SN74ACT244MDWREP Equivalent & Substitute Parts

Part Overview

The SN74ACT244MDWREP is a non-inverting buffer logic integrated circuit manufactured by Texas Instruments, designed for digital signal buffering and distribution applications. This 20-SOIC surface mount device provides 2 elements with 4 bits per element and 3-state output capability, operating across a 4.5V to 5.5V supply voltage range. The part is currently in active production status with RoHS3 compliance and unlimited moisture sensitivity rating (MSL 1). Substitute parts are necessary to address inventory availability, alternative packaging requirements, or manufacturer sourcing preferences while maintaining functional and electrical equivalence.

Substiute Parts

SN74ACT244MDWREP
Texas InstrumentsIn Stock: 814SN74ACT244MDWREP Datasheet
SN74ACT244MDWREP
Current Part
MC74ACT244DWR2G
onsemiIn Stock: 35187MC74ACT244DWR2G Datasheet
MC74ACT244DWR2G
Direct
74ACT244SC
onsemiIn Stock: 172674ACT244SC Datasheet
74ACT244SC
MFR Recommended
74ACT244SCX
onsemiIn Stock: 949874ACT244SCX Datasheet
74ACT244SCX
MFR Recommended
MC74ACT244DWG
onsemiIn Stock: 2107MC74ACT244DWG Datasheet
MC74ACT244DWG
MFR Recommended

Key Parameters

Parameter Value
Logic Type Buffer, Non-Inverting
Number of Elements 2
Number of Bits per Element 4
Output Type 3-State
Current - Output High, Low 24mA, 24mA
Voltage - Supply 4.5V ~ 5.5V
Package / Case 20-SOIC (0.295", 7.50mm Width)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the SN74ACT244MDWREP is determined by strict equivalence across the following parameters: logic type (non-inverting buffer), element count (2), bits per element (4), output configuration (3-state), output current specifications (24mA high and low), supply voltage range (4.5V to 5.5V), package type (20-SOIC), and mounting method (surface mount). All substitute parts listed maintain these core electrical and mechanical specifications. Packaging format variations (Tape & Reel, Tube, Cut Tape & Digi-Reel) represent different distribution methods for the identical die and do not affect functional compatibility. Operating temperature range differences and moisture sensitivity level variations are secondary considerations that do not prevent substitution in most applications but should be evaluated against specific system requirements.

Parameter Comparison

Parameter SN74ACT244MDWREP (TI) MC74ACT244DWR2G (onsemi) 74ACT244SC (onsemi) 74ACT244SCX (onsemi) MC74ACT244DWG (onsemi)
Manufacturer Texas Instruments onsemi onsemi onsemi onsemi
Logic Type Buffer, Non-Inverting Buffer, Non-Inverting Buffer, Non-Inverting Buffer, Non-Inverting Buffer, Non-Inverting
Number of Elements 2 2 2 2 2
Number of Bits per Element 4 4 4 4 4
Output Type 3-State 3-State 3-State 3-State 3-State
Current - Output High, Low 24mA, 24mA 24mA, 24mA 24mA, 24mA 24mA, 24mA 24mA, 24mA
Voltage - Supply 4.5V ~ 5.5V 4.5V ~ 5.5V 4.5V ~ 5.5V 4.5V ~ 5.5V 4.5V ~ 5.5V
Package / Case 20-SOIC 20-SOIC 20-SOIC 20-SOIC 20-SOIC
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Operating Temperature -55°C ~ 125°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C
Moisture Sensitivity Level (MSL) 1 (Unlimited) 3 (168 Hours) 3 (168 Hours) 3 (168 Hours) 3 (168 Hours)
Packaging Format Tape & Reel (TR) Tape & Reel (TR) Tube Cut Tape (CT) & Digi-Reel® Tube
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Product Status Active Active Active Active Active

Engineering Selection Recommendations

All listed substitute parts maintain full electrical and functional equivalence to the SN74ACT244MDWREP across core specifications: logic function, element configuration, output characteristics, and supply voltage requirements. All parts are active production items with ROHS3 compliance and REACH unaffected status, ensuring regulatory alignment.

The primary differentiation between the main part and substitutes is the operating temperature range. The SN74ACT244MDWREP supports -55°C to 125°C, while all onsemi substitutes operate within -40°C to 85°C. Applications requiring extended low-temperature operation below -40°C or high-temperature operation above 85°C must retain the Texas Instruments part. For standard industrial and commercial temperature ranges, onsemi substitutes provide equivalent performance.

Moisture sensitivity differs between the main part (MSL 1, unlimited) and substitutes (MSL 3, 168 hours). Applications subject to extended storage in high-humidity environments or requiring unlimited shelf life without baking should prioritize the SN74ACT244MDWREP. Standard manufacturing environments with controlled humidity typically accommodate MSL 3 components.

Packaging format selection depends on assembly and procurement workflow: Tape & Reel (TR) suits high-volume automated assembly; Tube packaging accommodates lower-volume or manual assembly processes; Cut Tape & Digi-Reel provides flexibility for mixed-volume requirements.

Frequently Asked Questions (FAQ)

Q: Can I substitute MC74ACT244DWR2G for SN74ACT244MDWREP in my design?

A: Yes, for applications operating within -40°C to 85°C and standard humidity environments. The electrical specifications, package type, and pin configuration are identical. If your application requires the extended temperature range (-55°C to 125°C) or unlimited moisture sensitivity of the original part, substitution is not recommended.

Q: What is the difference between the packaging formats listed?

A: Tape & Reel (TR) is standard for high-volume surface mount assembly with automated pick-and-place equipment. Tube packaging is used for lower-volume manual assembly or component storage. Cut Tape & Digi-Reel provides intermediate flexibility. All formats contain the identical component; packaging affects only handling and assembly methodology.

Q: Are all substitute parts pin-compatible with the original SN74ACT244MDWREP?

A: Yes. All parts use the 20-SOIC package with identical pinout and functional assignment. Direct PCB footprint compatibility is confirmed.

Q: Does the MSL 3 rating of onsemi parts affect my assembly process?

A: MSL 3 (168 hours) requires component baking if storage exceeds 168 hours in high-humidity conditions (typically >85% RH). Standard manufacturing environments with controlled humidity do not trigger this requirement. Verify your storage and assembly timeline against MSL specifications.

Q: Which substitute should I select for new designs?

A: For new designs without extended temperature or unlimited moisture sensitivity requirements, any onsemi substitute provides equivalent performance. Select based on packaging preference and inventory availability. MC74ACT244DWR2G in Tape & Reel format is recommended for high-volume automated assembly.

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