SN74HCT04IDREP Equivalent & Substitute Parts

Part Overview

The SN74HCT04IDREP is a 6-channel inverter logic IC manufactured by Texas Instruments in 14-SOIC surface mount packaging. This part is currently active in production and available in tape & reel packaging format. Alternative equivalent parts become necessary when the original part number is unavailable, when different packaging formats are required for manufacturing processes, or when sourcing from alternative manufacturers is preferred for supply chain optimization.

Substiute Parts

SN74HCT04IDREP

Texas InstrumentsIn Stock: 1039SN74HCT04IDREP Datasheet

Current PartRFQ

SN74HCT04DR

Texas InstrumentsIn Stock: 4284SN74HCT04DR Datasheet

Parametric EquivalentRFQ

SN74HCT04DT

Texas InstrumentsIn Stock: 2104SN74HCT04DT Datasheet

Parametric EquivalentRFQ

MC74HCT04ADR2G

onsemiIn Stock: 3500MC74HCT04ADR2G Datasheet

DirectRFQ

MM74HCT04M

Fairchild SemiconductorIn Stock: 1547MM74HCT04M Datasheet

DirectRFQ

MM74HCT04MX

Fairchild SemiconductorIn Stock: 18977MM74HCT04MX Datasheet

DirectRFQ

74HCT04S14-13

Diodes IncorporatedIn Stock: 1546174HCT04S14-13 Datasheet

MFR RecommendedRFQ

MC74HCT04ADG

onsemiIn Stock: 3774MC74HCT04ADG Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SN74HCT04IDREP is determined by strict equivalence across the following critical parameters:

• Logic type (Inverter) and circuit configuration (6 channels, 1 input per channel)
• Supply voltage range (4.5V ~ 5.5V)
• Input and output logic levels (0.8V low, 2V high; 4mA output capability)
• Package type (14-SOIC surface mount)
• Mounting compatibility (surface mount)

Substitute parts are grouped into three categories based on their relationship to the main part:

Parametric Equivalents maintain identical electrical specifications and differ only in packaging format (tape & reel vs. cut tape). These parts are direct functional replacements with no performance variation.

Direct Manufacturer Equivalents are produced by alternative manufacturers (onsemi, Fairchild Semiconductor) and meet the same functional requirements. Minor variations in quiescent current or propagation delay remain within acceptable tolerance ranges for standard logic applications.

Manufacturer Recommended Equivalents are designated by manufacturers as approved alternatives and may include extended operating temperature ranges or different packaging options while maintaining core functional compatibility.

Parameter Comparison

Engineering Selection Recommendations

For direct replacement with identical specifications: SN74HCT04DR is the primary alternative from Texas Instruments, offering identical electrical performance with cut tape and Digi-Reel packaging options. This part maintains active product status and is suitable for applications requiring the same performance envelope as the original SN74HCT04IDREP.

For extended temperature range applications: MC74HCT04ADR2G (onsemi) and MC74HCT04ADG (onsemi) both provide operating temperature ranges of -55°C to 125°C, compared to the standard -40°C to 85°C of the main part. These parts feature lower quiescent current (1 µA vs. 2 µA) and faster propagation delay (17ns vs. 18ns), making them suitable for demanding thermal environments while maintaining full functional compatibility.

For high-volume manufacturing with alternative packaging: MM74HCT04M and MM74HCT04MX (Fairchild Semiconductor) are active alternatives with higher output current capability (4.8mA vs. 4mA). These parts are suitable when packaging format flexibility is required, though propagation delay is slightly higher at 20ns.

For applications with relaxed timing requirements: 74HCT04S14-13 (Diodes Incorporated) is available in high inventory and offers extended temperature range (-40°C to 125°C). This part has higher quiescent current (20 µA) and slightly higher propagation delay (22ns), making it suitable for non-critical timing applications where cost and availability are prioritized.

All substitute parts maintain ROHS3 compliance and MSL 1 rating, ensuring compatibility with standard manufacturing processes and storage requirements.

Frequently Asked Questions (FAQ)

Q: Can SN74HCT04DR be used as a direct replacement for SN74HCT04IDREP?

A: Yes. Both parts are manufactured by Texas Instruments with identical electrical specifications. The difference is packaging format: SN74HCT04IDREP uses tape & reel format, while SN74HCT04DR uses cut tape and Digi-Reel format. Selection depends on your assembly equipment and manufacturing process requirements.

Q: What is the difference between the onsemi MC74HCT04ADR2G and the Texas Instruments SN74HCT04IDREP?

A: The MC74HCT04ADR2G offers superior performance with lower quiescent current (1 µA vs. 2 µA), faster propagation delay (17ns vs. 18ns), and extended operating temperature range (-55°C to 125°C vs. -40°C to 85°C). Electrical compatibility is maintained across all logic levels and output current specifications.

Q: Are the Fairchild Semiconductor MM74HCT04M and MM74HCT04MX interchangeable?

A: Both parts have identical electrical specifications. The difference lies in packaging designation, with MX typically indicating a specific packaging variant. Verify packaging compatibility with your assembly process before selection.

Q: Why does 74HCT04S14-13 have higher quiescent current than other alternatives?

A: The 74HCT04S14-13 from Diodes Incorporated has a quiescent current specification of 20 µA compared to 2 µA for the main part. This higher value is within the 74HCT logic family tolerance range and does not affect functional compatibility. Selection should consider power consumption requirements for your specific application.

Q: Can I use MC74HCT04ADG in place of MC74HCT04ADR2G?

A: Yes. Both onsemi parts have identical electrical specifications. The difference is packaging format: ADR2G uses tape & reel, while ADG uses tube packaging. Selection depends on your manufacturing equipment and volume requirements.

Q: Are all substitute parts RoHS compliant?

A: All listed substitute parts maintain ROHS3 compliance status, ensuring compatibility with environmental regulations and standard manufacturing processes.

Q: What packaging format should I select for high-volume surface mount assembly?

A: For automated pick-and-place assembly, tape & reel format (SN74HCT04IDREP, SN74HCT04DT, MC74HCT04ADR2G, 74HCT04S14-13) is standard. Cut tape format (SN74HCT04DR) is suitable for lower-volume or manual assembly operations. Tube packaging (MC74HCT04ADG) is typically used for manual insertion or small-quantity applications.