SN74HC00DT NAND Gate IC Equivalent & Substitute Parts

Part Overview

The SN74HC00DT is a 4-channel 2-input NAND gate logic IC manufactured by Texas Instruments in 14-SOIC surface mount packaging. This part is discontinued at DiGi Electronics, making equivalent substitutes necessary for ongoing production and maintenance applications. The 74HC00 series represents a standard logic function across multiple manufacturers, enabling direct functional replacement with parts meeting identical electrical and mechanical specifications.

Key Parameters

Parameter	Value
Logic Type	NAND Gate
Number of Circuits	4
Number of Inputs	2
Voltage Supply Range	2V ~ 6V
Package Type	14-SOIC (0.154", 3.90mm Width)
Mounting Type	Surface Mount
Operating Temperature Range	-40°C ~ 85°C
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level	1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the SN74HC00DT is determined by strict equivalence in the following parameters:

Logic function: 4-channel 2-input NAND gate
Package: 14-SOIC form factor
Supply voltage range: 2V ~ 6V minimum
Output current capability: 5.2mA high and low
Input logic levels: Low 0.5V ~ 1.8V, High 1.5V ~ 4.2V
RoHS3 compliance and MSL Level 1 rating

Substitute parts are grouped by product status and packaging format. Parametric equivalents maintain identical electrical performance within specified tolerances. Direct manufacturer alternatives from onsemi, Nexperia, and Diodes Incorporated provide functional interchangeability. Upgrade options offer enhanced performance characteristics such as reduced propagation delay or extended temperature range while maintaining pin-compatible 14-SOIC packaging.

Parameter Comparison

Manufacturer Part Number	Manufacturer	Product Status	Packaging	Quiescent Current (Max)	Propagation Delay @ 6V, 50pF	Operating Temperature	Inventory
SN74HC00DT	Texas Instruments	Discontinued	Tape & Reel (TR)	2 µA	15ns	-40°C ~ 85°C	3447 Pcs
SN74HC00DR	Texas Instruments	Active	Cut Tape (CT) & Digi-Reel®	2 µA	15ns	-40°C ~ 85°C	178195 Pcs
MC74HC00ADR2G	onsemi	Active	Cut Tape (CT) & Digi-Reel®	1 µA	13ns	-55°C ~ 125°C	9457 Pcs
MM74HC00M	onsemi	Active	Tube	2 µA	15ns	-40°C ~ 85°C	4805 Pcs
74HC00D,653	Nexperia USA Inc.	Active	Tape & Reel (TR)	40 µA	7ns	-40°C ~ 125°C	10100 Pcs
74HC00S14-13	Diodes Incorporated	Active	Tape & Reel (TR)	20 µA	15ns	-40°C ~ 125°C	1125 Pcs
MC74HC00ADG	onsemi	Active	Tube	1 µA	13ns	-55°C ~ 125°C	2498 Pcs
MM74HC00MX	Fairchild Semiconductor	Active	Not specified	2 µA	15ns	-40°C ~ 85°C	16050 Pcs

Engineering Selection Recommendations

For direct replacement of the discontinued SN74HC00DT, the SN74HC00DR from Texas Instruments is the primary parametric equivalent, maintaining identical electrical specifications and operating temperature range while offering significantly higher inventory availability in active distribution channels.

The MC74HC00ADR2G and MC74HC00ADG from onsemi provide enhanced performance with reduced quiescent current (1 µA vs. 2 µA) and faster propagation delay (13ns vs. 15ns), with extended operating temperature range to -55°C ~ 125°C. These parts are suitable for applications requiring improved thermal performance or lower power consumption.

The 74HC00D,653 from Nexperia offers the fastest propagation delay (7ns) and extended temperature range (-40°C ~ 125°C) but exhibits higher quiescent current (40 µA). This part is appropriate for timing-critical applications where power consumption is not a primary constraint.

The 74HC00S14-13 from Diodes Incorporated and MM74HC00M from onsemi maintain specifications closely aligned with the original part. All substitute options are ROHS3 compliant with MSL Level 1 rating, ensuring compatibility with standard manufacturing and storage requirements.

Frequently Asked Questions (FAQ)

Q: Can SN74HC00DR be used as a direct replacement for SN74HC00DT?

A: Yes. Both parts share identical electrical specifications, operating temperature range (-40°C ~ 85°C), and 14-SOIC packaging. The primary difference is packaging format: SN74HC00DR is supplied in Cut Tape & Digi-Reel® format versus Tape & Reel for the original part. Functional performance and pin compatibility are equivalent.

Q: What is the difference between MC74HC00ADR2G and MM74HC00M?

A: Both are onsemi 74HC00 NAND gate ICs with identical logic function and 14-SOIC packaging. MC74HC00ADR2G is supplied in Cut Tape & Digi-Reel® format with extended temperature range (-55°C ~ 125°C) and lower quiescent current (1 µA). MM74HC00M is supplied in Tube format with standard temperature range (-40°C ~ 85°C) and 2 µA quiescent current. Electrical performance differs in propagation delay: 13ns for MC74HC00ADR2G versus 15ns for MM74HC00M.

Q: Are all substitute parts pin-compatible with the original SN74HC00DT?

A: Yes. All listed substitute parts maintain the 14-SOIC package form factor with identical pin assignments for the 4-channel 2-input NAND gate function. Pin-to-pin compatibility is guaranteed across all manufacturers listed.

Q: Which substitute offers the best performance improvement?

A: The 74HC00D,653 from Nexperia provides the fastest propagation delay at 7ns compared to 15ns for the original part, representing a 53% improvement in switching speed. However, this part exhibits higher quiescent current (40 µA vs. 2 µA). Selection should be based on application requirements for speed versus power consumption.

Q: What is the significance of the extended temperature range in MC74HC00ADR2G?

A: The MC74HC00ADR2G operates from -55°C to 125°C, compared to -40°C to 85°C for the SN74HC00DT. This extended range accommodates applications in harsh thermal environments or equipment requiring wider operating specifications. All parts maintain ROHS3 compliance and MSL Level 1 rating across their respective temperature ranges.

Q: Can packaging format differences affect circuit board assembly?

A: Yes. Packaging format affects supply and handling but not electrical function. Tape & Reel (TR) format is standard for automated pick-and-place assembly. Cut Tape & Digi-Reel® and Tube formats require different feeder configurations on assembly equipment. Verify compatibility with your manufacturing process before selecting a substitute based on packaging availability.

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