SN74ALS577ANT Equivalent & Substitute Parts

Part Overview

The SN74ALS577ANT is a Flip Flop 1 Element D-Type 8 Bit Positive Edge logic integrated circuit manufactured by Texas Instruments in the 74ALS series. This component functions as a master reset device with tri-state inverted output configuration, operating at 30 MHz clock frequency. The part is classified as obsolete, making equivalent substitute parts necessary for ongoing design support and procurement continuity.

Substiute Parts

SN74ALS577ANT
Texas InstrumentsIn Stock: 804SN74ALS577ANT Datasheet
SN74ALS577ANT
Current Part
SN74ALS577ADWR
Texas InstrumentsIn Stock: 847SN74ALS577ADWR Datasheet
SN74ALS577ADWR
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number SN74ALS577ANT
Manufacturer Texas Instruments
Series 74ALS
Function Master Reset
Type D-Type Flip Flop
Number of Elements 1
Number of Bits per Element 8
Clock Frequency 30 MHz
Max Propagation Delay @ 5V, 50pF 14 ns
Output Type Tri-State, Inverted
Trigger Type Positive Edge
Current - Output High, Low 2.6 mA, 24 mA
Voltage - Supply 4.5V ~ 5.5V
Current - Quiescent (Iq) 18 mA
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Through Hole
Package / Case 24-DIP (0.300", 7.62mm)
Product Status Obsolete
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the SN74ALS577ANT is determined by strict electrical and mechanical compatibility criteria. The following parameters must remain constant across all substitute parts:

  • Function: Master Reset D-Type Flip Flop
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Clock Frequency: 30 MHz
  • Max Propagation Delay: 14 ns @ 5V, 50pF
  • Output Type: Tri-State, Inverted
  • Trigger Type: Positive Edge
  • Current Ratings: 2.6 mA (Output High), 24 mA (Output Low)
  • Voltage Supply Range: 4.5V ~ 5.5V
  • Quiescent Current: 18 mA
  • Operating Temperature Range: 0°C ~ 70°C
  • Series: 74ALS
  • Base Product Number: 74ALS577

The primary difference between the main part and its substitute lies in packaging and mounting technology. The SN74ALS577ANT uses through-hole 24-DIP packaging, while the substitute SN74ALS577ADWR uses surface-mount 24-SOIC packaging. Both maintain identical electrical specifications and functional characteristics.

Parameter Comparison

Parameter SN74ALS577ANT (Main) SN74ALS577ADWR (Substitute)
Manufacturer Part Number SN74ALS577ANT SN74ALS577ADWR
Manufacturer Texas Instruments Texas Instruments
Series 74ALS 74ALS
Base Product Number 74ALS577 74ALS577
Function Master Reset Master Reset
Type D-Type Flip Flop D-Type Flip Flop
Number of Elements 1 1
Number of Bits per Element 8 8
Clock Frequency 30 MHz 30 MHz
Max Propagation Delay @ 5V, 50pF 14 ns 14 ns
Output Type Tri-State, Inverted Tri-State, Inverted
Trigger Type Positive Edge Positive Edge
Current - Output High, Low 2.6 mA, 24 mA 2.6 mA, 24 mA
Voltage - Supply 4.5V ~ 5.5V 4.5V ~ 5.5V
Current - Quiescent (Iq) 18 mA 18 mA
Operating Temperature 0°C ~ 70°C (TA) 0°C ~ 70°C (TA)
Mounting Type Through Hole Surface Mount
Supplier Device Package 24-PDIP 24-SOIC
Package / Case 24-DIP (0.300", 7.62mm) 24-SOIC (0.295", 7.50mm Width)
Product Status Obsolete Active
Packaging Bulk Tape & Reel (TR)
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)

Engineering Selection Recommendations

The SN74ALS577ADWR serves as the active equivalent substitute for the obsolete SN74ALS577ANT. Both parts maintain identical electrical specifications, functional characteristics, and compliance certifications. The SN74ALS577ADWR is currently in active production status, ensuring long-term availability and supply chain continuity.

Selection between these parts depends on board assembly requirements. The SN74ALS577ANT uses through-hole 24-DIP packaging suitable for breadboard prototyping and through-hole assembly processes. The SN74ALS577ADWR uses surface-mount 24-SOIC packaging, appropriate for automated surface-mount assembly and compact board layouts.

Both parts maintain ROHS3 compliance and MSL 1 (Unlimited) moisture sensitivity rating, ensuring compatibility with modern manufacturing and storage requirements. The electrical performance, including 30 MHz clock frequency, 14 ns propagation delay, and tri-state inverted output configuration, remains constant across both variants.

Frequently Asked Questions (FAQ)

Q: Can the SN74ALS577ADWR directly replace the SN74ALS577ANT in existing designs?

A: Electrical substitution is complete. The SN74ALS577ADWR maintains identical functional specifications, electrical performance, and compliance certifications. However, physical board layout modifications are required due to packaging differences. The SN74ALS577ANT uses through-hole 24-DIP mounting, while the SN74ALS577ADWR uses surface-mount 24-SOIC packaging.

Q: What are the key compatibility criteria for substituting the SN74ALS577ANT?

A: Substitute parts must maintain the following specifications: 1 Element D-Type Flip Flop with 8 bits per element, 30 MHz clock frequency, 14 ns maximum propagation delay at 5V with 50pF load, tri-state inverted output, positive edge trigger, 4.5V to 5.5V supply voltage, and 0°C to 70°C operating temperature range.

Q: Why is the SN74ALS577ANT classified as obsolete?

A: The SN74ALS577ANT is obsolete due to manufacturing discontinuation by Texas Instruments. The SN74ALS577ADWR represents the active production equivalent, offering identical electrical functionality with modern surface-mount packaging.

Q: Are there any compliance or certification differences between these parts?

A: Both parts maintain identical compliance status: ROHS3 compliant, MSL 1 (Unlimited), REACH Unaffected, and EAR99 ECCN classification. No compliance or certification differences exist between the two variants.

Q: What packaging considerations apply when substituting these parts?

A: The SN74ALS577ANT requires through-hole assembly on PCBs with 0.300" (7.62mm) DIP spacing. The SN74ALS577ADWR requires surface-mount assembly with 0.295" (7.50mm) SOIC spacing. Board redesign and assembly process modifications are necessary for substitution.

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