities, and positive edge triggering. The part is actively produced and widely used in digital logic applications requiring state storage and synchronization. Substitute parts are identified based on functional equivalence, electrical parameter compatibility, and package compatibility to support procurement flexibility and supply chain continuity.

Key Parameters

Parameter	Value
Manufacturer Part Number	SN74LVC74AMDREP
Manufacturer	Texas Instruments
Series	74LVC
Type	D-Type Flip-Flop, 2 Element, 1 Bit per Element
Package / Case	14-SOIC (0.154", 3.90mm Width)
Mounting Type	Surface Mount
Clock Frequency	100 MHz
Max Propagation Delay @ 3.3V, 50pF	5.2 ns
Voltage Supply Range	2V ~ 3.6V
Output Current (High/Low)	24 mA / 24 mA
Quiescent Current (Iq)	10 µA
Operating Temperature	-55°C ~ 125°C
Product Status	Active
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitute parts for the SN74LVC74AMDREP are qualified based on the following criteria:

Functional Equivalence: All substitute parts must be dual D-type flip-flops with 2 elements, 1 bit per element, complementary outputs, set/preset and reset functions, and positive edge triggering.

Package Compatibility: All parts must use the 14-SOIC (0.154", 3.90mm Width) surface mount package to ensure direct PCB footprint compatibility.

Electrical Parameter Compatibility: Substitute parts must operate within the voltage supply range of 2V to 3.6V, maintain output current capability of 24 mA (high and low), and support quiescent current of 10 µA. Clock frequency and propagation delay may vary within acceptable operational limits for the application.

Series Compatibility: Parts from the 74LVC and 74LCX logic families are functionally equivalent and interchangeable for this application category.

Parameter Comparison

Parameter	SN74LVC74AMDREP (TI)	74LVC74AD,118 (NXP)	74LCX74M (Fairchild)	MC74LCX74DG (onsemi)	MC74LCX74DR2G (onsemi)
Manufacturer	Texas Instruments	NXP Semiconductors	Fairchild Semiconductor	onsemi	onsemi
Series	74LVC	74LVC	74LCX	74LCX	74LCX
Package / Case	14-SOIC	14-SOIC	14-SOIC	14-SOIC	14-SOIC
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount
Clock Frequency	100 MHz	150 MHz	150 MHz	150 MHz	150 MHz
Max Propagation Delay @ 3.3V, 50pF	5.2 ns	5.2 ns	7 ns	7 ns	7 ns
Voltage Supply Range	2V ~ 3.6V	1.2V ~ 3.6V	2V ~ 3.6V	2V ~ 3.6V	2V ~ 3.6V
Output Current (High/Low)	24 mA / 24 mA	24 mA / 24 mA	24 mA / 24 mA	24 mA / 24 mA	24 mA / 24 mA
Quiescent Current (Iq)	10 µA	10 µA	10 µA	10 µA	10 µA
Operating Temperature	-55°C ~ 125°C	-40°C ~ 125°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C
Product Status	Active	Active	Active	Active	Active
RoHS Status	ROHS3 Compliant	Not specified	Not specified	ROHS3 Compliant	ROHS3 Compliant

Engineering Selection Recommendations

Primary Substitutes: The 74LVC74AD,118 (NXP Semiconductors) and MC74LCX74DR2G (onsemi) are direct functional equivalents with identical propagation delay characteristics (5.2 ns and 7 ns respectively) and full voltage supply range compatibility. Both parts maintain active product status and meet ROHS3 compliance requirements where applicable.

Extended Temperature Range Consideration: The SN74LVC74AMDREP operates across -55°C to 125°C. The 74LVC74AD,118 supports the same upper temperature limit (-40°C to 125°C), making it suitable for applications requiring extended high-temperature operation. The 74LCX series substitutes (74LCX74M, MC74LCX74DG, MC74LCX74DR2G) operate to -40°C to 85°C and are appropriate for standard industrial temperature ranges.

Voltage Supply Range: The 74LVC74AD,118 offers extended low-voltage operation (1.2V minimum) compared to the SN74LVC74AMDREP (2V minimum), providing additional flexibility for low-power applications.

Packaging Format: The MC74LCX74DR2G is supplied in Tape & Reel format, matching the original part's packaging. The 74LVC74AD,118 and MC74LCX74DG are supplied in Bulk and Tube formats respectively, suitable for alternative procurement workflows.

Frequently Asked Questions (FAQ)

Q: Can I substitute a 74LCX74M for the SN74LVC74AMDREP in my design?

A: Yes. The 74LCX74M is functionally equivalent with identical package geometry (14-SOIC), output current capability (24 mA), and voltage supply range (2V ~ 3.6V). The propagation delay is 7 ns versus 5.2 ns for the original part. This substitution is valid if your application timing does not require the faster propagation delay of the SN74LVC74AMDREP.

Q: What is the difference between the 74LVC and 74LCX series?

A: Both series are dual D-type flip-flops with identical functional characteristics, package compatibility, and electrical parameters within the specified ranges. The primary differences are manufacturer-specific and do not affect functional interchangeability for this application.

Q: Is the MC74LCX74DR2G compatible with the SN74LVC74AMDREP?

A: Yes. The MC74LCX74DR2G is a direct substitute with identical 14-SOIC package geometry, output current (24 mA), and voltage supply range (2V ~ 3.6V). It is supplied in Tape & Reel format, matching the original part's packaging method.

Q: Which substitute part has the widest operating temperature range?

A: The 74LVC74AD,118 (NXP Semiconductors) operates from -40°C to 125°C, matching the upper temperature limit of the SN74LVC74AMDREP. The 74LCX series parts operate from -40°C to 85°C. The SN74LVC74AMDREP has the widest range at -55°C to 125°C.

Q: Are all substitute parts ROHS3 compliant?

A: The SN74LVC74AMDREP, MC74LCX74DG, and MC74LCX74DR2G are confirmed ROHS3 compliant. RoHS compliance status for the 74LVC74AD,118 and 74LCX74M is not specified in the provided data.

Q: Can I use these parts interchangeably on the same PCB?

A: Yes. All substitute parts use the identical 14-SOIC (0.154", 3.90mm Width) surface mount package with the same pin configuration, enabling direct PCB footprint compatibility and interchangeable assembly.

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